NXP Semiconductors 74ALVC164245BQ,518

Overview

74ALVC164245BQ from NXP Semiconductors is a 16-bit dual-supply translating transceiver with independent 3.3 V (VCC(A)) and 5 V (VCC(B)) I/O rails, non-inverting 3-state bus-compatible outputs, and dual-direction data flow control via DIR/OE inputs. It enables bidirectional level translation between mixed-voltage buses in industrial controllers and embedded communication interfaces.

For engineers reviewing the 74ALVC164245BQ datasheet, 74ALVC164245BQ pinout, 74ALVC164245BQ application, or 74ALVC164245BQ equivalent, key selection criteria include its 1.5–3.6 V / 1.5–5.5 V dual-rail operating range, 2.5 ns typical propagation delay (VCC(A)=3.3 V, VCC(B)=5 V), −40 °C to +125 °C temperature rating, and HXQFN60U thermal-enhanced package for high-density PCB layouts.

Technical Context

This device implements two independent 8-bit transceiver channels (A↔B) with separate direction (DIR) and output enable (OE) controls per channel. Each channel supports simultaneous 3-state operation on both A- and B-side ports, with voltage references strictly isolated: A-side pins (1A0–1A7, 2A0–2A7, 1DIR, 2DIR, 1OE, 2OE, VCC(A), GND) referenced to VCC(A); B-side pins (1B0–1B7, 2B0–2B7, VCC(B)) referenced to VCC(B).

Suspend-mode behavior is defined when one supply is at 0 V: the transceiver prevents reverse current flow, requires A-side outputs to be in 3-state, and mandates A-bus voltage ≤ 0.7 V. Compliance with JEDEC JESD8-B/JESD36 ensures interoperability with standard CMOS/TTL logic families across both voltage domains.

Key Specifications

Pinout & Package

74ALVC164245BQ uses the HXQFN60U (SOT1134-1) package: 4 × 6 × 0.5 mm thermal-enhanced quad flat no-lead package with 60 terminals, UTLP-based construction, and exposed thermal pad (not electrically connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC164245DGGR and TXB0108PWR, the 74ALVC164245BQ uniquely supports 5 V-tolerant B-side I/O with independent DIR/OE control and industrial-grade thermal performance in a 4×6 mm QFN, making it the only option for space-constrained 3.3 V ↔ 5 V backplane bridging.

Availability

74ALVC164245BQ is available at Aetrix Electronics and suitable for industrial PLC backplanes, automotive body control modules, and medical imaging subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74ALVC164245BQ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The 74ALVC164245BQ belongs to NXP's ALVC logic family, engineered specifically for robust mixed-voltage system integration in harsh environments where reliability, thermal efficiency, and JEDEC-compliant interoperability are mandatory.

FAQ

What is the maximum allowable voltage on the 74ALVC164245BQ B-side inputs when VCC(B) = 0 V?

The 74ALVC164245BQ B-side inputs tolerate up to 5.5 V regardless of VCC(B) state. When VCC(B) = 0 V, the device enters suspend mode: reverse current is blocked, and B-side inputs remain safe up to 5.5 V as long as A-side outputs are held in 3-state and A-bus voltage stays below 0.7 V. This behavior is explicitly guaranteed in the datasheet's suspend-mode specification.

Can the 74ALVC164245BQ operate with VCC(A) = 1.8 V and VCC(B) = 5.0 V simultaneously?

Yes. The 74ALVC164245BQ supports VCC(A) from 1.5 V to 3.6 V and VCC(B) from 1.5 V to 5.5 V concurrently. At VCC(A) = 1.8 V and VCC(B) = 5.0 V, the A-side outputs swing 0–1.8 V, B-side outputs swing 0–5.0 V, and all inputs accept up to 5.5 V. Propagation delay increases to ≤9.5 ns (A→B) per datasheet Table 7, remaining fully functional.

How many ground connections does the 74ALVC164245BQ HXQFN60U package provide, and why is this important?

The 74ALVC164245BQ in HXQFN60U (SOT1134-1) has eight dedicated GND terminals (pins A3, A8, A11, A16, A19, A24, A27, A32). This minimizes ground impedance and reduces simultaneous switching noise in high-speed 16-bit data transfers, directly supporting clean signal integrity at >50 MHz edge rates and meeting industrial EMC requirements without added filtering.

Does the 74ALVC164245BQ require external pull-up or pull-down resistors on DIR and OE pins?

No. The 74ALVC164245BQ DIR and OE inputs have CMOS-compatible thresholds and do not require external biasing. Their voltage range spans 0–5.5 V, and internal input leakage is ≤±10 μA (max) over temperature. Pull-ups/pull-downs are only needed if system-level noise immunity or default-state assurance is required beyond the device's native specifications.

What is the thermal resistance (RθJA) of the 74ALVC164245BQ in its HXQFN60U package?

The datasheet specifies 1000 mW maximum total power dissipation at Tamb = −40 °C to +125 °C for the HXQFN60U package but does not publish RθJA. However, the 0.5 mm profile, 4×6 mm body, and exposed thermal pad (per SOT1134-1 outline) imply RθJA ≈ 35–45 °C/W with 2 oz copper and 2 thermal vias - consistent with同类 NXP QFN packages. For precise thermal modeling, use the 1000 mW limit with worst-case junction temperature calculation.