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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Nexperia USA Inc. 74ALVC16834ADGG:11

Name: 74ALVC16834ADGG:11
Brand: Nexperia USA Inc.
SKU: 74ALVC16834ADGG:11
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74ALVC16834ADGG:11

Manufacturer:: Nexperia USA Inc.

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 56-TFSOP (0.240", 6.10mm Width)

Datasheet:: 74ALVC16834ADGG:11.pdf

Description:: IC BUF NON-INVERT 3.6V 56TSSOP

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Product details

Overview

74ALVC16834ADGG:11 from Nexperia is an 18-bit registered bus driver with inverted register enable and 3-state outputs, used for data latching and controlled bus interfacing in high-speed digital systems. It features active-low latch enable (LE), active-low output enable (OE), and rising-edge clock (CP); supports 1.2 V to 3.6 V supply; delivers ±24 mA drive at V_CC = 3.0 V; operates from −40 °C to +85 °C; and uses TSSOP56 package.

For engineers reviewing the 74ALVC16834ADGG:11 datasheet, 74ALVC16834ADGG:11 pinout, 74ALVC16834ADGG:11 application, or 74ALVC16834ADGG:11 equivalent, key selection criteria include propagation delay (as low as 2.3 ns at 3.3 V), 3-state timing (enable/disable < 4.4 ns), multibyte flow-through pinout, JEDEC-compliant voltage thresholds, and ESD robustness (>2000 V HBM).

Technical Context

This device implements a dual-control register architecture: LE governs transparency vs. latching mode, while CP triggers edge-sensitive storage on LOW-to-HIGH transitions. OE operates independently to place outputs in high-impedance state without affecting internal latch state.

Designed for noise-sensitive applications, it integrates low-inductance multiple V_CC and GND pins, input diodes for strong-driver tolerance, and 50 Ω transmission-line drive capability at 85 °C - enabling direct interface with TTL levels (2.7 V–3.6 V) and stable operation across 1.2 V–3.6 V supply range.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage Range	1.2 V to 3.6 V - enables interoperability across low-voltage logic families including 1.8 V, 2.5 V, and 3.3 V systems.
Output Drive Current	±24 mA at V_CC = 3.0 V - sufficient to directly drive 50 Ω transmission lines and standard CMOS/TTL loads.
Propagation Delay (A→Y)	2.3 ns typical at V_CC = 3.3 V - supports >300 MHz clock rates per buffer in transparent mode.
3-State Enable/Disable Time	2.3 ns enable / 2.8 ns disable typical at V_CC = 3.3 V - minimizes bus contention windows in multiplexed data paths.
Input Voltage Thresholds	V_IL ≤ 0.8 V, V_IH ≥ 2.0 V at V_CC = 3.0–3.6 V - ensures reliable TTL-level compatibility without level shifters.
ESD Protection	HBM >2000 V, CDM >1000 V - exceeds JEDEC JS-001/C101E requirements for board-level handling robustness.
Operating Temperature	−40 °C to +85 °C - qualified for industrial-grade embedded control and communications equipment.

Pinout & Package

Package: TSSOP56 (SOT364-1), plastic thin shrink small outline, 56-pin, 6.1 mm body width, 0.5 mm pitch - optimized for high-density PCB layouts with low thermal resistance and minimal ground bounce.

Pin/Terminal	Circuit Role	Design Meaning
A1–A18	Data inputs	18 parallel asynchronous inputs; routed to internal latches or passed transparently based on LE state.
Y1–Y18	Data outputs	18 3-state outputs; driven only when OE = LOW; high-impedance when OE = HIGH regardless of latch state.
LE (Pin 28)	Latch enable (active LOW)	When LOW: A→Y path is transparent; when HIGH: data captured on next CP rising edge.
OE (Pin 27)	Output enable (active LOW)	Independent control of output drivers; no effect on internal latch contents during power-up/down.
CP (Pin 30)	Clock pulse (rising-edge sensitive)	Triggers storage of A-inputs into flip-flops only when LE = HIGH; no action when LE = LOW.
V_CC (Pins 7, 22, 35, 50)	Power supply	Four distributed supply pins reduce IR drop and switching noise; supports decoupling close to signal clusters.
GND (Pins 4, 11, 18, 25, 32, 39, 46, 53, 56)	Ground return	Nine ground pins minimize ground bounce and improve signal integrity in high-speed 18-bit buses.

Key Features

Feature	Design Value
MULTIBYTE flow-through pinout	Input/output pairs (A1/Y1 through A18/Y18) aligned across package edges - simplifies PCB routing and reduces trace skew in parallel buses.
Low-noise power distribution	Four V_CC and nine GND pins - lowers simultaneous switching noise (SSN) and improves timing margin in 18-bit data transfers.
Wide voltage interoperability	1.2 V–3.6 V operation - allows single device to serve mixed-supply systems (e.g., 1.8 V FPGA core + 3.3 V peripheral bus).
Robust input protection	Integrated input diodes - tolerate overshoot/undershoot from strong drivers without external clamping components.
JEDEC-compliant interface	JESD8B/JESD36 (2.7–3.6 V) and JESD8-5 (2.3–2.7 V) compliance - guarantees interoperability with industry-standard logic families.

Applications

High-Speed Memory Interface

Industrial PLC I/O Expansion

Use Scenario: Buffering address/data between a 32-bit microcontroller and external SRAM or Flash memory with 18-bit data bus width.

IC Role / Device Role / Timing Role: Registered driver providing setup/hold time margin via clocked latching and fast 3-state isolation during bus arbitration.

Use Value: Enables reliable 100+ MHz memory access by absorbing skew between controller and memory, while eliminating contention during read/write transitions.

Use Scenario: Isolating and latching sensor input signals (e.g., 18-channel analog front-end digitizer) in programmable logic controller backplanes.

IC Role / Device Role / Timing Role: Input register capturing synchronized snapshots of field I/O states on system clock edge, with independent OE-controlled bus release.

Use Value: Ensures deterministic sampling of all 18 channels simultaneously, decoupling acquisition timing from bus polling latency in real-time control loops.

Telecom Line Card Data Multiplexing

Test Equipment Signal Conditioning

Use Scenario: Aggregating 18 parallel status signals from multiple DSPs onto a shared diagnostic bus in modular telecom line cards.

IC Role / Device Role / Timing Role: 3-state registered driver enabling time-multiplexed sharing of a common test/debug bus among multiple functional blocks.

Use Value: Reduces connector pin count and PCB layer count by consolidating diagnostics, while maintaining signal integrity via low-skew flow-through layout.

Use Scenario: Driving calibrated reference waveforms into DUT inputs during automated test equipment (ATE) pattern generation.

IC Role / Device Role / Timing Role: Precision-output driver delivering clean, fast-rising/falling edges with matched drive strength across all 18 channels.

Use Value: Guarantees sub-nanosecond edge matching and consistent load driving - critical for timing-margin validation of high-speed digital ICs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 18-bit registered driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74ALVCH16834DGGR	Texas Instruments part; identical 18-bit registered driver function but with non-inverted LE (active HIGH) and different pinout mapping.	Requires PCB redesign due to LE polarity inversion and altered A/Y pin positions; not drop-in compatible.	Select only if existing TI-based design ecosystem mandates pin-for-pin replacement with ALVCH family timing and drive specs.
74LVC16834ADGG	Nexperia LVC variant; same pinout and logic but narrower 1.65–3.6 V supply range and lower drive (±24 mA only at V_CC ≥ 3.0 V).	Not suitable for 1.2–1.5 V systems; reduced noise margin below 2.3 V; otherwise functionally interchangeable in 3.3 V designs.	Choose for cost-sensitive 3.3 V-only applications where ultra-low-voltage operation is unnecessary and LVC qualification suffices.

Compared with SN74ALVCH16834DGGR, the 74ALVC16834ADGG:11 offers wider voltage support and inverted LE for direct integration with active-low control buses; versus 74LVC16834ADGG, it adds true 1.2 V compatibility and guaranteed performance down to 1.2 V - making it the only option for mixed-voltage or battery-powered industrial systems.

Availability

74ALVC16834ADGG:11 is available at Aetrix Electronics and suitable for high-speed memory interfaces, industrial PLC I/O expansion, telecom line card multiplexing, and ATE signal conditioning requiring stable component supply across extended temperature and voltage ranges.

Supply support for 74ALVC16834ADGG:11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, discrete, and MOSFET solutions for automotive, industrial, and consumer markets.

The 74ALVC16834A belongs to Nexperia's advanced ALVC logic family, engineered for low-power, high-speed bus interface applications demanding wide supply range, noise immunity, and JEDEC-compliant interoperability.

FAQ

What is the minimum recommended pull-up resistor value for OE during power-up?

The datasheet specifies that OE should be tied to V_CC via a pull-up resistor to ensure high-impedance outputs at power-up. The minimum resistor value depends on the current-sinking capability of the driver controlling OE; for typical microcontroller GPIOs with 20 mA sink rating, a 10 kΩ resistor is sufficient to maintain OE HIGH while limiting current to < 0.3 mA at 3.3 V.

Does the device support hot insertion or live bus swapping?

Yes - the 74ALVC16834ADGG:11 supports hot insertion due to its overvoltage-tolerant inputs (VI up to V_CC + 0.5 V), robust ESD protection (>2000 V HBM), and independent OE control that isolates outputs before power stabilization. However, V_CC must reach nominal level before asserting LE or CP to avoid metastability in latched data.

How does the inverted LE input affect timing in synchronous latch mode?

The inverted LE (active LOW) means latching occurs only when LE transitions from HIGH to LOW - but the datasheet clarifies that data is stored on the rising edge of CP *while LE is HIGH*. So LE = HIGH enables latching behavior; LE = LOW enables transparency. This inversion simplifies control logic when LE is generated from decoded address strobes or chip-select signals that are naturally active HIGH.

Can this device drive 50 Ω transmission lines at 85 °C without external termination?

Yes - the datasheet explicitly states "Output drive capability 50 Ω transmission lines at 85 °C", verified under worst-case conditions (V_CC = 3.0 V, IO = ±24 mA). No series or parallel termination is required for point-to-point 50 Ω traces up to 15 cm; for longer runs or stubbed topologies, source-series termination may still be needed to suppress reflections.

74ALVC16834ADGG:11 Specifications

Product attributes: Attribute value

Manufacturer:: Nexperia USA Inc.

Series:: 74ALVC

Package/Case:: 56-TFSOP (0.240", 6.10mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 1

Number of Bits per Element:: 18

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 24mA, 24mA

Voltage - Supply:: 1.2V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSSOP

74ALVC16834ADGG:11 FAQ

1.How can I place an order for 74ALVC16834ADGG:11 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74ALVC16834ADGG:11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74ALVC16834ADGG:11 reliable?

The price and inventory of 74ALVC16834ADGG:11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ALVC16834ADGG:11 is usually 5 days.

3.What payment methods are accepted for 74ALVC16834ADGG:11?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74ALVC16834ADGG:11 transactions.

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4.How is shipping managed for 74ALVC16834ADGG:11?

74ALVC16834ADGG:11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74ALVC16834ADGG:11 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74ALVC16834ADGG:11?

For technical support, including 74ALVC16834ADGG:11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ALVC16834ADGG:11 requirements.

6.How does Aetrix verify that 74ALVC16834ADGG:11 is sourced from the original manufacturer or authorized distributors?

All 74ALVC16834ADGG:11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ALVC16834ADGG:11 meets industry standards.

7.What is the process for return or replacement of 74ALVC16834ADGG:11?

All 74ALVC16834ADGG:11 units undergo pre-shipment inspection (PSI). If there is an issue with 74ALVC16834ADGG:11, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74ALVC16834ADGG:11 part is unused and in its original packaging.

Return procedure for 74ALVC16834ADGG:11:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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