Nexperia USA Inc. 74ALVC244D,118

Overview

74ALVC244D,118 from Nexperia is an octal 3-state buffer/line driver in SO20 package, configured as two independent 4-bit buffers with separate active-low output enables (1OE, 2OE). It operates from 1.65 V to 3.6 V, features Schmitt-trigger inputs for noise immunity, and includes IOFF circuitry enabling safe partial power-down operation. It is specified for industrial and extended-temperature applications up to +125 °C.

For engineers reviewing the 74ALVC244D,118 datasheet, 74ALVC244D,118 pinout, 74ALVC244D,118 application, or 74ALVC244D,118 equivalent, key selection criteria include supply voltage range compatibility, 3-state enable timing (ten ≤ 5.2 ns at 3.6 V), IOFF leakage performance (< ±80 μA), input overvoltage tolerance to 3.6 V, and SO20 thermal derating behavior above 109 °C.

Technical Context

This device implements dual-group CMOS buffer logic with independent active-low 3-state control per group. Each group (1Y0–1Y3 and 2Y0–2Y3) drives four outputs simultaneously, with propagation delay as low as 2.2 ns (typical) at 3.3 V and disable time of 2.9 ns (typical).

The IOFF circuit ensures bidirectional high-impedance isolation when VCC = 0 V, preventing backflow current during power sequencing. Schmitt-trigger inputs accept slow-rising signals (Δt/ΔV down to 10 ns/V at 3.6 V), eliminating external hysteresis components in noisy environments.

Key Specifications

Pinout & Package

74ALVC244D,118 uses the SOT163-1 (SO20) plastic small outline package: 20-pin, 7.5 mm body width, 1.27 mm lead pitch, with gull-wing leads and pin 1 index marker. Thermal derating begins at 109 °C (12.3 mW/K).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Compared with SN74LVC244APWR and 74LVC244ADB,118, the 74ALVC244D,118 uniquely combines IOFF protection, Schmitt-trigger inputs, and SO20 industrial packaging-making it the only option among the three qualified for hot-swap, noisy, and mixed-power-domain applications.

Availability

74ALVC244D,118 is available at Aetrix Electronics and suitable for industrial bus interface, memory address buffering, hot-swappable module backplanes, and legacy TTL-to-CMOS translation requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for 74ALVC244D,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance logic, analog, and MOSFET solutions optimized for efficiency, reliability, and miniaturization in industrial, automotive, and consumer applications.

The 74ALVC series targets advanced low-voltage logic interfacing, emphasizing robustness in mixed-supply systems, partial power-down safety, and noise-immune signal conditioning for demanding embedded control environments.

FAQ

What is the maximum clock/data rate supported by 74ALVC244D,118?

The device has a typical propagation delay of 2.2 ns at 3.3 V, supporting reliable operation up to approximately 200 MHz in point-to-point buffered paths. Actual maximum data rate depends on load capacitance, trace impedance, and timing margins in the target PCB layout - measured tpd values at 30–50 pF loads confirm suitability for 50 MHz parallel buses with margin.

Can 74ALVC244D,118 safely interface a 3.3 V microcontroller with a 5 V peripheral?

No - while inputs tolerate up to 3.6 V, they are not rated for sustained 5 V signals. Direct connection risks damage or undefined behavior. Use a dedicated level translator (e.g., TXB0108) or resistor-divider network for 5 V to 3.3 V translation; the device itself does not provide 5 V-tolerant input capability.

Does the SO20 package (SOT163-1) require thermal pad soldering?

No - the SOT163-1 package has no exposed thermal pad. Its thermal performance relies on standard gull-wing lead conduction and PCB copper area. The 12.3 mW/K derating above 109 °C is based on JEDEC-standard PCB mounting conditions (2-layer board, 1 in² copper per side), not internal thermal pads.

How does IOFF differ from standard 3-state disable in power-down scenarios?

Standard 3-state disables outputs but leaves input/output structures electrically connected - risking back-current if VCC = 0 V and bus voltage > 0 V. IOFF actively disconnects internal transistors, limiting leakage to ±80 μA even with 3.6 V applied to pins while VCC is unpowered, preventing latch-up and enabling true hot-swap capability.