Nexperia USA Inc. 74ALVC244PW,112

Overview

74ALVC244PW,112 from Nexperia is a 3.3 V octal buffer/line driver with 3-state outputs, featuring ±24 mA output drive, 3.3 ns typical propagation delay at V_CC = 3.3 V, and operation over -40 °C to +85 °C. It serves as a bidirectional bus interface device in low-voltage digital systems such as industrial control backplanes and FPGA I/O expansion.

For engineers reviewing the 74ALVC244PW,112 datasheet, 74ALVC244PW,112 pinout, 74ALVC244PW,112 application, or 74ALVC244PW,112 equivalent, key selection criteria include output drive strength, propagation delay consistency across channels, 3-state enable timing, and TSSOP-20 package thermal performance in high-density PCB layouts.

Technical Context

This device implements two independent 4-bit non-inverting buffer sections, each controlled by separate active-low output-enable (OE) inputs. Each section supports 3-state output control with simultaneous channel enable/disable and no internal bus contention.

Designed for mixed-voltage interfacing, it accepts 1.65–3.6 V input logic levels while maintaining 3.3 V output swing, enabling interoperability between 1.8 V, 2.5 V, and 3.3 V logic families without level-shifting circuitry.

Key Specifications

Pinout & Package

TSSOP-20 (Thin Shrink Small Outline Package), 0.65 mm pitch, 6.5 mm × 4.4 mm body, exposed pad not present, JEDEC MO-153 compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal buffer applications.

Compared with SN74LVC244APWR and 74LVC244ADB,118, the 74ALVC244PW,112 offers optimal balance of propagation delay, thermal performance in compact layouts, and industrial temperature compliance-making it preferred for space-constrained, high-reliability embedded interfaces.

Availability

74ALVC244PW,112 is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA I/O expansion modules, and automotive body control units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74ALVC244PW,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions for automotive, industrial, and consumer markets.

The ALVC (Advanced Low-Voltage CMOS) product line delivers high-speed, low-power logic devices optimized for 3.3 V and mixed-voltage system interfacing in space- and power-sensitive applications.

FAQ

What is the maximum output current per pin for 74ALVC244PW,112?

The device supports ±24 mA DC output current per pin under steady-state conditions at V_CC = 3.3 V and T_A = 25 °C. This rating remains valid up to 105 °C ambient when derated per Nexperia's thermal guidelines, and applies only when no more than four outputs switch simultaneously to avoid exceeding total package power dissipation limits.

Does 74ALVC244PW,112 support hot insertion?

No, the 74ALVC244PW,112 does not include hot-swap protection features such as power-up 3-state or I_OFF partial-power-down mode. Its inputs and outputs are not designed to tolerate live backplane insertion; system-level hot-plug capability requires external isolation circuitry or dedicated hot-swap controllers.

Can 74ALVC244PW,112 interface directly with 5 V TTL logic?

No, its absolute maximum input voltage is V_CC + 0.5 V, limiting safe input to ≤4.1 V at 3.3 V supply. Direct connection to 5 V TTL outputs risks permanent damage. A discrete resistor divider or purpose-built level translator like the TXS0108E is required for reliable 5 V-to-3.3 V signal translation.

Is there an exposed thermal pad on the TSSOP-20 package?

No, the 74ALVC244PW,112 in TSSOP-20 (package code PW) has no exposed thermal pad. Thermal dissipation relies solely on lead-frame conduction through the 20 gull-wing leads and PCB copper area. For high-duty-cycle applications, use ≥25 mm² of 2-oz copper connected to GND under the package body to maintain junction temperature below 125 °C.