Nexperia USA Inc. 74ALVC245BQ,115
- Part No.:
- 74ALVC245BQ,115
- Manufacturer:
- Nexperia USA Inc.
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
74ALVC245BQ,115.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 20DHVQFN
- Quantity:
- Payment:

- Shipping:

Inventory:375
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74ALVC245BQ,115 from Nexperia is an octal 3-state bus transceiver with bidirectional data flow controlled by DIR and active-low OE inputs, operating across 1.65 V to 3.6 V supply, featuring Schmitt-trigger inputs for noise immunity and IOFF circuitry enabling partial power-down protection. It is used in voltage-level translation between mixed-supply subsystems in industrial control backplanes and FPGA I/O expansion interfaces.
For engineers reviewing the 74ALVC245BQ,115 datasheet, 74ALVC245BQ,115 pinout, 74ALVC245BQ,115 application, or 74ALVC245BQ,115 equivalent, key selection criteria include its 20-terminal DHVQFN package, -40 °C to +125 °C temperature rating, 3.4 ns max propagation delay at 3.6 V, IOFF-enabled hot-swap capability, and compatibility with TTL input thresholds.
Technical Context
The device implements dual-bus bidirectional data transfer using a single DIR signal to select direction (A→B or B→A) and an active-low OE to place all outputs in high-impedance state. Its Schmitt-trigger inputs accept slow-rising signals and reject noise below hysteresis thresholds of ~0.3–0.8 V depending on VCC.
IOFF circuitry actively disables output drivers when VCC = 0 V, limiting backflow current to ±10 µA maximum and preventing damage during live insertion or partial system power-down. The logic conforms to JEDEC standards JESD8-7, JESD8-5, and JESD8C/JESD36 across its full 1.65–3.6 V operating range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 1.65 V to 3.6 V - supports direct interface between 1.8 V, 2.5 V, and 3.3 V logic domains without level shifters. |
| Propagation Delay | 3.4 ns max at VCC = 3.0–3.6 V - enables reliable operation in high-speed parallel bus systems up to ~150 MHz clock-equivalent rates. |
| IOFF Leakage | ±10 µA max at VCC = 0 V - ensures safe hot-plug operation and prevents bus contention during power sequencing. |
| Input Hysteresis | ~0.4–0.6 V typical - rejects noise on slow-rising control lines such as reset or enable signals in noisy industrial environments. |
| Operating Temperature | -40 °C to +125 °C - qualified for under-hood automotive modules, industrial PLCs, and telecom line cards requiring extended thermal margin. |
| ESD Protection | HBM >2000 V, CDM >1000 V - withstands handling and board assembly without additional protection circuitry. |
| Power Dissipation | 500 mW max at Tamb ≤111 °C (DHVQFN) - supports compact layout in thermally constrained embedded modules. |
Pinout & Package
DHVQFN20 (SOT764-1) package: 2.5 mm × 4.5 mm × 0.85 mm body, 20-terminal no-lead quad flat design with exposed thermal pad (non-soldered or floating GND connection per datasheet).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | DIR | Direction control input: HIGH enables B→A data flow; LOW enables A→B flow - critical for synchronous bus arbitration. |
| 2–9 | A0–A7 | Port A bidirectional I/O - connects to microcontroller or ASIC local bus; driven by internal drivers when enabled. |
| 11–18 | B0–B7 | Port B bidirectional I/O - interfaces to peripheral bus or memory subsystem; electrically isolated when OE is HIGH. |
| 10 | GND | Ground reference (0 V) - must be connected; thermal pad may remain floating or tied to GND per layout guidance. |
| 19 | OE | Active-low output enable - asserts high-impedance state on both ports simultaneously; synchronizes with DIR for glitch-free switching. |
| 20 | VCC | Positive supply rail - powers internal logic and output drivers; requires local 100 nF decoupling adjacent to pin. |
Key Features
| Feature | Design Value |
|---|---|
| Wide VCC range (1.65–3.6 V) | Eliminates need for external level translators when interfacing 1.8 V FPGAs to 3.3 V peripherals. |
| IOFF partial power-down | Prevents destructive back-current during hot-swap or staggered power-up sequences in modular systems. |
| Schmitt-trigger inputs | Enables robust operation with slow or noisy control signals (e.g., mechanical switch debouncing, long PCB traces). |
| JEDEC-compliant voltage standards | Guarantees interoperability across vendor ecosystems including TI, ON Semi, and ST logic families. |
| Thermally enhanced DHVQFN | 0.85 mm profile and exposed pad support high-density routing and improved thermal dissipation in space-constrained designs. |
Applications
| Industrial Backplane Interface | FPGA I/O Expansion |
|---|---|
|
Use Scenario: Bidirectional data exchange between a 3.3 V main controller and multiple 1.8 V sensor nodes on a shared backplane. IC Role / Device Role / Timing Role: Level-translating bus transceiver managing direction and isolation via DIR/OE; provides sub-4 ns timing margin for 25 MHz parallel transfers. Use Value: Eliminates discrete level shifters and reduces BOM count while maintaining signal integrity across mixed-voltage domains. |
Use Scenario: Extending limited FPGA I/O pins to drive external SRAM, ADCs, and display controllers operating at different voltage rails. IC Role / Device Role / Timing Role: Octal bidirectional buffer with configurable direction and 3-state control synchronized to FPGA clock domain. Use Value: Enables flexible pin-multiplexing without sacrificing timing performance or introducing bus contention risks. |
| Automotive Body Control Module | Telecom Line Card Data Buffering |
|
Use Scenario: Isolating MCU GPIOs from CAN transceiver control lines and LIN bus peripherals in under-dash ECUs. IC Role / Device Role / Timing Role: Voltage-tolerant transceiver with IOFF protection during ignition cycling; operates reliably at 125 °C ambient. Use Value: Prevents latch-up and backfeed during battery disconnect/reconnect events, improving system robustness. |
Use Scenario: Buffering parallel configuration data between baseband processor and multi-channel RF front-end ICs in 5G small cells. IC Role / Device Role / Timing Role: Low-skew, low-capacitance bus interface ensuring setup/hold compliance across 20-bit wide control paths. Use Value: Reduces signal degradation and crosstalk in high-density RF modules where trace length matching is impractical. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC245APWR | Same 20-pin TSSOP package; identical VCC range and IOFF, but lacks Schmitt-trigger inputs and has higher max tpd (5.5 ns). | Less tolerant of slow-rising enable/control signals; suitable only where clean digital edges are guaranteed. | Select when footprint compatibility with legacy TSSOP layouts is required and input edge rates exceed 10 ns/V. |
| 74LVC245AD,118 | SO20 package (SOT163-1); same electrical specs but larger footprint (7.5 mm width) and lower thermal efficiency (12.3 mW/K derating). | Not suitable for ultra-thin or thermally dense PCBs; preferred for through-hole prototyping or legacy rework. | Choose for manual assembly, test fixtures, or cost-sensitive industrial boards where thermal headroom exceeds 25 °C. |
Compared with SN74LVC245APWR and 74LVC245AD,118, the 74ALVC245BQ,115 delivers superior noise immunity via Schmitt triggers, tighter timing (3.4 ns vs. 5.5 ns), and optimized thermal performance in a 2.5×4.5 mm footprint-making it the preferred choice for high-reliability, space-constrained, and mixed-slew-rate systems.
Availability
74ALVC245BQ,115 is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA I/O expansion, automotive body control modules, and telecom line card buffering requiring stable component supply across extended temperature and mixed-voltage environments.
Supply support for 74ALVC245BQ,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions, with leadership in automotive-qualified and industrial-grade components.
The 74ALVC series targets low-voltage, high-speed bus interface applications in space- and power-constrained systems, emphasizing robustness across voltage domains and thermal extremes.
FAQ
Can 74ALVC245BQ,115 operate with VCC = 1.65 V while driving 3.3 V-tolerant loads?
Yes. Its overvoltage-tolerant inputs accept up to 3.6 V regardless of VCC, and outputs swing rail-to-rail within the 1.65–3.6 V supply range. At 1.65 V, VOH is guaranteed ≥1.25 V (with 6 mA load), sufficient to meet VIH thresholds of 3.3 V CMOS devices when properly terminated.
What is the function of the exposed thermal pad on the DHVQFN package?
The exposed pad (terminal 1 index area) serves as a thermal path to the PCB. Per Nexperia's guidance, it may remain electrically floating or be connected to GND - no solder requirement exists, but if soldered, the land must not create unintended shorts or ground loops that compromise signal integrity.
How does IOFF behavior differ from standard 3-state disable?
Standard 3-state only disables driver output stages while leaving input circuitry active. IOFF additionally isolates all I/O terminals from internal circuitry when VCC = 0 V, limiting leakage to ±10 µA and preventing backflow current - essential for hot-swap and partial power-down safety.
Is DIR pin synchronized to avoid bus glitches during direction changes?
No internal synchronization is provided. DIR must be held stable during OE transitions and for tdis (max 6.3 ns) after OE deassertion. Glitch-free operation requires external timing control - e.g., aligning DIR changes with OE assertion or using clock-gated enable logic in the host system.
74ALVC245BQ,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74ALVC
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-DHVQFN (4.5x2.5)
74ALVC245BQ,115 FAQ
1.How can I place an order for 74ALVC245BQ,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74ALVC245BQ,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74ALVC245BQ,115 reliable?
The price and inventory of 74ALVC245BQ,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ALVC245BQ,115 is usually 5 days.
3.What payment methods are accepted for 74ALVC245BQ,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74ALVC245BQ,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74ALVC245BQ,115?
74ALVC245BQ,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74ALVC245BQ,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74ALVC245BQ,115?
For technical support, including 74ALVC245BQ,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ALVC245BQ,115 requirements.
6.How does Aetrix verify that 74ALVC245BQ,115 is sourced from the original manufacturer or authorized distributors?
All 74ALVC245BQ,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ALVC245BQ,115 meets industry standards.
7.What is the process for return or replacement of 74ALVC245BQ,115?
All 74ALVC245BQ,115 units undergo pre-shipment inspection (PSI). If there is an issue with 74ALVC245BQ,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74ALVC245BQ,115 part is unused and in its original packaging.
Return procedure for 74ALVC245BQ,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74ALVC245BQ,115 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments

-
SN74LVC2G17DBVR
Texas Instruments

-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments

-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

