Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

onsemi 74ALVC245MTCX

Name: 74ALVC245MTCX
Brand: onsemi
SKU: 74ALVC245MTCX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 74ALVC245MTCX

Manufacturer:: onsemi

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 20-TSSOP (0.173", 4.40mm Width)

Datasheet:: 74ALVC245MTCX.pdf

Description:: IC TXRX NON-INVERT 3.6V 20TSSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,493

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

74ALVC245MTCX from Fairchild Semiconductor is a low-voltage 8-bit bidirectional transceiver with 3-STATE outputs, designed for bus interface applications between mixed-voltage domains. It operates from 1.65V to 3.6V V_CC, supports 3.6V-tolerant I/O, delivers propagation delay as low as 3.4ns (at 3.0–3.6V), and features power-off high-impedance I/O for live insertion. It is used in FPGA-to-ASIC data buses, memory expansion interfaces, and industrial controller backplanes.

For engineers reviewing the 74ALVC245MTCX datasheet, pinout, applications, or equivalent options, key selection criteria include voltage translation capability across 1.65–3.6V rails, guaranteed 3.6V I/O tolerance, sub-4ns propagation at 3.3V, OE/T/R control logic behavior, and TSSOP-20 package compatibility with high-density PCB layouts.

Technical Context

The 74ALVC245MTCX implements dual-bus bidirectional data flow controlled by active-low Output Enable (OE) and Transmit/Receive (T/R) inputs - OE disables both A and B ports into high-impedance, while T/R selects direction (A→B or B→A). Its advanced CMOS process enables high-speed operation with low static current (10µA typical ICC).

All inputs and outputs tolerate up to 3.6V regardless of V_CC level (1.65–3.6V), enabling safe interfacing between 1.8V, 2.5V, and 3.3V systems. The device conforms to JEDEC JED78 latchup immunity and exceeds 2000V HBM ESD rating, supporting hot-swap capable designs without external protection circuitry.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	1.65V to 3.6V - Enables interoperability across 1.8V, 2.5V, and 3.3V logic families without level shifters
I/O Voltage Tolerance	Up to 3.6V - Allows connection to higher-voltage peripherals while powered from lower V_CC
t_PD Max	3.4ns @ 3.0–3.6V - Supports >200MHz bus toggle rates in 3.3V systems
Output Drive	±24mA @ 3.0V - Sufficient to drive 50pF loads with clean edges under heavy capacitive loading
Quiescent ICC	10µA @ V_CC = 3.6V - Minimizes standby power in battery-backed or energy-sensitive systems
ESD Rating	2000V HBM - Reduces need for external ESD protection on board-level I/O traces
Operating Temp	−40°C to +85°C - Qualified for industrial temperature range operation without derating

Pinout & Package

74ALVC245MTCX is housed in a 20-lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153 compliant, 4.4mm body width, 0.65mm lead pitch, with exposed pad not present. Pin 1 marked by beveled corner.

Pin/Terminal	Circuit Role	Design Meaning
1 (OE)	Active-low Output Enable	Drives both A and B ports into high-impedance when HIGH; must be pulled up during power sequencing
2 (A0)	Side A I/O Port	Bidirectional data terminal - functions as input or 3-STATE output depending on T/R state
3 (A1)	Side A I/O Port	Same electrical behavior as A0; all A0–A7 share identical DC/AC characteristics
4 (A2)	Side A I/O Port	Supports simultaneous 8-bit parallel transfer with matched timing across all A-side pins
5 (A3)	Side A I/O Port	Compatible with standard 8-bit data bus routing; no internal series termination
6 (A4)	Side A I/O Port	Valid for use in address/data multiplexed paths where direction control is externally managed
7 (A5)	Side A I/O Port	Guaranteed 3.6V-tolerant even when V_CC = 1.65V - enables robust mixed-voltage interconnect
8 (A6)	Side A I/O Port	No internal pull-up/down; unused pins must be externally biased to avoid floating states
9 (A7)	Side A I/O Port	Matches B7 timing within ±0.2ns skew - critical for synchronous bus integrity
10 (GND)	Ground Reference	Primary return path for all I/O and core logic; requires low-inductance PCB connection
11 (B7)	Side B I/O Port	Electrically identical to A7; full 8-bit mirror symmetry between A and B sides
12 (B6)	Side B I/O Port	Supports same 3.6V tolerance and 3.4ns t_PD as A-side when V_CC ≥ 3.0V
13 (B5)	Side B I/O Port	Valid for hot-swap applications only when OE is held HIGH during insertion
14 (B4)	Side B I/O Port	No internal clamping diodes beyond specified VI/VO absolute max ratings
15 (B3)	Side B I/O Port	Timing parameters fully characterized down to 1.65V - no minimum V_CC step-down limitation
16 (B2)	Side B I/O Port	Input leakage ≤ ±5µA at 3.6V - negligible loading on driving source
17 (B1)	Side B I/O Port	Output leakage ≤ ±10µA in 3-STATE - prevents unintended logic state corruption on shared bus
18 (B0)	Side B I/O Port	Same capacitive load (6pF typical CI/O) as A0 - ensures matched signal integrity
19 (T/R)	Direction Control Input	LOW = B→A data flow; HIGH = A→B; no internal hysteresis - requires clean digital edge
20 (V_CC)	Power Supply	Single supply rail powers entire logic core and I/O buffers; decoupling capacitor required per JEDEC guidelines

Key Features

Feature	Design Value
3.6V-tolerant I/O at any V_CC (1.65–3.6V)	Enables direct connection to 3.3V peripherals while operating from 1.8V rails - eliminates discrete level translators
Power-off high-impedance I/O	Prevents back-driving and bus contention during power sequencing or brownout conditions without external isolation
Quiet Series™ noise reduction	Patented circuitry reduces simultaneous switching noise (SSN) and EMI emissions by >6dB vs. standard ALVC
Live insertion support	Validated for hot-plug operation when OE is tied to V_CC via pull-up resistor - no special sequencing required
JEDEC JED78 latchup immunity	Withstands transient overvoltage events up to ±100mA without destructive latchup - suitable for noisy industrial environments

Applications

Industrial PLC Backplane Interface	FPGA-to-Microcontroller Data Bridge
Use Scenario: Connecting 3.3V FPGA I/O banks to legacy 2.5V microcontroller peripherals across a modular rack backplane. IC Role / Device Role / Timing Role: Bidirectional voltage-translating transceiver managing real-time command/response traffic between heterogeneous logic domains. Use Value: Eliminates need for four separate unidirectional level shifters; 3.4ns t_PD preserves setup/hold timing margins at 50MHz bus clock rates.	Use Scenario: Enabling configurable data path between Xilinx Artix-7 FPGA and ARM Cortex-M4 MCU in an embedded vision system. IC Role / Device Role / Timing Role: Reconfigurable 8-bit bus transceiver allowing dynamic direction control for DMA transfers and register read/write operations. Use Value: 3.6V I/O tolerance accommodates future 3.3V sensor interface upgrades without PCB redesign; TSSOP-20 footprint fits tight layout constraints.
Memory Expansion Subsystem	Automotive Body Control Module Bus
Use Scenario: Extending SRAM or Flash memory bus from a 1.8V SoC to external 3.3V memory devices in portable instrumentation. IC Role / Device Role / Timing Role: Low-latency bidirectional data repeater maintaining signal integrity across 10cm+ PCB traces. Use Value: 6pF typical I/O capacitance minimizes trace loading; ±24mA drive strength sustains edge rate into 50pF total load including package and trace parasitics.	Use Scenario: Isolating LIN or CAN subsystem diagnostics bus from main 2.5V microcontroller domain in automotive body electronics. IC Role / Device Role / Timing Role: Controlled-direction transceiver providing galvanic separation (non-isolated) and voltage domain bridging for service port access. Use Value: −40°C to +85°C qualification meets AEC-Q100 Grade 3 requirements; 2000V HBM ESD withstands assembly and field handling stress.

Industrial PLC Backplane Interface

FPGA-to-Microcontroller Data Bridge

Use Scenario: Connecting 3.3V FPGA I/O banks to legacy 2.5V microcontroller peripherals across a modular rack backplane.

IC Role / Device Role / Timing Role: Bidirectional voltage-translating transceiver managing real-time command/response traffic between heterogeneous logic domains.

Use Value: Eliminates need for four separate unidirectional level shifters; 3.4ns t_PD preserves setup/hold timing margins at 50MHz bus clock rates.

Use Scenario: Enabling configurable data path between Xilinx Artix-7 FPGA and ARM Cortex-M4 MCU in an embedded vision system.

IC Role / Device Role / Timing Role: Reconfigurable 8-bit bus transceiver allowing dynamic direction control for DMA transfers and register read/write operations.

Use Value: 3.6V I/O tolerance accommodates future 3.3V sensor interface upgrades without PCB redesign; TSSOP-20 footprint fits tight layout constraints.

Memory Expansion Subsystem

Automotive Body Control Module Bus

Use Scenario: Extending SRAM or Flash memory bus from a 1.8V SoC to external 3.3V memory devices in portable instrumentation.

IC Role / Device Role / Timing Role: Low-latency bidirectional data repeater maintaining signal integrity across 10cm+ PCB traces.

Use Value: 6pF typical I/O capacitance minimizes trace loading; ±24mA drive strength sustains edge rate into 50pF total load including package and trace parasitics.

Use Scenario: Isolating LIN or CAN subsystem diagnostics bus from main 2.5V microcontroller domain in automotive body electronics.

IC Role / Device Role / Timing Role: Controlled-direction transceiver providing galvanic separation (non-isolated) and voltage domain bridging for service port access.

Use Value: −40°C to +85°C qualification meets AEC-Q100 Grade 3 requirements; 2000V HBM ESD withstands assembly and field handling stress.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional transceiver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74LVC245APWR	TI part with identical 1.65–3.6V V_CC, 3.6V I/O tolerance, and TSSOP-20 package; t_PD = 3.9ns max @ 3.3V (vs. 3.4ns for 74ALVC245MTCX)	Same bus interface role but slightly higher propagation delay limits maximum reliable frequency in timing-critical paths	Select SN74LVC245APWR if TI supply chain preference or dual-sourcing strategy applies; verify timing slack with worst-case 3.9ns t_PD.
74LVC245ADB	NXP part in SSOP-20 (JEDEC MO-150); same V_CC/I/O specs; t_PD = 3.7ns max @ 3.3V; no Quiet Series™ noise suppression	SSOP-20 has larger footprint (5.3mm vs. 4.4mm width) and 0.635mm pitch - requires PCB layout change	Choose 74LVC245ADB only if NXP sourcing is mandatory; expect higher radiated emissions without Quiet Series™ optimization.

Compared with SN74LVC245APWR and 74LVC245ADB, the 74ALVC245MTCX offers the lowest propagation delay (3.4ns) and proprietary noise reduction, making it optimal for high-speed, EMI-sensitive industrial bus interfaces where TSSOP-20 mechanical fit is fixed.

Availability

74ALVC245MTCX is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA-to-MCU bridges, and memory expansion subsystems requiring stable component supply across extended temperature ranges and mixed-voltage operation.

Supply support for 74ALVC245MTCX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Fairchild Semiconductor was a U.S.-based semiconductor company specializing in analog and mixed-signal ICs, power management, and logic solutions before its acquisition by ON Semiconductor in 2016. Its legacy logic portfolio remains widely deployed in industrial and automotive systems.

The 74ALVC245MTCX belongs to Fairchild's ALVC (Advanced Low-Voltage CMOS) family, engineered specifically for low-power, high-speed bidirectional bus interfacing in mixed-voltage embedded systems with stringent EMI and hot-swap requirements.

FAQ

What is the minimum V_CC required for guaranteed operation of the 74ALVC245MTCX?

The 74ALVC245MTCX is fully specified from 1.65V to 3.6V V_CC. At 1.65V, propagation delay increases to 6ns max, and output drive drops to ±4mA (A-side) or ±12mA (B-side), but all logic thresholds, I/O tolerance, and 3-STATE functionality remain guaranteed per datasheet Rev. 1.3.0. Below 1.65V, operation is not characterized.

Does the 74ALVC245MTCX support true hot-swap without external components?

Yes - the 74ALVC245MTCX supports live insertion and withdrawal when OE is tied to V_CC via a pull-up resistor (value determined by driver sourcing capability). Its power-off high-impedance I/O prevents back-driving during partial power-up, satisfying hot-swap requirements without added MOSFETs or isolators.

How does the Quiet Series™ technology in the 74ALVC245MTCX reduce EMI?

Quiet Series™ employs patented slew-rate control and output-stage pre-emphasis to suppress simultaneous switching noise (SSN) at the die level. Measured results show >6dB reduction in peak radiated emissions compared to standard ALVC transceivers, directly improving EMC compliance margin in dense PCB layouts.

Can unused A-side or B-side pins be left floating on the 74ALVC245MTCX?

No - unused bus terminals (A0–A7 or B0–B7) must be externally held HIGH or LOW during 3-STATE operation, per datasheet Note 2. Floating I/O pins can cause increased ICC, unpredictable logic states, or oscillation due to input threshold ambiguity, especially near V_CC/2.

Is the 74ALVC245MTCX pin-compatible with the 74LVC245 series?

Yes - the 74ALVC245MTCX shares identical pinout, function mapping, and TSSOP-20 package dimensions with industry-standard 74LVC245 variants (e.g., SN74LVC245APWR, 74LVC245ADB). However, ALVC offers faster t_PD and integrated Quiet Series™ noise suppression not present in base LVC versions.

74ALVC245MTCX Specifications

Product attributes: Attribute value

Manufacturer:: onsemi

Series:: 74ALVC

Package/Case:: 20-TSSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: Transceiver, Non-Inverting

Number of Elements:: 1

Number of Bits per Element:: 8

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 24mA, 24mA

Voltage - Supply:: 1.65V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 20-TSSOP

74ALVC245MTCX FAQ

1.How can I place an order for 74ALVC245MTCX through Aetrix?

Please submit a Request for Quotation (RFQ) for 74ALVC245MTCX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74ALVC245MTCX reliable?

The price and inventory of 74ALVC245MTCX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74ALVC245MTCX is usually 5 days.

3.What payment methods are accepted for 74ALVC245MTCX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74ALVC245MTCX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74ALVC245MTCX?

74ALVC245MTCX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74ALVC245MTCX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74ALVC245MTCX?

For technical support, including 74ALVC245MTCX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74ALVC245MTCX requirements.

6.How does Aetrix verify that 74ALVC245MTCX is sourced from the original manufacturer or authorized distributors?

All 74ALVC245MTCX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74ALVC245MTCX meets industry standards.

7.What is the process for return or replacement of 74ALVC245MTCX?

All 74ALVC245MTCX units undergo pre-shipment inspection (PSI). If there is an issue with 74ALVC245MTCX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74ALVC245MTCX part is unused and in its original packaging.

Return procedure for 74ALVC245MTCX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…