NXP Semiconductors 74ALVC32PW,112

Overview

74ALVC32PW,112 from Nexperia is a quad 2-input OR gate logic IC with Schmitt-trigger inputs, IOFF partial power-down capability, and operation across 1.65 V to 3.6 V supply. It delivers propagation delay as low as 2.0 ns at 3.0–3.6 V, supports -40 °C to +125 °C ambient, and features overvoltage-tolerant inputs up to 3.6 V. Used in level-shifting, noise-immune signal conditioning, and bus interface logic in industrial control and portable electronics.

For engineers reviewing the 74ALVC32PW,112 datasheet, 74ALVC32PW,112 pinout, 74ALVC32PW,112 application, or 74ALVC32PW,112 equivalent, key selection criteria include IOFF-enabled power sequencing, Schmitt-trigger input hysteresis for slow-edge immunity, guaranteed timing across wide voltage/temperature range, and TSSOP14 package compatibility with high-density PCB layouts.

Technical Context

This device implements four independent 2-input OR gates with Schmitt-trigger inputs-each providing hysteresis (typically ~0.3 V at VCC = 3.3 V) to reject noise on slow-rising/falling signals. Input thresholds scale with VCC per JEDEC standards JESD8-7, JESD8-5, and JESD8C/JESD36.

The IOFF circuit actively disables outputs when VCC = 0 V, limiting backflow current to ≤ ±10 μA (max), enabling safe hot-insertion and multi-rail partial power-down systems. Static drive strength is ±24 mA at VCC = 3.0 V, with VOL ≤ 0.55 V and VOH ≥ 2.2 V under full load.

Key Specifications

Pinout & Package

TSSOP14 plastic thin shrink small outline package (SOT402-1); 14-lead, 4.4 mm body width, 0.65 mm pitch; thermally enhanced for high-density routing and reflow compatibility.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad 2-input OR gate applications.

Compared with SN74LVC32APWR and 74LVC32PW,118, the 74ALVC32PW,112 uniquely combines Schmitt-trigger inputs, IOFF, and -40 °C to +125 °C qualification - making it the sole option for robust, hot-pluggable, wide-temperature industrial logic interfacing.

Availability

74ALVC32PW,112 is available at Aetrix Electronics and suitable for industrial sensor aggregation, power sequencing control, portable keypad scanning, and legacy bus signal conditioning requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for 74ALVC32PW,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a leading Dutch semiconductor manufacturer specializing in high-volume logic, discrete, and MOSFET solutions, with emphasis on reliability, efficiency, and application-specific optimization.

The 74ALVC series targets advanced low-voltage logic applications demanding robust noise immunity, power-aware design, and seamless integration across heterogeneous voltage domains in industrial and computing systems.

FAQ

Does 74ALVC32PW,112 support true bidirectional operation?

No. The 74ALVC32PW,112 is a unidirectional combinatorial logic device with dedicated inputs (1A–4B) and outputs (1Y–4Y). It lacks bus transceiver functionality, direction control pins, or internal feedback paths required for bidirectional data flow. Its IOFF feature only disables outputs during power-down-it does not enable reverse signal propagation.

Can 74ALVC32PW,112 be used with a 5 V microcontroller output?

Yes - its inputs are overvoltage tolerant up to 3.6 V, but not 5 V. Direct connection to a 5 V MCU output violates the absolute maximum input voltage rating (VI ≤ +4.6 V is limiting, but recommended operating VI ≤ 3.6 V). A resistive divider or level shifter is required to clamp input voltage to ≤3.6 V while maintaining logic thresholds.

What is the thermal resistance (RθJA) of the TSSOP14 package?

The SOT402-1 (TSSOP14) package has a typical RθJA of 140 K/W under standard JEDEC JESD51-2 PCB conditions (2-layer board, 2 oz copper, 1 in² copper pad). Derating begins at +81 °C ambient, with linear reduction of 7.3 mW/K above that point - critical for sustained 500 mW total power dissipation planning.

Is the exposed thermal pad on the DHVQFN variant present in the TSSOP version?

No. The DHVQFN14 (SOT762-1) variant includes an exposed thermal pad for enhanced heat dissipation, but the TSSOP14 (SOT402-1) package used in 74ALVC32PW,112 has no thermal pad. Its thermal performance relies solely on lead-frame conduction through the 14 gull-wing leads and PCB copper area beneath the body.