Texas Instruments 74AUC1G125DBVRE4
- Part No.:
- 74AUC1G125DBVRE4
- Manufacturer:
- Texas Instruments
- Package:
- SC-74A, SOT-753
- Datasheet:
-
74AUC1G125DBVRE4.pdf
- Description:
- IC BUF NON-INVERT 2.7V SOT23-5
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
74AUC1G125DBVRE4 from Texas Instruments is a single 3-state bus buffer gate optimized for 1.8-V operation, delivering ±8-mA output drive, 2.5-ns max propagation delay at 1.8 V/30 pF, 0.8–2.7-V supply range, and over-voltage tolerant I/Os up to 3.6 V. It serves as a high-speed signal redriver in compact digital interfaces such as memory expansion buses and low-voltage FPGA I/O conditioning.
For engineers reviewing the 74AUC1G125DBVRE4 datasheet, 74AUC1G125DBVRE4 pinout, 74AUC1G125DBVRE4 application, or 74AUC1G125DBVRE4 equivalent, key selection criteria include its NanoFree™-compatible SOT-23 package, Ioff-enabled partial power-down capability, ULTTL output structure for 50–65-Ω transmission line driving, and guaranteed operation down to 0.8 V for ultra-low-power systems.
Technical Context
The 74AUC1G125DBVRE4 implements a noninverting 3-state buffer with active-low output enable (OE), where Y follows A when OE is low and enters high-impedance state when OE is high. Its ULTTL output architecture provides matched source/sink strength and dynamic impedance control during transitions to suppress ringing on short (<15 cm) controlled-impedance lines.
It supports true partial power-down via Ioff circuitry that disables outputs and limits back-drive current when VCC = 0 V, while standard CMOS inputs require termination to VCC or GND to prevent floating-induced oscillation or excess power draw. The device operates across –40°C to +85°C and meets JESD78 Class II latch-up immunity (>100 mA).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 2.7 V - enables interoperability with sub-1-V logic domains and compatibility with 1.2-V, 1.8-V, and 2.5-V systems. |
| Max Propagation Delay | 2.5 ns at 1.8 V, 30 pF - ensures timing closure in high-speed data paths up to ~250 MHz clock rates. |
| Output Drive Strength | ±8 mA at 1.8 V - sufficient to drive moderate capacitive loads and 50–65-Ω PCB traces without external termination. |
| Ioff Current | ±10 µA at 2.7 V - guarantees safe isolation during system-level power sequencing and hot-swap scenarios. |
| Input Voltage Tolerance | Up to 3.6 V independent of VCC - allows interfacing with higher-voltage peripherals without level shifters. |
| Quiescent Current | 10 µA max ICC - supports battery-powered and always-on subsystems with minimal standby power impact. |
| ESD Rating (HBM) | ±2000 V - meets industrial-grade robustness requirements for handling and board assembly. |
Pinout & Package
SOT-23-5 (DBV) package: 2.90 mm × 1.60 mm body, 5-pin surface-mount, lead-free (NIPDAU), moisture sensitivity level 1 (260°C reflow unlimited).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - OE | Active-low output enable input | Drives Y into high-impedance state when high; must be pulled up to VCC during power-up/down to ensure defined Z-state. |
| 2 - A | Noninverting logic input | Accepts 0.8–3.6 V signals; requires external termination to VCC or GND if unused to prevent floating. |
| 3 - GND | Ground reference | Primary return path for all currents; layout requires low-inductance connection to system ground plane. |
| 4 - Y | 3-state buffered output | Delivers rail-to-rail switching with ULTTL drive; directly drives 50–65-Ω transmission lines ≤15 cm without termination resistors. |
| 5 - VCC | Positive supply | Must be bypassed with 0.1-µF capacitor placed adjacent to pin; supports wide voltage scaling for power domain flexibility. |
Key Features
| Feature | Design Value |
|---|---|
| ULTTL Output Architecture | Dynamic impedance control during edge transitions minimizes overshoot/ringing on 50–65-Ω PCB traces without external termination. |
| Ioff Partial Power-Down | Outputs fully disable with <±10 µA leakage when VCC = 0 V, enabling safe multi-rail power sequencing and back-drive protection. |
| Over-Voltage Tolerant I/Os | All pins withstand 3.6 V regardless of VCC value - eliminates need for external clamping diodes or level translators in mixed-voltage interfaces. |
| NanoFree™ Packaging Compatibility | SOT-23 footprint supports die-as-package miniaturization - reduces board area by >30% vs. legacy SOIC while maintaining thermal performance (RθJA = 220.7°C/W). |
| Low-Power Logic Operation | 10 µA max ICC and 2 pF typical input capacitance enable integration into power-constrained portable and IoT endpoints. |
Applications
| Memory Interface Signal Redriving | FPGA I/O Level Translation & Conditioning |
|---|---|
Use Scenario: Re-timing and strengthening address/data strobes between low-voltage microcontroller and parallel NOR flash. IC Role / Device Role / Timing Role: Single-line noninverting buffer with 3-state control synchronizes signal edges and restores voltage margins degraded by trace capacitance. Use Value: Enables reliable 1.8-V flash access at >20-MHz bus rates using only internal pull-ups and no external resistors or drivers. |
Use Scenario: Isolating and conditioning configuration I/Os between 1.2-V FPGA core banks and 1.8-V peripheral logic. IC Role / Device Role / Timing Role: Bidirectional signal conditioner with Ioff and overvoltage tolerance prevents cross-bank contention during partial reconfiguration. Use Value: Eliminates risk of damage during FPGA power sequencing and supports hot-plug interface extension without added protection circuitry. |
| USB 2.0 Data Line Buffering | Industrial Sensor Interface Signal Gating |
Use Scenario: Driving D+ and D− lines from a low-power MCU to meet USB 2.0 full-speed rise/fall time specs over 10-cm flex cable. IC Role / Device Role / Timing Role: High-speed 3-state buffer with matched source/sink drive ensures clean 480-Mbps eye diagrams under load. Use Value: Achieves USB compliance without series resistors or AC coupling, reducing BOM count and PCB space in compact host designs. |
Use Scenario: Enabling/disabling analog sensor data lines (e.g., I²C SDA/SCL) during sleep mode to cut leakage current in battery-operated nodes. IC Role / Device Role / Timing Role: Low-leakage gate with Ioff and 10-µA ICC isolates sensor bus while preserving signal integrity during wake-up transitions. Use Value: Extends battery life by >15% in multi-sensor nodes through selective bus gating and zero-current off-state. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G125DBVR | Wider VCC range (1.65–5.5 V), lower drive (±24 mA @ 3.3 V), slower tpd (3.7 ns @ 3.3 V/30 pF), no overvoltage tolerance. | Requires level shifting for sub-1.65-V systems; unsuitable for direct 3.6-V I/O interfacing. | Select when operating above 1.65 V and needing higher drive or broader voltage compatibility. |
| 74AUP1G125GW,125 | NXP variant with identical AUC-family specs but different MSL rating (Level-1-260°C vs TI's Level-1-260°C-UNLIM) and RoHS finish (NiPdAu vs NIPDAU). | Same functional behavior and pinout; minor packaging process variation affects long-term solder joint reliability in high-reliability environments. | Use when dual-sourcing required or when NXP's qualification documentation aligns with program-specific standards. |
Compared with SN74LVC1G125DBVR and 74AUP1G125GW,125, the 74AUC1G125DBVRE4 uniquely delivers sub-1-V operation, 3.6-V I/O tolerance, and ULTTL signal integrity-making it the only choice for ultra-low-voltage, mixed-rail, and high-speed trace-driven applications.
Availability
74AUC1G125DBVRE4 is available at Aetrix Electronics and suitable for high-speed memory interfaces, FPGA I/O conditioning, USB 2.0 signal routing, and industrial sensor bus gating requiring stable component supply across automotive, industrial, and consumer production programs.
Supply support for 74AUC1G125DBVRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-performance, low-power IC design.
The SN74AUC1G125 belongs to TI's AUC (Advanced Ultra-low-voltage CMOS) logic family, engineered specifically for speed and signal integrity in sub-2-V digital systems - targeting portable, battery-powered, and high-density interconnect applications.
FAQ
What is the maximum operating frequency supported by the 74AUC1G125DBVRE4?
The 74AUC1G125DBVRE4 supports data rates up to 500 Mbps under optimal conditions (1.8 V, 15-pF load), corresponding to a maximum toggle frequency near 250 MHz. This is enabled by its 2.5-ns max propagation delay at 1.8 V/30 pF and ULTTL output structure designed for clean edge transitions on controlled-impedance lines.
Does the 74AUC1G125DBVRE4 require external pull-up or pull-down resistors on unused inputs?
Yes - all unused inputs of the 74AUC1G125DBVRE4 must be terminated to either VCC or GND to prevent floating, which can cause excessive power consumption or oscillation. A 10-kΩ resistor is recommended per TI's layout guidelines, especially for OE or A when not actively driven.
Can the 74AUC1G125DBVRE4 safely interface with 3.3-V logic signals?
Yes - the 74AUC1G125DBVRE4 features over-voltage tolerant I/Os rated to 3.6 V independent of VCC, allowing direct connection to 3.3-V peripherals without level shifters or clamping diodes, provided VCC remains within 0.8–2.7 V and absolute maximum ratings are observed.
What is the thermal resistance (RθJA) of the 74AUC1G125DBVRE4 in its SOT-23 package?
The 74AUC1G125DBVRE4 in DBV (SOT-23-5) package has a junction-to-ambient thermal resistance (RθJA) of 220.7°C/W, measured under standard JEDEC test conditions. This value assumes a two-layer board with 1-in² copper pour; actual thermal performance improves with enhanced PCB copper area or thermal vias.
How does the Ioff feature of the 74AUC1G125DBVRE4 protect downstream circuitry during power-down?
The Ioff feature in the 74AUC1G125DBVRE4 disables all outputs and limits leakage current to ±10 µA when VCC = 0 V, preventing damaging back-drive current from powered sections into unpowered logic. This ensures safe multi-rail power sequencing and protects connected devices during hot-swap or partial shutdown events.
74AUC1G125DBVRE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- SC-74A, SOT-753
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-5
74AUC1G125DBVRE4 FAQ
1.How can I place an order for 74AUC1G125DBVRE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUC1G125DBVRE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUC1G125DBVRE4 reliable?
The price and inventory of 74AUC1G125DBVRE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUC1G125DBVRE4 is usually 5 days.
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Once your 74AUC1G125DBVRE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUC1G125DBVRE4?
For technical support, including 74AUC1G125DBVRE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUC1G125DBVRE4 requirements.
6.How does Aetrix verify that 74AUC1G125DBVRE4 is sourced from the original manufacturer or authorized distributors?
All 74AUC1G125DBVRE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUC1G125DBVRE4 meets industry standards.
7.What is the process for return or replacement of 74AUC1G125DBVRE4?
All 74AUC1G125DBVRE4 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUC1G125DBVRE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUC1G125DBVRE4 part is unused and in its original packaging.
Return procedure for 74AUC1G125DBVRE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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