Texas Instruments 74AUC1G125DBVRG4

Overview

74AUC1G125DBVRG4 from Texas Instruments is a single 3-state bus buffer gate optimized for 1.8-V operation, delivering ±8-mA output drive, 2.5-ns max propagation delay at 1.8 V/30 pF, 0.8–2.7-V operating voltage range, and over-voltage tolerant I/Os up to 3.6 V. It serves as a high-speed signal redriver in compact digital interfaces such as memory expansion paths and low-voltage FPGA I/O buffers.

For engineers reviewing the 74AUC1G125DBVRG4 datasheet, 74AUC1G125DBVRG4 pinout, 74AUC1G125DBVRG4 application, or 74AUC1G125DBVRG4 equivalent, key selection criteria include its NanoFree™ SOT-23 package compatibility, Ioff-enabled partial power-down capability, ULTTL output structure for 50–65-Ω transmission line driving, and guaranteed 10-µA max ICC across –40°C to 85°C.

Technical Context

The 74AUC1G125DBVRG4 implements a noninverting 3-state buffer with active-low output enable (OE), where Y = A when OE is low and Y = high-impedance when OE is high. Its ULTTL CMOS output stage provides matched sourcing/sinking capability and dynamic impedance control during transitions to suppress ringing on short controlled-impedance lines.

It operates across 0.8–2.7 V but is specifically characterized and optimized for 1.65–1.95 V supply, enabling >250 MHz operation with 15-pF load. The Ioff feature disables outputs and blocks back-current flow when VCC = 0 V, supporting hot-insertion and partial-power-down system architectures.

Key Specifications

Pinout & Package

74AUC1G125DBVRG4 uses the 5-pin SOT-23 (DBV) package, measuring 2.90 mm × 1.60 mm, with exposed pad not present and standard lead finish (NIPDAU). This NanoFree™-compatible surface-mount package enables high-density routing and thermal performance suitable for space-constrained portable and embedded designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Compared with SN74LVC1G125DBVR and 74AUP1G125GW,125, the 74AUC1G125DBVRG4 uniquely balances sub-3-ns speed, 1.8-V optimization, and 3.6-V I/O tolerance in a NanoFree™ SOT-23 footprint-making it the only choice for compact, high-frequency, mixed-voltage redriving where both timing margin and voltage flexibility are mandatory.

Availability

74AUC1G125DBVRG4 is available at Aetrix Electronics and suitable for memory interface redriving, FPGA I/O expansion, USB 2.0 data conditioning, and industrial sensor bus enable applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant production volumes.

Supply support for 74AUC1G125DBVRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of innovation in high-performance logic and precision analog solutions.

The SN74AUC1G125 belongs to TI's AUC (Advanced Ultra-CMOS) sub-1-V logic family, engineered for maximum speed and signal fidelity in ultra-low-voltage digital systems-including portable computing, communications infrastructure, and industrial edge devices.

FAQ

What is the maximum operating frequency supported by the 74AUC1G125DBVRG4?

The 74AUC1G125DBVRG4 is characterized for operation up to 250 MHz at 1.8 V with a 15-pF load, based on its 2.5-ns maximum propagation delay and optimized ULTTL output structure. Real-world achievable frequency depends on layout, load capacitance, and transmission line impedance-but the device reliably sustains 500 Mbps data rates in point-to-point configurations with proper termination and trace control.

Does the 74AUC1G125DBVRG4 require external pull-up or pull-down resistors on unused pins?

Yes-the 74AUC1G125DBVRG4 requires all unused inputs (A and OE) to be tied to VCC or GND to prevent floating states that cause excessive current draw or oscillation. TI recommends a 10-kΩ pull-up on OE for power-up safety, ensuring Y remains in high-impedance until firmware asserts control. Unused A must also be terminated-typically to GND for predictable default behavior.

Can the 74AUC1G125DBVRG4 safely interface between a 1.2-V processor and a 3.3-V peripheral?

No-the 74AUC1G125DBVRG4 supports VCC from 0.8 V to 2.7 V and tolerates up to 3.6 V on I/Os, but its output swing is rail-referenced to VCC. With VCC = 1.2 V, Y cannot drive a valid 3.3-V logic high. It can accept 3.3-V inputs safely, but output translation requires a second-stage level shifter or a higher-VCC configuration (e.g., VCC = 1.8 V with 3.3-V-tolerant peripheral input).

What is the thermal resistance (RθJA) of the 74AUC1G125DBVRG4 in its SOT-23 package?

The 74AUC1G125DBVRG4 in the DBV (SOT-23) package has a junction-to-ambient thermal resistance (RθJA) of 220.7°C/W under standard JEDEC test conditions. This value assumes a 1-in² 2-oz copper pad with two vias; actual board-level performance improves significantly with enhanced copper pour and thermal vias beneath the package.

How does the Ioff feature of the 74AUC1G125DBVRG4 protect system-level circuits during power sequencing?

The Ioff feature in the 74AUC1G125DBVRG4 disables all outputs and limits leakage to ±10 µA when VCC = 0 V, preventing back-current flow from powered I/Os into unpowered sections. This protects downstream components during staggered power-up/down sequences-such as when an FPGA bank powers before its associated buffer-and eliminates latch-up risk in partial-power-down modes.