Texas Instruments 74AUC2G126DCURE4

Overview

74AUC2G126DCURE4 from Texas Instruments is a dual 3-state bus buffer gate optimized for 1.65-V to 1.95-V operation, delivering ±8-mA output drive at 1.8 V, sub-1-V operability, 1.9-ns max propagation delay, and Ioff support for partial-power-down mode - used in low-voltage data bus isolation in portable SSDs and USB-C peripheral hubs.

For engineers reviewing the 74AUC2G126DCURE4 datasheet, 74AUC2G126DCURE4 pinout, 74AUC2G126DCURE4 application, or 74AUC2G126DCURE4 equivalent, key selection criteria include its 1.8-V optimized timing, 3.6-V I/O tolerance for mixed-mode interfacing, NanoFree™ DCU package footprint, and guaranteed Ioff behavior during power sequencing.

Technical Context

This device implements two independent noninverting buffers, each with dedicated 3-state output-enable (OE) control. Each channel operates across 0.8-V to 2.7-V VCC but is characterized and specified for 1.65–1.95-V operation, ensuring robust noise margins and timing predictability in modern ultra-low-voltage systems.

Its Ioff circuitry actively disables outputs when VCC = 0 V, preventing backflow current from live buses into unpowered sections. The NanoFree™ DCU (US8) package uses the silicon die as the package body, eliminating wirebonds and reducing parasitic inductance for cleaner signal integrity.

Key Specifications

Pinout & Package

74AUC2G126DCURE4 is packaged in an 8-pin US8 (DCU) VSSOP package measuring 2.1 mm × 1.6 mm × 0.9 mm, with 0.5-mm lead pitch and exposed pad-free construction. Pin 1 is marked by a beveled corner on the top-side silkscreen.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Compared with SN74LVC2G126DCUR, 74AUC2G126DCURE4 delivers superior low-voltage timing and true partial-power-down safety; compared with 74AUP2G126DCURE4, it provides 3× faster propagation at 1.8 V while consuming only slightly more quiescent current.

Availability

74AUC2G126DCURE4 is available at Aetrix Electronics and suitable for mobile storage interfaces, USB-C peripheral routing, FPGA configuration buses, and industrial sensor hubs requiring stable component supply across extended temperature ranges.

Supply support for 74AUC2G126DCURE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog, embedded processing, and logic products for industrial, automotive, and consumer markets.

The AUC family - including 74AUC2G126DCURE4 - was engineered specifically for sub-1.8-V digital systems requiring high-speed, low-power, and mixed-voltage interoperability in space-constrained portable electronics.

FAQ

What is the minimum operating voltage for the 74AUC2G126DCURE4?

The 74AUC2G126DCURE4 operates down to 0.8 V VCC, with full functionality and guaranteed timing specifications beginning at 1.65 V. This sub-1-V capability enables use in near-threshold logic designs and ultra-low-power wake-up circuits where supply rails dip below 1.0 V during deep sleep modes. The device remains functional - though not fully characterized - across the entire 0.8-V to 2.7-V range.

Does the 74AUC2G126DCURE4 support hot-swap or partial-power-down operation?

Yes, the 74AUC2G126DCURE4 includes Ioff circuitry that disables all outputs when VCC = 0 V, limiting Ioff to ±10 µA at 2.7 V. This prevents damaging current backflow from live buses into unpowered sections - a critical requirement for hot-pluggable modules like M.2 SSDs or USB-C accessories. OE pins retain their function regardless of VCC state.

What is the maximum propagation delay of the 74AUC2G126DCURE4 at 1.8 V?

The maximum propagation delay (tpd) of the 74AUC2G126DCURE4 is 1.9 ns at VCC = 1.8 V, CL = 15 pF, and RL = 2 kΩ. This value applies to both A→Y and OE→Y transitions and is measured under worst-case process/voltage/temperature conditions. At 30-pF load, tpd increases to 2.3 ns - a key constraint for high-speed DDR or PCIe sideband signal routing.

Is the 74AUC2G126DCURE4 pin-compatible with other dual buffer variants in TI's portfolio?

The 74AUC2G126DCURE4 uses the US8 (DCU) 8-pin VSSOP package with standardized pinout (1A, 1Y, 1OE, GND, 2A, 2Y, 2OE, VCC), matching SN74LVC2G126DCUR and 74AUP2G126DCURE4. While pinout and footprint are identical, electrical behavior differs - especially in VCC range, drive strength, and Ioff - so direct substitution requires validation of timing, power, and power-down requirements.

What package type and dimensions does the 74AUC2G126DCURE4 use?

The 74AUC2G126DCURE4 is supplied in the US8 (DCU) VSSOP package: 2.1 mm × 1.6 mm × 0.9 mm body size, 0.5-mm lead pitch, and no exposed thermal pad. It belongs to TI's NanoFree™ family, where the silicon die serves as the mechanical package - eliminating wirebonds and reducing parasitic inductance. Pin 1 is identified by a beveled corner on the top surface.