Texas Instruments 74AUC2G240DCURG4
- Part No.:
- 74AUC2G240DCURG4
- Manufacturer:
- Texas Instruments
- Package:
- 8-VFSOP (0.091", 2.30mm Width)
- Datasheet:
-
74AUC2G240DCURG4.pdf
- Description:
- IC BUFFER INVERT 2.7V 8VSSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
74AUC2G240DCURG4 from Texas Instruments is a dual 1-bit noninverting buffer/driver with independent 3-state outputs, designed for sub-1.8-V bus interface applications. It operates from 0.8 V to 2.7 V, delivers ±8 mA output drive at 1.65 V, achieves 1.8 ns max propagation delay at 1.8 V, and features Ioff partial-power-down support. It is used in low-voltage memory address buffering and clock distribution in portable embedded systems.
For engineers reviewing the 74AUC2G240DCURG4 datasheet, 74AUC2G240DCURG4 pinout, 74AUC2G240DCURG4 application, or 74AUC2G240DCURG4 equivalent, key selection criteria include its 1.8-V optimized timing, 3-state bus contention control, NanoFree™-compatible VSSOP-8 footprint, and Ioff-enabled mixed-voltage system interoperability.
Technical Context
This device implements two independent noninverting buffers, each with dedicated active-low output-enable (OE) control. Its logic function follows a standard 3-state truth table: when OE is low, Y = A; when OE is high, Y = high-impedance. The architecture supports simultaneous bus driving and isolation without external pull-ups.
Designed for 1.65–1.95 V nominal operation, it maintains full functionality down to 0.8 V and tolerates 3.6-V I/O-enabling safe interfacing between 1.8-V logic and legacy 3.3-V subsystems. The Ioff circuitry actively disables outputs during power-down, preventing backflow current across powered-off rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 2.7 V - enables operation in ultra-low-power and mixed-voltage domains including battery-powered IoT nodes. |
| Max tpd @ 1.8 V | 1.8 ns - ensures tight timing margins in high-speed 1.8-V data paths such as memory address latching. |
| Output Drive | ±8 mA @ 1.65 V - sufficient to drive 15-pF loads across PCB traces without signal degradation. |
| Ioff Support | Yes - blocks current flow when VCC = 0 V, allowing hot insertion and partial power-down in multi-rail systems. |
| ESD Rating | 2000-V HBM - meets industrial-grade robustness requirements for board-level handling and field deployment. |
| Input Thresholds | VIL = 0.35×VCC, VIH = 0.65×VCC - provides noise margin >300 mV at 1.8 V for reliable CMOS switching. |
| Quiescent ICC | 10 µA @ 1.8 V - minimizes standby power in always-on sensor interface circuits. |
Pinout & Package
VSSOP-8 (DCU) package: 2.3 mm × 2.0 mm body, 0.5-mm lead pitch, 0.9-mm max height, exposed thermal pad not present, RoHS-compliant NiPdAu lead finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1A | Input of first buffer - connects to upstream 1.8-V logic source (e.g., MCU GPIO or address line). |
| 2 | 1OE | Active-low enable for first buffer - tie high via 10-kΩ resistor to VCC for default disable during power-up. |
| 3 | 2Y | Output of second buffer - drives bidirectional bus segment or downstream load with 3-state control. |
| 4 | GND | Digital ground reference - must be connected to low-impedance system ground plane adjacent to VCC. |
| 5 | GND | Second ground terminal - reduces ground bounce in high-speed switching; shares same net as Pin 4. |
| 6 | 2A | Input of second buffer - accepts independent signal path, enabling dual-channel buffering on single IC. |
| 7 | 2OE | Active-low enable for second buffer - allows asynchronous gating of second channel without affecting first. |
| 8 | VCC | Supply input - decoupled with 0.1-µF ceramic capacitor placed ≤2 mm from pin per TI layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Sub-1-V operability | Functional at 0.8 V - supports emerging ultra-low-power microcontrollers and energy-harvesting systems. |
| 3.6-V I/O tolerance | Withstands 3.6-V inputs while powered at 1.8 V - eliminates level shifters in mixed-voltage memory interfaces. |
| NanoFree™ packaging | Die-as-package construction - reduces parasitic inductance/capacitance for cleaner signal integrity vs. traditional SOIC. |
| Latch-up immunity | Exceeds 100 mA per JESD 78 Class II - ensures reliability in noisy industrial environments with ESD transients. |
| Low dynamic power | 15 pF typical Cpd - limits switching current and radiated emissions in dense portable PCB layouts. |
Applications
| Memory Address Buffering | Low-Voltage Clock Distribution |
|---|---|
Use Scenario: Driving 16-bit address lines from an ARM Cortex-M0+ MCU to external SRAM in a wearable health monitor. IC Role / Device Role / Timing Role: Dual 3-state buffer isolating MCU address bus from SRAM inputs; enables shared bus access with other peripherals. Use Value: 1.8 ns propagation delay ensures setup/hold timing compliance at 25 MHz address strobe rates without added wait states. | Use Scenario: Distributing a 12.288-MHz audio clock from a codec to multiple ADC/DAC channels in a battery-powered voice recorder. IC Role / Device Role / Timing Role: Noninverting driver with independent OE control per channel - synchronizes clock fanout while minimizing skew. Use Value: ±8-mA drive capability sustains signal integrity over 30-mm FR4 traces with <100-ps skew between outputs. |
| Hot-Swappable I/O Expansion | Mixed-Voltage System Interface |
Use Scenario: Enabling/disabling FPGA I/O banks during runtime in a modular test instrument with pluggable daughterboards. IC Role / Device Role / Timing Role: 3-state bus buffer acting as directional gate between FPGA and peripheral modules. Use Value: Ioff protection prevents backfeed current when daughterboard is removed while main board remains powered. | Use Scenario: Interfacing a 1.8-V SoC to legacy 3.3-V EEPROM and UART transceivers in an industrial gateway. IC Role / Device Role / Timing Role: Voltage-tolerant level translator and bus driver - eliminates discrete MOSFET translators. Use Value: 3.6-V I/O rating allows direct connection to 3.3-V devices without external components, reducing BOM count by 4 parts per channel. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G240DCUR | Higher VCC min (1.65 V), lower drive (±24 mA @ 3.3 V), no sub-1-V operation | Requires ≥1.65 V supply; unsuitable for 0.8–1.2 V systems | Select when operating strictly at 3.3 V or 2.5 V with higher drive needs and no sub-1-V requirement. |
| 74AUP2G240DCUR | Lower ICC (5 µA), slower tpd (3.4 ns @ 1.8 V), same VCC range and Ioff | Optimized for ultra-low static power over speed - ideal for always-on sensors | Select when quiescent current <6 µA is critical and 3.4 ns delay is acceptable in the timing budget. |
Compared with SN74LVC2G240DCUR and 74AUP2G240DCUR, the 74AUC2G240DCURG4 uniquely balances sub-1-V operation, 1.8 ns speed, and ±8-mA drive - making it optimal for 1.8-V memory and clock paths where both timing density and voltage flexibility matter.
Availability
74AUC2G240DCURG4 is available at Aetrix Electronics and suitable for memory address buffering, low-voltage clock distribution, and mixed-voltage system interface applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for 74AUC2G240DCURG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The AUC family targets sub-1-V and 1.8-V logic applications, emphasizing speed-power optimization for portable and battery-constrained systems where nanosecond timing and microamp quiescence coexist.
FAQ
What is the minimum supply voltage at which 74AUC2G240DCURG4 guarantees functional operation?
The 74AUC2G240DCURG4 is fully specified from 0.8 V to 2.7 V, with guaranteed operation-including propagation delay, drive strength, and logic thresholds-at 0.8 V. This sub-1-V capability is confirmed in the Recommended Operating Conditions table of the SCES534C datasheet, enabling use with emerging ultra-low-power MCUs and energy-harvesting sources. The 74AUC2G240DCURG4 maintains valid high/low output states and 3-state control across this entire range.
Does 74AUC2G240DCURG4 support hot-swap or partial-power-down modes?
Yes, the 74AUC2G240DCURG4 includes Ioff circuitry that disables all outputs when VCC = 0 V, preventing damaging current backflow from live I/O pins into a powered-down supply rail. This feature is explicitly documented in the Features and Electrical Characteristics sections of the datasheet, and is validated per JESD 78 Class II latch-up testing. The 74AUC2G240DCURG4 thus supports safe hot-plug operation in modular systems.
Can 74AUC2G240DCURG4 safely interface a 1.8-V microcontroller with a 3.3-V EEPROM?
Yes-the 74AUC2G240DCURG4 has 3.6-V I/O tolerance, meaning its inputs and outputs withstand up to 3.6 V regardless of VCC level. When powered at 1.8 V, it can accept 3.3-V signals from the EEPROM and drive 3.3-V logic-high levels (VOH ≥ 2.4 V at IOL = –8 mA) without damage or level-shifting components. This capability is verified in the Absolute Maximum Ratings and Recommended Operating Conditions tables of the SCES534C datasheet.
What is the recommended power-supply decoupling for 74AUC2G240DCURG4 in high-speed designs?
Texas Instruments recommends placing a 0.1-µF X7R ceramic capacitor between VCC (Pin 8) and GND (Pins 4/5), located ≤2 mm from the device, with short, low-inductance traces. This is specified in the Layout Guidelines section of the SCES534C datasheet and validated in TI's board layout examples. For systems with multiple 74AUC2G240DCURG4 devices, add a bulk 4.7-µF tantalum capacitor per 5–10 ICs on the same VCC rail to suppress low-frequency ripple.
How does the pinout of 74AUC2G240DCURG4 differ from the DCT and YZP package variants?
The 74AUC2G240DCURG4 uses the DCU (VSSOP-8) package with identical logical pinout to the DCT (SSOP-8) variant: Pin 1 = 1A, Pin 2 = 1OE, Pin 3 = 2Y, Pin 4 = GND, Pin 5 = GND, Pin 6 = 2A, Pin 7 = 2OE, Pin 8 = VCC. The YZP (NanoFree™ WCSP) variant uses bottom-side bumps with mirrored layout but same signal mapping-confirmed in TI's mechanical drawings SCES534C Figure 1 and Package Outline DCU0008A. No redesign is needed when migrating between DCU and DCT footprints.
74AUC2G240DCURG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AUC
- Package/Case:
- 8-VFSOP (0.091", 2.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 9mA, 9mA
- Voltage - Supply:
- 0.8V ~ 2.7V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-VSSOP
74AUC2G240DCURG4 FAQ
1.How can I place an order for 74AUC2G240DCURG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUC2G240DCURG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUC2G240DCURG4 reliable?
The price and inventory of 74AUC2G240DCURG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUC2G240DCURG4 is usually 5 days.
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Once your 74AUC2G240DCURG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUC2G240DCURG4?
For technical support, including 74AUC2G240DCURG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUC2G240DCURG4 requirements.
6.How does Aetrix verify that 74AUC2G240DCURG4 is sourced from the original manufacturer or authorized distributors?
All 74AUC2G240DCURG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUC2G240DCURG4 meets industry standards.
7.What is the process for return or replacement of 74AUC2G240DCURG4?
All 74AUC2G240DCURG4 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUC2G240DCURG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUC2G240DCURG4 part is unused and in its original packaging.
Return procedure for 74AUC2G240DCURG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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