Diodes Incorporated 74AUP1G00FW4-7

Overview

74AUP1G00FW4-7 from Diodes Incorporated is a single two-input positive NAND gate in X2-DFN1010-6 package, designed for ultra-low-power portable logic applications operating from 0.8V to 3.6V supply. It features IOFF partial power-down protection, ±4 mA output drive at 3.0V, <0.9 µA static ICC, and Schmitt-trigger inputs with ~250 mV hysteresis at 3.0V. It is used in battery-powered mobile devices including smartphones, e-readers, and wearables for signal conditioning and enable control.

For engineers reviewing the 74AUP1G00FW4-7 datasheet, 74AUP1G00FW4-7 pinout, 74AUP1G00FW4-7 application, or 74AUP1G00FW4-7 equivalent, key selection criteria include supply voltage flexibility (0.8–3.6 V), IOFF-enabled system-level power sequencing, low dynamic power (CPD = 6.1 pF at 3.3 V), input hysteresis tolerance for slow-rising signals, and DFN1010 footprint compatibility with space-constrained PCB layouts.

Technical Context

This device implements standard Boolean NAND logic (Y = A·B) using Advanced Ultra Low Power (AUP) CMOS process technology. Its IOFF circuit actively disables outputs during power-down to prevent back-current flow, enabling safe hot-insertion and multi-rail partial-power-down operation.

The Schmitt-trigger inputs provide noise immunity with typical 250 mV hysteresis at VCC = 3.0 V, allowing reliable operation with slow or noisy input edges. Propagation delay ranges from 1.0 ns (typ, 3.3 V, CL = 5 pF) to 2.3 ns (typ, 3.3 V, CL = 30 pF), supporting high-speed logic interfacing within ultra-low-power constraints.

Key Specifications

Pinout & Package

X2-DFN1010-6 (1.0 mm × 1.0 mm × 0.4 mm, 0.35 mm pad pitch) - leadless, bottom-terminal package optimized for high-density portable PCBs with thermal performance θJA = 445 °C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NAND gate applications.

Compared with SN74LVC1G00DBVR and NC7SZ00P5X, the 74AUP1G00FW4-7 uniquely combines sub-1 V operation, IOFF, and Schmitt inputs in a 1.0 mm × 1.0 mm DFN-making it optimal for next-gen ultra-portable designs requiring mixed-voltage safety and noise resilience.

Availability

74AUP1G00FW4-7 is available at Aetrix Electronics and suitable for smartphone power sequencing, wearable sensor interface, tablet display backlight control, and IoT edge node status logic requiring stable component supply across high-mix, low-volume production runs.

Supply support for 74AUP1G00FW4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and precision timing solutions for consumer, industrial, and automotive markets.

The 74AUP logic family targets ultra-low-power portable electronics, delivering nanowatt static consumption and wide-voltage operation to extend battery life in space-constrained devices such as wearables and handhelds.

FAQ

What is the maximum recommended load capacitance for reliable 74AUP1G00FW4-7 operation?

The device is characterized up to 30 pF load capacitance, with typical propagation delay of 2.3 ns at 3.3 V. Driving >30 pF may increase delay nonlinearly and reduce noise margin; for >50 pF loads, consider buffering or selecting a higher-drive variant like 74AUP2G00. Layout best practices (short traces, ground return paths) help maintain signal integrity.

Can Pin 6 (NC) be connected to GND or left floating?

Per Diodes' AP02002 layout guide, Pin 6 is an internal die paddle and must be either left unconnected or tied to GND using a dedicated thermal pad connection-not routed to signal nets. Floating is acceptable if thermal relief is not required; grounding improves thermal dissipation but requires proper solder mask definition to avoid shorting.

Does the 74AUP1G00FW4-7 support mixed-voltage operation between inputs and VCC?

No-inputs must remain within 0 V to VCC. The absolute maximum rating allows VI up to VCC + 0.5 V, but operation outside 0–VCC violates recommended conditions and risks latch-up. For level translation, pair with dedicated translators like NXSL0104 or use resistor-divider networks with Schmitt-buffered receivers.

How does IOFF behave when VCC = 0 V but inputs are pulled to 3.3 V?

IOFF actively disables the output stage, limiting leakage to ≤0.6 µA (max) even with VI = 3.3 V and VCC = 0 V. This prevents back-current into powered-down domains-a critical feature for USB-C port controllers, battery fuel gauges, and multi-rail PMICs where isolated domain sequencing is required.