Nexperia USA Inc. 74AUP1G02GS,132

Overview

74AUP1G02GS,132 from Nexperia is a single 2-input NOR gate in XSON6 package (SOT1202), operating from 0.8 V to 3.6 V supply, featuring Schmitt-trigger inputs for noise immunity, IOFF partial power-down protection, and guaranteed operation from –40 °C to +125 °C. It delivers ultra-low static current (≤1.4 μA max) and propagation delay as low as 0.8 ns at 3.6 V with 5 pF load, enabling use in battery-powered sensor interfaces and level-shifting logic blocks.

For engineers reviewing the 74AUP1G02GS,132 datasheet, 74AUP1G02GS,132 pinout, 74AUP1G02GS,132 application, or 74AUP1G02GS,132 equivalent, this device serves as a low-voltage, low-power combinational logic element where input tolerance, power sequencing robustness, and space-constrained PCB layout are critical selection criteria.

Technical Context

The 74AUP1G02GS implements standard NOR logic (Y = NOT(A OR B)) with Schmitt-trigger inputs that accept slow-rising/falling signals without oscillation, supporting reliable interfacing with mechanical switches or noisy analog-sourced digital signals. Its IOFF circuit actively disables outputs during VCC = 0 V, blocking backflow current in partial power-down systems.

All inputs tolerate up to 3.6 V regardless of VCC, enabling mixed-voltage domain bridging (e.g., 1.8 V logic driving 3.3 V subsystems). The device complies with JEDEC standards JESD8-12 through JESD8-B across its full voltage range and meets HBM ESD rating >5000 V and CDM >1000 V.

Key Specifications

Pinout & Package

XSON6 package (SOT1202): 1.0 mm × 1.0 mm × 0.35 mm body, no leads, 6 terminals, side-wettable flanks not present, thermal pad absent.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input NOR gate applications.

Compared with 74LVC1G02GW,125 and SN74AUP1G02DBVR, the 74AUP1G02GS,132 uniquely combines sub-1-mm² area, Schmitt-trigger robustness, and <1.5 μA max ICC - making it optimal for miniaturized, battery-sensitive, and EMI-prone designs where every nanometer and nanoamp matters.

Availability

74AUP1G02GS,132 is available at Aetrix Electronics and suitable for industrial sensor nodes, automotive body electronics, wearable health monitors, and USB-C power delivery controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 74AUP1G02GS,132 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency-enhancing components - including logic, discretes, MOSFETs, and ESD protection - with manufacturing rooted in process discipline and automotive-grade reliability.

The 74AUP (Advanced Ultra-low Power) logic family targets space- and energy-constrained applications such as portable medical devices, smart sensors, and automotive sub-systems where minimal leakage, wide voltage operation, and robust signal integrity are mandatory.

FAQ

Does the 74AUP1G02GS,132 support true bidirectional signal translation?

No. It is a unidirectional NOR gate with defined input (A, B) and output (Y) terminals. While inputs tolerate 3.6 V irrespective of VCC, the output cannot drive higher-voltage buses without external level-shifting circuitry. Its IOFF feature isolates the output during power-down but does not enable reverse signal flow.

Can Pin 5 (n.c.) be grounded or tied to VCC for improved thermal performance?

No. Pin 5 is internally unconnected and must remain floating per Nexperia's design specification. Connecting it risks internal shorting or parametric shift. Thermal performance relies solely on solder joint quality to the exposed copper pad beneath the package body - no thermal pad or heatsink land is integrated.

What is the minimum recommended PCB pad layout for SOT1202 (XSON6) mounting?

Nexperia specifies a 0.35 mm × 0.35 mm solder paste stencil aperture with 0.1 mm solder mask expansion, centered on each terminal. The GND pad (Pin 3) requires a dedicated 0.4 mm × 0.4 mm thermal relief-connected copper pour. No solder mask opening is needed on the bottom die attach area - the package has no exposed thermal pad.

How does the Schmitt-trigger input affect timing analysis in synchronous designs?

The Schmitt-trigger adds hysteresis (~0.3 V at 1.8 V), which eliminates metastability from slow edges but introduces minor, non-linear propagation delay variation depending on input slew rate. For timing-critical paths, use worst-case tpd values from Table 9 (–40 °C to +125 °C) - not typical values - and verify setup/hold margins with actual board-level rise/fall times.