Diodes Incorporated 74AUP1G07FS3-7

Overview

74AUP1G07FS3-7 from Diodes Incorporated is a single-channel CMOS buffer/driver with open-drain output, designed for level-shifting and wired-OR logic in ultra-low-power portable systems. It operates across 0.8V–3.6V supply, delivers 4 mA sink current at 3.0V, features IOFF partial power-down protection, and includes Schmitt-trigger inputs with ~250 mV hysteresis at VCC = 3.0V - used in smartphone I²C bus pull-up control and sensor interface conditioning.

For engineers reviewing the 74AUP1G07FS3-7 datasheet, 74AUP1G07FS3-7 pinout, 74AUP1G07FS3-7 application, or 74AUP1G07FS3-7 equivalent, key selection criteria include open-drain drive capability, sub-1 µA static ICC, IOFF-enabled system-level power sequencing, and compatibility with 0.8V logic thresholds in battery-constrained designs.

Technical Context

This device implements a positive-buffer Boolean function (Y = A) using advanced ultra-low-power (AUP) CMOS process technology. Its open-drain output requires an external pull-up resistor to define high-state voltage and supports mixed-voltage interfacing between 0.8V and 3.6V domains.

The integrated IOFF circuit disables output leakage when VCC = 0V, preventing back-current flow during partial power-down. Schmitt-trigger inputs tolerate slow-rising signals (≤200 ns/V transition rate), enabling robust operation with RC-filtered or noisy sensor outputs.

Key Specifications

Pinout & Package

X2-DFN0808-4 package: 0.8 mm × 0.8 mm × 0.35 mm body, diamond pad layout, 0.5 mm pad pitch, no leads, bottom thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar open-drain buffer applications.

Compared with SN74LVC1G07DBVR and 74LVC1G17GW,125, the 74AUP1G07FS3-7 uniquely combines ultra-low ICC, IOFF, Schmitt input, and open-drain output in a 0.8 mm × 0.8 mm footprint - making it the only choice for battery-critical, multi-rail, noise-prone sensor interface applications.

Availability

74AUP1G07FS3-7 is available at Aetrix Electronics and suitable for smartphone sensor hubs, wearable battery monitors, and industrial PLC input conditioning requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 74AUP1G07FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The 74AUP logic family targets ultra-low-power portable electronics, delivering sub-1 µA static current and wide VCC operation to extend battery life in space-constrained devices.

FAQ

What is the maximum capacitive load this device can drive reliably?

The 74AUP1G07FS3-7 maintains guaranteed propagation delay up to 30 pF load capacitance. At CL = 30 pF and VCC = 3.3V, tPD is 9.7 ns (max) - sufficient for I²C Fast Mode Plus (1 Mbps) and most GPIO fanout scenarios. For loads exceeding 30 pF, add series resistance to limit slew rate and prevent ringing.

Can this device be used with a 0.8V supply and still meet timing specs?

Yes - at VCC = 0.8V, the device guarantees tPD ≤ 11.6 ns (CL = 5 pF) and supports VIH/VIL thresholds scaled to 0.8×VCC. However, output drive drops to 20 µA, so external pull-up must be ≥100 kΩ to ensure VOL < 0.1V. This mode is intended for ultra-low-power sleep-state signaling, not high-speed data.

Does the IOFF feature work when VCC is disconnected but GND remains connected?

Yes - IOFF activates whenever VCC is below ~0.2V, regardless of GND continuity. With VCC = 0V and GND intact, IOFF limits output leakage to ±0.5 µA max, preventing back-current from powered downstream circuits into the unpowered buffer. This protects both the device and system-level power integrity.

Is the X2-DFN0808-4 package compatible with standard reflow profiles?

Yes - the X2-DFN0808-4 package is rated for IPC-JSTD-020D lead-free reflow (peak 260°C, 20–40 sec above 217°C). Its 0.35 mm height and copper-leadframe construction ensure uniform thermal distribution. Use Type II (SnAgCu) paste and verify solder joint voiding via X-ray if used under thermal cycling stress.