Diodes Incorporated 74AUP1G07FW5-7

Overview

74AUP1G07FW5-7 from Diodes Incorporated is a single-channel CMOS buffer/driver with open-drain output, designed for low-power portable systems operating from 0.8 V to 3.6 V. It delivers 4 mA sink current at 3.0 V, features IOFF partial power-down protection, and incorporates Schmitt-trigger inputs with ~250 mV hysteresis at 3.0 V for robust noise immunity in battery-powered interfaces.

For engineers reviewing the 74AUP1G07FW5-7 datasheet, 74AUP1G07FW5-7 pinout, 74AUP1G07FW5-7 application, or 74AUP1G07FW5-7 equivalent, key selection criteria include ultra-low ICC (<0.9 µA), open-drain flexibility for wired-AND logic and level translation, IOFF-enabled system power sequencing, and DFN1010-6 footprint compatibility with space-constrained mobile PCBs.

Technical Context

This device implements a non-inverting buffer function (Y = A) with open-drain output, requiring an external pull-up resistor to define high-level voltage and logic threshold. Its IOFF circuit actively disables output leakage when VCC = 0 V, preventing back-current flow during partial power-down states in multi-rail systems.

Schmitt-trigger inputs provide defined switching thresholds and hysteresis (~250 mV at VCC = 3.0 V), enabling reliable operation with slow-rising or noisy signals-critical for wake-up lines, reset propagation, and I²C-compatible bus driving where signal integrity is compromised by trace capacitance or EMI.

Key Specifications

Pinout & Package

X1-DFN1010-6 package: 1.0 mm × 1.0 mm × 0.5 mm body, 0.35 mm pad pitch, 6-terminal leadless land-grid array with exposed thermal pad (Type B).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar buffer/driver applications.

Compared with SN74LVC1G07DBVR and 74AHC1G07GW,125, the 74AUP1G07FW5-7 uniquely combines sub-µA quiescent current, Schmitt-trigger noise immunity, IOFF protection, and 1.0 mm² DFN packaging - making it the only choice for space- and energy-constrained portable systems requiring robust signal conditioning.

Availability

74AUP1G07FW5-7 is available at Aetrix Electronics and suitable for mobile device power sequencing, I²C level translation, wearable wake-up interfaces, and industrial reset distribution requiring stable component supply across high-mix, low-volume production runs.

Supply support for 74AUP1G07FW5-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and precision timing solutions for consumer, industrial, and automotive markets.

The 74AUP logic family targets ultra-low-power portable electronics, delivering extended battery life through sub-µA static current and wide-voltage operation while maintaining robust noise immunity and system-level safety features like IOFF.

FAQ

What is the purpose of the NC pin on the 74AUP1G07FW5-7?

Pin 4 is a no-connect terminal with no internal bond wire or silicon connection. It must remain unconnected in the PCB layout - neither tied to VCC nor GND - to avoid unintended parasitic coupling or thermal stress. Diodes Incorporated specifies this pin as NC in all package variants to maintain mechanical symmetry and manufacturability of the X1-DFN1010-6 body.

Can the 74AUP1G07FW5-7 drive an LED directly?

Yes - at VCC = 3.0 V, it can sink up to 4 mA, sufficient for indicator LEDs with forward voltage ≤2.8 V and series resistance ≥50 Ω. However, the open-drain output requires the LED anode to connect to a positive rail (e.g., 3.3 V) and cathode to Y, with current limited externally. Do not exceed IOL ratings or operate outside recommended VCC range.

How does IOFF protect the device during partial power-down?

When VCC drops to 0 V, the IOFF circuit disables both input and output buffers, limiting leakage current to ±0.5 µA maximum. This prevents current from flowing backward through the output into a powered-down VCC rail or from a live input into the unpowered IC, avoiding damage to upstream drivers or unintended activation of downstream loads.

Is the exposed thermal pad on the X1-DFN1010-6 electrically connected?

Yes - the exposed pad is internally connected to GND and serves as both a thermal conduction path and part of the ESD discharge network. It must be soldered to a dedicated PCB thermal pad tied to the main ground plane using at least four thermal vias (0.3 mm diameter, spaced evenly) to ensure compliance with JEDEC JESD51-7 thermal testing and maintain specified θJA = 435 °C/W.