Diodes Incorporated 74AUP1G125FS3-7

Overview

74AUP1G125FS3-7 from Diodes Incorporated is a single non-inverting buffer gate with 3-state output, designed for ultra-low-power portable systems operating from 0.8V to 3.6V. It delivers ±4mA drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs (250mV hysteresis at 3.0V) for robust noise immunity in battery-powered interfaces.

For engineers reviewing the 74AUP1G125FS3-7 datasheet, 74AUP1G125FS3-7 pinout, 74AUP1G125FS3-7 application, or 74AUP1G125FS3-7 equivalent, this device supports low-voltage bus buffering, level translation between mixed-supply domains, and power-gated subsystem isolation in space-constrained mobile and embedded designs.

Technical Context

This AUP-family CMOS buffer implements a single-channel, non-inverting logic path with active-low output enable (OE), entering high-impedance state when OE = HIGH. Its IOFF circuit actively disables outputs during power-down, preventing backflow current into unpowered rails - critical for hot-swap and multi-rail sequencing.

The input stage integrates Schmitt-trigger action (typical 250mV hysteresis at VCC = 3.0V), enabling reliable operation with slow-rising signals and noisy environments. Propagation delay ranges from 1.2ns (tpd, 3.3V, CL = 5pF) to 8.3ns (tdis, 1.8V, CL = 30pF), supporting timing-critical signal conditioning without external hysteresis components.

Key Specifications

Pinout & Package

X2-DFN0808-4 package: 0.8mm × 0.8mm × 0.35mm body, diamond pad layout, 0.5mm pad pitch, no leads, bottom thermal pad not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-state buffer applications.

Compared with the 74AUP1G125FS3-7, the Nexperia alternative offers identical performance and footprint compatibility, while the Toshiba part sacrifices IOFF protection and drive strength - making it unsuitable for dynamic power-gating scenarios despite lower unit cost.

Availability

74AUP1G125FS3-7 is available at Aetrix Electronics and suitable for mobile device power management, low-power sensor interface, wearable display control, and USB-C port logic isolation requiring stable component supply and long-term lifecycle support.

Supply support for 74AUP1G125FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The 74AUP1G125FS3-7 belongs to the Advanced Ultra Low Power (AUP) logic family, engineered specifically for extended battery life and robust operation in portable, wearable, and IoT edge devices.

FAQ

What is the maximum recommended load capacitance for stable operation?

The device is characterized up to 30pF load capacitance across all supply voltages and temperature ranges. At 3.3V and CL = 30pF, tpd remains ≤8.3ns and tdis ≤13.1ns - within guaranteed timing margins. Exceeding 30pF may increase propagation delay nonlinearly and risk setup/hold violations in synchronous systems.

Can the 74AUP1G125FS3-7 be used with 0.8V logic inputs while powered at 3.3V?

Yes. The input voltage range is -0.5V to VCC + 0.5V, and VIH/VIL thresholds scale with VCC. At 3.3V supply, VIH(min) = 2.0V and VIL(max) = 0.9V, so 0.8V inputs fall safely within the guaranteed LOW state - enabling direct connection to sub-1V controllers without level shifting.

Does the X2-DFN0808-4 package require thermal vias under the exposed pad?

No. The X2-DFN0808-4 variant has no thermal pad; its thermal resistance (θJA = 430°C/W) is defined for standard FR-4 with minimum recommended copper pads per AP02001. Thermal vias are unnecessary and may compromise solder joint reliability due to uneven heating during reflow.

How does IOFF behavior differ from standard high-impedance state?

IOFF actively disables both input and output circuitry when VCC = 0, limiting leakage to ±0.5µA regardless of applied signal voltages. Standard 3-state only disconnects the output driver; IOFF prevents current flow *into* powered-down ICs - essential for safe interconnection of live and unpowered subsystems.