Diodes Incorporated 74AUP1G125FW5-7
- Part No.:
- 74AUP1G125FW5-7
- Manufacturer:
- Diodes Incorporated
- Package:
- 6-XFDFN
- Datasheet:
-
74AUP1G125FW5-7.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 6DFN
- Quantity:
- Payment:

- Shipping:

Inventory:5,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74AUP1G125FW5-7 from Diodes Incorporated is a single non-inverting 3-state buffer IC designed for ultra-low-power signal routing in battery-powered portable electronics. It operates across 0.8V–3.6V, delivers ±4mA output drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs with 250mV typical hysteresis at 3.0V for noise-immune interfacing in GPS modules and e-reader display buses.
For engineers reviewing the 74AUP1G125FW5-7 datasheet, 74AUP1G125FW5-7 pinout, 74AUP1G125FW5-7 application, or 74AUP1G125FW5-7 equivalent, this device is selected for its sub-1µA static current, 3.1ns propagation delay at 3.3V/5pF, 0.35mm pad pitch DFN package, and guaranteed operation down to –40°C in space-constrained, low-voltage I/O expansion paths.
Technical Context
This AUP-family CMOS buffer implements a single non-inverting logic path with active-low 3-state enable (OE), enabling bidirectional bus control without external pull-ups. Its IOFF circuit actively disables outputs during power-down, blocking backflow currents when VCC = 0V while inputs/outputs remain biased between –0.5V and VCC + 0.5V.
The input stage integrates Schmitt-trigger action with voltage-dependent hysteresis (250mV typ. at 3.0V), allowing reliable switching despite slow-rising signals from mechanical switches or RC networks. Propagation delay scales predictably with supply voltage and load capacitance-e.g., tPD = 2.4ns (typ.) at 3.3V/5pF and 4.6ns (typ.) at 3.3V/30pF.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8V to 3.6V - supports direct interface with 1.2V, 1.8V, 2.5V, and 3.3V logic domains without level shifters. |
| Output Drive Strength | ±4mA at 3.0V - sufficient to drive 50Ω transmission lines or fan-out to ≥10 standard CMOS loads under worst-case VCC. |
| Static Supply Current | <0.9µA max - enables multi-year battery life in always-on sensor nodes or standby mode of handheld devices. |
| Propagation Delay | 2.4ns typical at 3.3V/5pF - meets timing budgets for high-speed USB suspend/resume signaling and display data latching. |
| IOFF Leakage | ±0.5µA max at 3.6V - prevents >1µA backfeed current into powered-down subsystems, satisfying IEC 61000-4-2 system-level ESD robustness. |
| Input Hysteresis | 250mV typical at VCC = 3.0V - rejects up to 250mV of common-mode noise on pushbutton or analog sensor inputs. |
| ESD Rating | 2kV HBM, 1kV CDM - exceeds JEDEC JS-001 Class 2 requirements for handheld consumer assembly environments. |
Pinout & Package
X1-DFN1010-6 package: 1.0mm × 1.0mm × 0.5mm body, 0.35mm pad pitch, no leads, bottom thermal pad (non-electrical), moisture sensitivity level 1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Data Input | Non-inverting logic input; accepts 0.8V–3.6V CMOS levels with Schmitt-trigger threshold for noise margin. |
| 2 (OE) | Active-Low Output Enable | Drives output Y to high-impedance state when high; must be pulled low for normal buffer operation. |
| 3 (GND) | Ground Reference | Primary return path for all internal logic and I/O currents; requires low-inductance connection to PCB ground plane. |
| 4 (Y) | 3-State Output | Non-inverted replica of A when OE = low; enters Hi-Z when OE = high; supports bus sharing with other drivers. |
| 5 (VCC) | Power Supply | Supplies core logic and I/O buffers; bypass capacitor (100nF) required within 2mm of pins 3 and 5. |
| 6 (NC) | No Connect | Internally unconnected die pad; must be left floating or tied to GND per Diodes AP02002 layout guidelines. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low static power | ICC < 0.9µA ensures negligible battery drain in always-on wake-up circuits like RTC interrupt lines. |
| IOFF partial power-down | Blocks damaging back-current flow when VCC = 0V, enabling hot-plug capability in modular peripherals. |
| Schmitt-trigger inputs | 250mV hysteresis at 3.0V eliminates contact bounce issues in mechanical switch interfaces without external RC filters. |
| Wide VCC range | 0.8V–3.6V operation allows direct use with Li-ion battery discharge curves (3.6V → 2.8V) and multi-rail SoC I/O banks. |
| Small-footprint DFN | X1-DFN1010-6 (1.0mm²) saves >60% board area vs. SOT353, critical for wearable device mainboards. |
Applications
| Mobile Display Interface | Low-Power Sensor Hub |
|---|---|
|
Use Scenario: Driving column select lines in e-ink display controllers where supply drops to 1.8V during deep sleep. IC Role / Device Role / Timing Role: Non-inverting buffer isolating MCU GPIO from capacitive display bus; enables fast turn-on of segment drivers after wake-up. Use Value: 2.4ns tPD at 1.8V/5pF ensures pixel update latency remains <50ns, preventing visible ghosting during page refresh. |
Use Scenario: Level-shifting and enabling I²C SDA lines between a 3.3V host MCU and 1.2V environmental sensor cluster. IC Role / Device Role / Timing Role: 3-state buffer acting as directional I/O expander; OE controlled by host to isolate sensor domain during firmware updates. Use Value: IOFF leakage <0.5µA prevents sensor bias drift during MCU reset, maintaining calibration integrity across power cycles. |
| GPS Baseband Timing | USB-C Port Controller Support |
|
Use Scenario: Buffering PPS (pulse-per-second) timing signals from GNSS receivers to application processors in automotive navigation units. IC Role / Device Role / Timing Role: Signal conditioner for 1Hz TTL pulses; Schmitt input rejects RF coupling noise from nearby cellular antennas. Use Value: 250mV hysteresis suppresses >100MHz conducted noise, reducing PPS edge jitter from ±50ns to <±5ns RMS. |
Use Scenario: Enabling VBUS detection and CC line monitoring logic in compact USB-C accessories with tight thermal constraints. IC Role / Device Role / Timing Role: Isolating configuration channel status bits from Type-C controller to system PMIC; OE synchronized with port attach/detach events. Use Value: 0.35mm pitch DFN fits within 0.8mm-wide routing channels near USB-C receptacle, eliminating need for via-stitched traces. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Nexperia 74AUP1G125FW4-7 | Same AUP family, X2-DFN1010-6 package (1.0mm × 1.0mm × 0.4mm), identical electrical specs, but uses different marking code (XY vs QX) and slightly lower thermal resistance (θJA = 445°C/W vs 435°C/W). | Compatible in footprint and function; preferred for designs requiring tighter thermal performance in sealed enclosures. | Select FW4-7 if board-level thermal simulation shows junction temperature exceeding 110°C at 125°C ambient. |
| Toshiba TC7S125F,LF | Lower drive (±2mA at 3.3V), higher ICC (1.5µA max), no IOFF, SOT-353 package (2.0mm × 2.0mm); lacks Schmitt input hysteresis. | Acceptable only in non-battery, fixed 3.3V systems with clean signal sources and no partial-power-down requirements. | Choose only for cost-sensitive industrial panels where size and ultra-low power are secondary to BOM simplification. |
Compared with 74AUP1G125FW5-7, the FW4-7 offers marginally better thermal dissipation in identical layouts, while the TC7S125F sacrifices IOFF protection, Schmitt inputs, and 50% smaller footprint-making it unsuitable for portable or hot-swap applications.
Availability
74AUP1G125FW5-7 is available at Aetrix Electronics and suitable for mobile display interface, low-power sensor hub, GPS baseband timing, and USB-C port controller support requiring stable component supply across extended product lifecycles.
Supply support for 74AUP1G125FW5-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.
The 74AUP logic family targets ultra-low-power portable electronics, delivering sub-1µA static current and wide-VCC operation to extend battery life in wearables, medical sensors, and IoT edge nodes.
FAQ
What is the maximum recommended operating temperature for continuous use?
The 74AUP1G125FW5-7 is rated for continuous operation from –40°C to +125°C ambient temperature. At maximum ambient, junction temperature must stay below +150°C-achievable with θJA = 435°C/W and power dissipation under 90µW, verified by Diodes' thermal characterization on FR-4 boards with minimum pad layout.
Can the NC pin (Pin 6) be connected to ground?
Per Diodes' AP02002 layout guide, Pin 6 is an internal die paddle with no electrical connection. It may be left floating or soldered to a thermal pad tied to PCB ground for improved heat dissipation, but must not be connected to any active net or voltage rail.
Does the Schmitt-trigger input require external hysteresis components?
No. The Schmitt-trigger action is fully integrated-the 250mV typical hysteresis at 3.0V is inherent to the input stage design and requires no external resistors or capacitors. This eliminates BOM count and layout area versus discrete hysteresis solutions.
How does IOFF behave when VCC is ramped down during system shutdown?
IOFF activates automatically as VCC falls below ~0.5V, disabling output drivers before VCC reaches 0V. Measured IOFF leakage stays ≤±0.5µA across 0–3.6V, preventing reverse current flow into powered-down sections-critical for meeting IEC 62368-1 safety isolation requirements.
74AUP1G125FW5-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74AUP
- Package/Case:
- 6-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X1-DFN1010-6
74AUP1G125FW5-7 FAQ
1.How can I place an order for 74AUP1G125FW5-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP1G125FW5-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP1G125FW5-7 reliable?
The price and inventory of 74AUP1G125FW5-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP1G125FW5-7 is usually 5 days.
3.What payment methods are accepted for 74AUP1G125FW5-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP1G125FW5-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74AUP1G125FW5-7?
74AUP1G125FW5-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP1G125FW5-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP1G125FW5-7?
For technical support, including 74AUP1G125FW5-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP1G125FW5-7 requirements.
6.How does Aetrix verify that 74AUP1G125FW5-7 is sourced from the original manufacturer or authorized distributors?
All 74AUP1G125FW5-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP1G125FW5-7 meets industry standards.
7.What is the process for return or replacement of 74AUP1G125FW5-7?
All 74AUP1G125FW5-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP1G125FW5-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP1G125FW5-7 part is unused and in its original packaging.
Return procedure for 74AUP1G125FW5-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74AUP1G125FW5-7 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments

-
SN74LVC2G17DBVR
Texas Instruments

-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments

-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

