Diodes Incorporated 74AUP1G125FZ4-7

Overview

74AUP1G125FZ4-7 from Diodes Incorporated is a single non-inverting buffer gate with 3-state output, designed for ultra-low-power portable systems operating from 0.8V to 3.6V. It delivers ±4mA drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs (250mV hysteresis at 3.0V) for robust noise immunity in battery-powered interfaces.

For engineers reviewing the 74AUP1G125FZ4-7 datasheet, 74AUP1G125FZ4-7 pinout, 74AUP1G125FZ4-7 application, or 74AUP1G125FZ4-7 equivalent, this device serves as a voltage-scalable, low-leakage bus driver for I²C, SPI, and GPIO expansion in space-constrained mobile and embedded designs where static current <0.9µA and dynamic CPD = 6.3pF are critical.

Technical Context

This AUP-family CMOS buffer implements a single-channel, non-inverting logic path with active-low 3-state enable (OE), enabling bidirectional bus control without external pull-ups. Its IOFF circuit actively disables outputs during power-down, blocking backflow currents up to ±20mA when VCC = 0V.

Schmitt-trigger inputs provide defined switching thresholds across the full 0.8–3.6V supply range, ensuring reliable operation with slow-rising signals (≤200 ns/V transition rate). Propagation delay is 2.4ns typical at 3.3V/CL=5pF, and enable/disable times are 2.4ns/3.9ns respectively under same conditions.

Key Specifications

Pinout & Package

X2-DFN1410-6 package: 1.4mm × 1.0mm × 0.4mm body, 0.5mm pad pitch, exposed thermal pad, RoHS-compliant leadless construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-state buffer applications.

Compared with SN74LVC1G125DBVR and NC7SZ125P5X, the 74AUP1G125FZ4-7 uniquely combines sub-1V operation, IOFF, Schmitt inputs, and <0.9µA ICC - making it irreplaceable in energy-harvesting sensors and multi-rail portable SoC designs requiring zero-cross-domain leakage.

Availability

74AUP1G125FZ4-7 is available at Aetrix Electronics and suitable for mobile device power management, IoT sensor node interface, industrial PLC I/O expansion, and USB-C port controller support requiring stable component supply across extended temperature ranges (–40°C to +125°C).

Supply support for 74AUP1G125FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and precision timing solutions for consumer, industrial, and automotive markets.

The 74AUP1G125FZ4-7 belongs to the Advanced Ultra Low Power (AUP) logic family, engineered specifically for battery-constrained portable electronics where nanowatt static power, wide-VCC compatibility, and robust IO behavior are mandatory design requirements.

FAQ

What is the minimum supply voltage for guaranteed operation of the 74AUP1G125FZ4-7?

The device is fully specified from 0.8V to 3.6V. At 0.8V, propagation delay is 20.6ns (CL=5pF), input thresholds scale to 0.8×VCC, and output drive drops to ±20µA - sufficient for ultra-low-power wake-up signaling and sensor polling in energy-harvesting systems.

How does the IOFF feature protect the device during partial power-down?

When VCC = 0V and any input or output pin is driven to 3.6V, the IOFF circuit disables internal output transistors, limiting leakage to ±0.2µA maximum. This prevents destructive reverse current flow into the unpowered VCC rail, satisfying JEDEC JESD78 latch-up immunity requirements.

Can the 74AUP1G125FZ4-7 drive a 50Ω transmission line directly?

Yes - at 3.0V supply, its ±4mA output drive supports 50Ω termination (VOL ≈ 0.31V, VOH ≈ 2.67V), enabling point-to-point routing without external series resistors in compact high-speed GPIO or clock fanout applications up to 50MHz.

Is the X2-DFN1410-6 package compatible with standard reflow profiles?

Yes - the package is rated for JEDEC J-STD-020D MSL3 handling and withstands peak reflow temperatures up to 260°C. Its 0.5mm pad pitch and exposed thermal pad require controlled solder paste volume (120–140µm stencil) and symmetric heating to ensure void-free GND connection.