Diodes Incorporated 74AUP1G126SE-7

Overview

74AUP1G126SE-7 from Diodes Incorporated is a single non-inverting buffer gate with 3-state output, designed for ultra-low-power portable systems operating from 0.8V to 3.6V. It delivers ±4mA drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs (250mV hysteresis at 3.0V) for noise immunity in battery-powered GPS receivers and e-readers.

For engineers reviewing the 74AUP1G126SE-7 datasheet, 74AUP1G126SE-7 pinout, 74AUP1G126SE-7 application, or 74AUP1G126SE-7 equivalent, this device supports voltage-level translation across mixed-supply domains, enables bus isolation in low-voltage microcontroller peripherals, and meets stringent leakage requirements (<0.9µA ICC, <0.5µA IOFF) for always-on sensor interfaces.

Technical Context

This AUP-family CMOS buffer implements a single-channel, non-inverting logic path with active-high output enable (OE), entering high-impedance state when OE = LOW. Its IOFF circuit actively disables I/Os during power-down, blocking reverse current flow between powered and unpowered rails.

Schmitt-trigger inputs provide robust noise rejection for slow-rising signals (e.g., mechanical switch debouncing or RC-filtered sensor outputs), while propagation delay ranges from 1.4ns (3.3V, CL=5pF) to 4.4ns (3.3V, CL=30pF), ensuring timing predictability across supply and load variations.

Key Specifications

Pinout & Package

SOT353 package: 2.0mm × 2.0mm × 1.1mm body, 0.65mm lead pitch, 5-pin surface-mount outline with exposed pad not present.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-state buffer applications.

Compared with SN74LVC1G126DBVR and 74LX1G126STR, the 74AUP1G126SE-7 uniquely combines sub-1µA ICC, 0.8V operation, IOFF, and Schmitt inputs - making it the sole choice for battery-constrained, mixed-voltage, noise-prone embedded subsystems.

Availability

74AUP1G126SE-7 is available at Aetrix Electronics and suitable for mobile device power management, IoT sensor hub interface, portable display backlight control, and USB-C port configuration channel applications requiring stable component supply across extended product lifecycles.

Supply support for 74AUP1G126SE-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.

The 74AUP1G126SE-7 belongs to the Advanced Ultra Low Power (AUP) logic family, engineered specifically for extended battery life and robust operation in space-constrained portable electronics with multi-voltage architectures.

FAQ

What is the maximum recommended capacitive load for stable 74AUP1G126SE-7 operation?

The device is characterized up to 30pF load capacitance, with propagation delay increasing from 1.4ns (CL=5pF) to 4.4ns (CL=30pF) at 3.3V. For designs exceeding 30pF, add series termination or verify timing margins using worst-case tpd values from Table 6 of DS35158 Rev. 5-2, as excessive capacitance may cause output ringing or increased power dissipation.

Can 74AUP1G126SE-7 safely interface between 1.2V and 3.3V logic domains?

Yes - its 0.8V–3.6V supply range and Schmitt-trigger inputs allow direct connection to 1.2V outputs (VIH min = 0.8×VCC = 0.96V at 1.2V) and reliable recognition of 3.3V signals (VIL max = 0.3×3.3V = 0.99V). No external level shifter is needed when VCC = 1.2V or 3.3V, provided OE and A are referenced to the same VCC rail.

Does the SOT353 package support reflow soldering per J-STD-020?

Yes - the SOT353 package is rated for standard lead-free reflow profiles (peak 260°C, 20–40s above 217°C). Thermal resistance θJA = 371°C/W confirms suitability for moderate-power-density layouts; ensure minimum 2oz copper thermal pads and follow Diodes' AP02002 pad layout for void-free solder joints and mechanical reliability.

How does IOFF behavior differ from standard high-impedance output during power-down?

IOFF actively disables both input and output circuitry when VCC = 0V, limiting leakage to ±0.5µA regardless of applied I/O voltages. Standard 3-state buffers without IOFF allow uncontrolled current flow through parasitic diodes when external signals are present on powered-down pins - risking damage or system instability in partial-power-down scenarios.