Diodes Incorporated 74AUP1G17FW4-7

Overview

74AUP1G17FW4-7 from Diodes Incorporated is a single-channel Schmitt-trigger buffer IC in X2-DFN1010-6 package, operating from 0.8V to 3.6V supply, delivering ±4mA output drive at 3.0V, with hysteresis of 790mV (typ) at V_CC = 3.0V and I_CC < 0.9µA - designed for noise-immune signal conditioning in ultra-low-power portable systems.

For engineers reviewing the 74AUP1G17FW4-7 datasheet, 74AUP1G17FW4-7 pinout, 74AUP1G17FW4-7 application, or 74AUP1G17FW4-7 equivalent, this device serves as a rail-to-rail input/output logic buffer with IOFF-enabled partial power-down capability, critical for battery-powered wearables, sensor interfaces, and always-on subsystems requiring robust edge detection and leakage control.

Technical Context

This CMOS Schmitt-trigger buffer implements positive Boolean logic (Y = A) with asymmetric input thresholds: VT+ = 1.61V and VT− = 0.88V at 3.0V supply, yielding 730mV–1.31V hysteresis across temperature. Its IOFF circuit actively disables outputs during power-down, limiting backflow current to ±0.2µA (max) when V_I/V_O = 0V–3.6V.

Propagation delay is load- and voltage-dependent: t_PD = 2.7ns (typ) at 3.3V/5pF, degrading to 4.9ns at 3.3V/30pF; input capacitance is 1.5pF, and power dissipation capacitance C_PD is 6.1pF (3.3V), enabling predictable dynamic power estimation in high-frequency digital interfaces.

Key Specifications

Pinout & Package

X2-DFN1010-6 package: 1.0mm × 1.0mm × 0.4mm body, 0.35mm pad pitch, exposed thermal pad (no internal connection), RoHS-compliant, halogen-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Compared with SN74LVC1G17DBVR and 74LVC1G17GW,125, the 74AUP1G17FW4-7 uniquely combines sub-1µA static current, 0.8V operation, and IOFF in a 1.0mm² DFN - making it the only choice for coin-cell-powered devices requiring both ultra-low quiescent power and robust multi-rail isolation.

Availability

74AUP1G17FW4-7 is available at Aetrix Electronics and suitable for wearable electronics, battery-powered IoT sensors, and portable medical devices requiring stable component supply with guaranteed long-term manufacturability and RoHS compliance.

Supply support for 74AUP1G17FW4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power, and thermally optimized components for consumer, industrial, and automotive markets.

The 74AUP logic family targets ultra-low-power portable electronics, emphasizing extended battery life, wide supply flexibility, and robust noise immunity - directly addressing design constraints in wearables, hearables, and energy-harvesting systems.

FAQ

Can 74AUP1G17FW4-7 operate reliably at 0.85V supply?

Yes - the datasheet specifies full functionality down to 0.8V, including guaranteed VT+ and VT− thresholds, propagation delay (19.0ns max at 0.8V/5pF), and IOFF operation. At 0.85V, output drive drops to ±20µA, sufficient for high-impedance inputs like MCU GPIOs or comparators, but insufficient for driving transmission lines or LEDs directly.

What is the maximum capacitive load this buffer can drive while maintaining timing specs?

The datasheet characterizes t_PD up to 30pF load. At 3.3V, delay increases from 2.7ns (5pF) to 6.2ns (30pF). For loads >30pF, delay becomes unpredictable and output rise/fall times degrade; external series termination or a second-stage buffer is recommended beyond this limit to maintain signal integrity.

Is the exposed thermal pad on the X2-DFN1010-6 package electrically connected?

No - the exposed pad is a thermal relief structure only, with no internal electrical connection to any die node. It must be soldered to a PCB copper pour for thermal performance (θ_JA improves from 445°C/W to ~300°C/W with 250mm² 2oz copper), but must not be tied to V_CC, GND, or any signal net.

How does IOFF behave when V_CC is ramping during power-up?

IOFF activates only when V_CC is near 0V (typically <0.2V). During power-up, the output remains high-impedance until V_CC exceeds ~0.4V, then transitions to active drive. This prevents glitching but requires external pull-up/down on Y if defined state is needed before V_CC stabilizes.