Diodes Incorporated 74AUP1G32FS3-7
- Part No.:
- 74AUP1G32FS3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Gates and Inverters
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
74AUP1G32FS3-7.pdf
- Description:
- IC GATE OR 1CH 2-INP DFN0808-4
- Quantity:
- Payment:

- Shipping:

Inventory:9,467
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Product details
Overview
74AUP1G32FS3-7 from Diodes Incorporated is a single 2-input positive OR gate in an ultra-low-power AUP CMOS logic family, operating from 0.8V to 3.6V supply, delivering ±4mA output drive at 3.0V, with IOFF partial power-down protection and Schmitt-trigger inputs (250mV hysteresis at 3.0V), deployed in battery-powered portable electronics such as e-readers and GPS navigation devices.
For engineers reviewing the 74AUP1G32FS3-7 datasheet, 74AUP1G32FS3-7 pinout, 74AUP1G32FS3-7 application, or 74AUP1G32FS3-7 equivalent, key selection criteria include its 0.8–3.6V VCC range, sub-1µA ICC static current, 2.1ns typical propagation delay at 3.3V/CL=5pF, IOFF-enabled system-level power sequencing, and X2-DFN0808-4 footprint compatibility with space-constrained PCB layouts.
Technical Context
This device implements the Boolean function Y = A + B using advanced ultra-low-power CMOS process technology, supporting full rail-to-rail input/output swing across its 0.8V–3.6V operating range. Its Schmitt-trigger inputs provide 250mV hysteresis at VCC = 3.0V, enabling robust noise immunity for slow-rising or noisy control signals in portable systems.
The IOFF circuit actively disables output leakage during partial power-down states, limiting VI/O backflow to ≤0.6µA over –40°C to +125°C, while maintaining latch-up immunity >100mA per JESD78 Class I. It is fully specified for mixed-voltage interfacing with TTL- and CMOS-compatible logic families.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8V to 3.6V - enables direct interface with 1.2V, 1.8V, 2.5V, and 3.3V logic domains without level shifters |
| ICC (Static) | < 0.9µA max at +25°C - extends battery life in always-on sensor or wake-up circuitry |
| IOH/IOL Drive | ±4mA at VCC = 3.0V - sufficient to drive multiple standard CMOS loads or small LED indicators |
| tpd (Typical) | 2.1ns at VCC = 3.3V, CL = 5pF - supports high-speed signal routing in compact timing-critical paths |
| VIH/VIL Thresholds | VIL ≤ 0.3×VCC, VIH ≥ 0.65×VCC - ensures reliable logic recognition across full voltage range and temperature |
| IOFF Leakage | ≤ 0.6µA at –40°C to +125°C - prevents unintended current paths when upstream/downstream rails are powered off |
| ESD Rating | 2kV HBM, 1kV CDM - meets industrial handling requirements without external protection components |
Pinout & Package
X2-DFN0808-4 package: 0.8mm × 0.8mm × 0.35mm body, 0.5mm diamond pad pitch, bottom-side thermal pad, no leads - optimized for minimal PCB area and high-density routing in wearables and IoT edge nodes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Input | First OR operand; Schmitt-triggered for noise immunity on slow or noisy control lines |
| 2 (B) | Input | Second OR operand; electrically identical to Pin 1, supports independent signal sources |
| 3 (GND) | Ground Reference | Return path for all internal logic and output currents; must be low-impedance for stable operation |
| 4 (Y) | Output | Push-pull OR result; drives high/low actively without external pull-ups or pull-downs |
| 5 (NC) | No Connect | Internally unconnected; must remain floating or grounded per layout guidelines - not usable as thermal pad |
| 6 (VCC) | Supply Voltage | Primary power rail; decoupling capacitor (≥100nF) required within 2mm for noise suppression |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Ultra Low Power (AUP) CMOS | Reduces dynamic power by minimizing CPD (6.3pF typical) and static ICC (<0.9µA), critical for multi-year battery operation |
| IOFF Partial Power-Down Support | Disables output stage when VCC = 0V, preventing back-current flow into powered subsystems during staged shutdown |
| Schmitt-Trigger Inputs | 250mV hysteresis at 3.0V eliminates false triggering from slow edges or EMI in mechanical switch interfaces or sensor outputs |
| Wide Supply Range (0.8V–3.6V) | Eliminates need for separate voltage regulators in multi-rail designs - compatible with Li-ion, coin-cell, and USB-supplied systems |
| Lead-Free & Halogen-Free Construction | Fully RoHS-compliant (≤900ppm Br+Cl, ≤1000ppm Sb) - satisfies environmental compliance for global consumer electronics shipments |
Applications
| Smartphone Power Sequencing | Wearable Sensor Hub Logic |
|---|---|
Use Scenario: Coordinating power-up order of RF, display, and MCU subsystems during cold boot. IC Role / Device Role / Timing Role: OR gate combines reset signals from multiple PMICs to generate unified system enable. Use Value: IOFF prevents backfeed between partially powered rails; 0.8V operation allows use with buck converter standby outputs. | Use Scenario: Debouncing and combining motion-interrupt and heart-rate-alert signals before waking the host MCU. IC Role / Device Role / Timing Role: Positive OR merges asynchronous event flags with Schmitt-triggered inputs rejecting EMI from nearby antennas. Use Value: Sub-1µA ICC extends coin-cell lifetime beyond 2 years; 2.1ns tpd ensures timely wake-up response. |
| Industrial Handheld Terminal | Bluetooth Audio Remote Control |
Use Scenario: Enabling communication interface only when both battery voltage and firmware validation pass. IC Role / Device Role / Timing Role: OR gate validates dual safety conditions before releasing UART enable to modem IC. Use Value: Wide VCC range accommodates aging battery (down to 0.8V); latch-up immunity >100mA protects against field-induced transients. | Use Scenario: Merging button-press and voice-activation triggers to initiate Bluetooth connection sequence. IC Role / Device Role / Timing Role: Single-gate OR provides glitch-free wake signal to BLE SoC's interrupt input. Use Value: 0.5mm pitch DFN footprint saves space on <10mm² PCBs; ESD rating eliminates need for external TVS diodes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 2-input OR gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G32DBVR | Higher ICC (1µA typ), narrower VCC range (1.65–5.5V), no IOFF or Schmitt inputs | Requires external level shifting below 1.65V; unsuitable for partial power-down systems | Select when interfacing exclusively with 3.3V/5V logic and board space permits larger SOT-23-5 |
| 74AHC1G32SE-7 | Higher drive (±8mA), higher CPD (15pF), no IOFF, same 2.0×2.0mm SOT353 package | Lacks power-down isolation; better suited for high-speed fanout, not battery-sensitive designs | Choose for cost-sensitive, non-battery applications needing stronger drive and legacy SOT-353 assembly |
Compared with SN74LVC1G32DBVR and 74AHC1G32SE-7, the 74AUP1G32FS3-7 uniquely balances ultra-low ICC, wide VCC scalability, and IOFF protection - making it the only option qualified for long-life, multi-rail, and partial-power-down embedded systems.
Availability
74AUP1G32FS3-7 is available at Aetrix Electronics and suitable for battery-powered portable electronics, low-voltage sensor interfaces, and space-constrained IoT edge nodes requiring stable component supply and long-term lifecycle support.
Supply support for 74AUP1G32FS3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for consumer, industrial, and automotive markets.
The 74AUP logic family targets ultra-low-power portable applications, with design emphasis on extended battery life, mixed-voltage interoperability, and robustness in thermally constrained environments.
FAQ
What is the maximum recommended operating temperature for 74AUP1G32FS3-7?
The device is rated for continuous operation from –40°C to +125°C ambient temperature, with junction temperature up to +150°C. Thermal resistance θJA is 430°C/W for the X2-DFN0808-4 package, so derating is required above 85°C ambient if power dissipation exceeds ~10mW - verified via thermal simulation or IR imaging under actual load conditions.
Can Pin 5 (NC) be used as a thermal pad or grounded for improved heat dissipation?
No - Pin 5 is internally unconnected and must remain floating or be left un-soldered per Diodes' AP02001 layout guidelines. The X2-DFN0808-4 package has no exposed thermal pad; heat dissipation relies solely on copper traces connected to Pins 3 (GND) and 6 (VCC). Adding solder to Pin 5 risks shorting adjacent pads or compromising reliability.
Does the 74AUP1G32FS3-7 support mixed-voltage operation where A and B inputs are driven from different supply domains?
Yes - inputs tolerate VI from 0V to VCC + 0.5V, allowing A and B to originate from different voltage rails (e.g., 1.8V and 3.3V) as long as both remain within the absolute maximum rating (–0.5V to VCC + 0.5V) and do not exceed VCC + 0.5V. Output swing remains rail-to-rail relative to its own VCC.
How does the Schmitt-trigger input affect timing behavior compared to a standard CMOS input?
The 250mV hysteresis at VCC = 3.0V increases effective input noise margin but adds negligible delay - propagation delay (tpd) values in the datasheet already include Schmitt-trigger latency. Input transition rate ∆t/∆V is specified up to 200 ns/V, meaning rise/fall times slower than 600ns (for 3V swing) still guarantee clean switching without oscillation or metastability.
74AUP1G32FS3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74AUP
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- OR Gate
- Number of Circuits:
- 1
- Number of Inputs:
- 2
- Features:
- -
- Voltage - Supply:
- 0.8V ~ 3.6V
- Current - Quiescent (Max):
- 500 nA
- Current - Output High, Low:
- 4mA, 4mA
- Input Logic Level - Low:
- 0.7V ~ 0.9V
- Input Logic Level - High:
- 1.6V ~ 2V
- Max Propagation Delay @ V, Max CL:
- 6.4ns @ 3.3V, 30pF
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN0808-4
74AUP1G32FS3-7 FAQ
1.How can I place an order for 74AUP1G32FS3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP1G32FS3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP1G32FS3-7 reliable?
The price and inventory of 74AUP1G32FS3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP1G32FS3-7 is usually 5 days.
3.What payment methods are accepted for 74AUP1G32FS3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP1G32FS3-7 transactions.
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4.How is shipping managed for 74AUP1G32FS3-7?
74AUP1G32FS3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP1G32FS3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP1G32FS3-7?
For technical support, including 74AUP1G32FS3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP1G32FS3-7 requirements.
6.How does Aetrix verify that 74AUP1G32FS3-7 is sourced from the original manufacturer or authorized distributors?
All 74AUP1G32FS3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP1G32FS3-7 meets industry standards.
7.What is the process for return or replacement of 74AUP1G32FS3-7?
All 74AUP1G32FS3-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP1G32FS3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP1G32FS3-7 part is unused and in its original packaging.
Return procedure for 74AUP1G32FS3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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