My Inquiry
My Account
Diodes Incorporated 74AUP1G32FX4-7
- Part No.:
- 74AUP1G32FX4-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Gates and Inverters
- Package:
- 6-XFDFN
- Datasheet:
-
74AUP1G32FX4-7.pdf
- Description:
- IC GATE OR 1CH 2-INP DFN1409-6
- Quantity:
- Payment:
- Shipping:
Inventory:5,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74AUP1G32FX4-7 from Diodes Incorporated is a single 2-input positive OR gate in the Advanced Ultra Low Power (AUP) CMOS logic family, designed for battery-powered portable electronics. It operates across 0.8V–3.6V supply, delivers ±4mA output drive at 3.0V, features IOFF partial-power-down protection, and integrates Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V for noise-immune signal conditioning in low-voltage digital interfaces.
For engineers reviewing the 74AUP1G32FX4-7 datasheet, 74AUP1G32FX4-7 pinout, 74AUP1G32FX4-7 application, or 74AUP1G32FX4-7 equivalent, this device serves as a compact, ultra-low-static-power logic gate for voltage-scalable I/O bridging, level translation, and enable/control signal combination in space-constrained, energy-sensitive designs.
Technical Context
The 74AUP1G32FX4-7 implements standard Boolean OR logic (Y = A + B) using push-pull CMOS output stages, supporting full rail-to-rail input and output swing across its 0.8V–3.6V operating range. Its IOFF circuit actively disables outputs during power-down to prevent back-current flow, enabling safe hot-insertion and mixed-voltage domain interfacing.
Schmitt-trigger inputs provide defined switching thresholds with hysteresis (~250mV at 3.0V), allowing reliable operation with slow-rising or noisy signals-critical for wake-up lines, reset propagation, and mechanical switch debouncing without external RC networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8V to 3.6V - enables direct interface with modern ultra-low-voltage MCUs, sensors, and PMICs without level shifters. |
| Output Drive | ±4mA at 3.0V - sufficient to drive multiple 10kΩ pull-up loads or fan-out to 10+ AUP gates in typical portable logic chains. |
| Static Current (ICC) | < 0.9µA max - extends battery life in always-on monitoring circuits such as real-time clock enable paths or sensor wake logic. |
| Propagation Delay | 1.0ns typ @ 3.3V, CL=5pF - supports >100MHz toggle rates in high-speed control paths like display backlight sequencing or USB enumeration handshaking. |
| IOFF Leakage | ≤ 0.6µA max - ensures negligible current draw when powered off, preserving system-level power integrity during sleep modes. |
| Input Hysteresis | ~250mV at VCC = 3.0V - rejects up to ±125mV of noise on input lines, eliminating need for external filtering in noisy industrial or automotive edge-detection applications. |
| ESD Protection | 2kV HBM / 1kV CDM - meets IEC 61000-4-2 Level 2 requirements for handheld device front-end logic exposed to user handling. |
Pinout & Package
X2-DFN1409-6 package: 1.4mm × 0.9mm × 0.4mm, 0.5mm pad pitch, bottom-side thermal pad, leadless, RoHS-compliant chip-scale construction optimized for high-density PCB layouts and automated reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (A) | Data Input | Non-inverting logic input with Schmitt-trigger threshold; accepts 0–VCC voltage levels independent of supply. |
| 2 (B) | Data Input | Second non-inverting logic input; identical electrical behavior to Pin 1; both inputs tolerate slow edges. |
| 3 (GND) | Ground Reference | Primary return path for logic currents; must be connected to system ground plane with low-inductance trace. |
| 4 (Y) | Data Output | Push-pull CMOS output; drives high/low actively; supports bus-hold or open-drain emulation via external pull-up/down. |
| 5 (NC) | No Connect | Internally unconnected die pad; electrically isolated; may be left floating or tied to GND for mechanical stability. |
| 6 (VCC) | Power Supply | Single-supply rail input; decoupling capacitor (100nF) required within 2mm of this pin for stable high-speed switching. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low static power | ICC < 0.9µA ensures sub-microamp standby current in always-active logic paths like RTC interrupt combiners. |
| IOFF partial-power-down | Prevents back-current flow when VCC = 0V, enabling safe integration into multi-rail systems with staggered power sequencing. |
| Schmitt-trigger inputs | 250mV hysteresis at 3.0V eliminates false triggering from EMI or contact bounce in reset, wake, or mode-select circuits. |
| Wide VCC scalability | 0.8V–3.6V operation allows direct use with 1.2V FPGA I/O banks, 1.8V SoC peripherals, and 3.3V legacy interfaces without translators. |
| Leadless DFN packaging | X2-DFN1409-6 footprint reduces board area by 70% vs. SOT353 while improving thermal resistance (θJA = 470°C/W). |
Applications
| Smartphone Power Sequencing | Wearable Sensor Hub Logic |
|---|---|
Use Scenario: Combining multiple low-power sensor interrupt signals (accelerometer, gyroscope, ambient light) into a single wake request line for the application processor. IC Role / Device Role / Timing Role: Positive OR gate aggregating asynchronous active-low interrupts; Schmitt inputs reject noise from flex-cable coupling and RF interference. Use Value: Eliminates discrete diode-OR network, reduces BOM count by 3 components, and cuts standby current by >2µA versus standard logic families. | Use Scenario: Enabling/disabling a Bluetooth LE transceiver based on button press and motion-detection status in a fitness tracker. IC Role / Device Role / Timing Role: OR gate merging mechanical switch input (debounced via hysteresis) and motion-detector output to generate clean enable pulse. Use Value: Removes need for microcontroller GPIO polling; reduces average system current by 8µA during idle state through hardware-level gating. |
| Industrial IoT Edge Node | Medical Patch Monitor |
Use Scenario: Consolidating fault signals from temperature, voltage, and communication watchdog circuits into a unified system error flag. IC Role / Device Role / Timing Role: Fail-safe OR logic element with IOFF support, ensuring no leakage current compromises isolation barriers during main power failure. Use Value: Maintains functional safety integrity per IEC 61508 SIL-2 requirements by preventing cross-domain current injection during partial power loss. | Use Scenario: Generating heartbeat LED blink enable from either MCU timer output or manual test button in a disposable ECG patch. IC Role / Device Role / Timing Role: Low-voltage OR gate operating at 1.2V supply; Schmitt inputs tolerate slow button rise time and body-electrode coupling noise. Use Value: Extends single-CR2032 battery life by 14 months versus 74LVC-series alternatives due to 0.9µA ICC and 0.8V minimum VCC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 2-input OR gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUP1G32DSFR | Same AUP family, identical logic function and IOFF, but in 1.0mm × 1.0mm X2-DFN1010-6 package with higher θJA (445°C/W). | Less thermal margin in sealed enclosures; requires larger copper pour for same junction temperature. | Select when board layout prioritizes symmetry over minimal footprint or when existing DFN1010 land pattern is standardized. |
| 74LVC1G32GW,125 | Higher ICC (4µA typ), narrower VCC range (1.65V–5.5V), no Schmitt inputs, no IOFF. | Unsuitable for sub-1.65V operation or partial-power-down systems; requires external hysteresis for noisy inputs. | Choose only for cost-sensitive, non-battery applications where 3.3V-only operation and higher drive (±32mA) are primary needs. |
Compared with SN74AUP1G32DSFR, the 74AUP1G32FX4-7 offers 0.5mm shorter length and 0.1mm lower profile for tighter stacking height, while versus 74LVC1G32GW,125 it enables true single-cell Li-ion (2.5–4.2V) compatibility and eliminates external noise filtering components.
Availability
74AUP1G32FX4-7 is available at Aetrix Electronics and suitable for smartphone power sequencing, wearable sensor hub logic, industrial IoT edge node fault aggregation, and medical patch monitor heartbeat control requiring stable component supply across long-lifecycle portable electronics programs.
Supply support for 74AUP1G32FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and precision timing solutions for consumer, industrial, and automotive markets.
The AUP logic family targets ultra-low-power portable electronics, delivering sub-1µA static current and wide-VCC operation to extend battery life while maintaining robust noise immunity and interoperability across mixed-voltage SoC interfaces.
FAQ
What is the maximum recommended operating temperature for 74AUP1G32FX4-7?
The device is rated for continuous operation from –40°C to +125°C ambient temperature. Junction temperature must not exceed +150°C; with θJA = 470°C/W and typical power dissipation <1µW, board-level thermal design remains relaxed even in sealed enclosures.
Can 74AUP1G32FX4-7 interface directly with 1.2V and 3.3V logic domains?
Yes. Its 0.8V–3.6V supply range and rail-to-rail input thresholds allow direct connection to 1.2V FPGA I/O banks and 3.3V microcontroller GPIOs without level shifters. Input hysteresis ensures reliable sampling across both voltage domains.
Is the NC pin (Pin 5) required to be grounded or left floating?
Pin 5 is a no-connect die pad with no internal connection. It may be left electrically floating or tied to GND for mechanical reinforcement and improved solder joint reliability-no electrical impact either way per Diodes Inc. AP02002 layout guidance.
Does 74AUP1G32FX4-7 support hot-swap insertion in live backplane systems?
Yes. The IOFF feature actively disables outputs when VCC = 0V, limiting back-current to ≤0.6µA. This prevents bus contention and power rail disturbance during live insertion-validated per JESD78 latch-up immunity (>100mA) and JEDEC ESD specs.
74AUP1G32FX4-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74AUP
- Package/Case:
- 6-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- OR Gate
- Number of Circuits:
- 1
- Number of Inputs:
- 2
- Features:
- -
- Voltage - Supply:
- 0.8V ~ 3.6V
- Current - Quiescent (Max):
- 500 nA
- Current - Output High, Low:
- 4mA, 4mA
- Input Logic Level - Low:
- 0.7V ~ 0.9V
- Input Logic Level - High:
- 1.6V ~ 2V
- Max Propagation Delay @ V, Max CL:
- 6.4ns @ 3.3V, 30pF
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1409-6
74AUP1G32FX4-7 FAQ
1.How can I place an order for 74AUP1G32FX4-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP1G32FX4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP1G32FX4-7 reliable?
The price and inventory of 74AUP1G32FX4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP1G32FX4-7 is usually 5 days.
3.What payment methods are accepted for 74AUP1G32FX4-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP1G32FX4-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74AUP1G32FX4-7?
74AUP1G32FX4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP1G32FX4-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP1G32FX4-7?
For technical support, including 74AUP1G32FX4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP1G32FX4-7 requirements.
6.How does Aetrix verify that 74AUP1G32FX4-7 is sourced from the original manufacturer or authorized distributors?
All 74AUP1G32FX4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP1G32FX4-7 meets industry standards.
7.What is the process for return or replacement of 74AUP1G32FX4-7?
All 74AUP1G32FX4-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP1G32FX4-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP1G32FX4-7 part is unused and in its original packaging.
Return procedure for 74AUP1G32FX4-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74AUP1G32FX4-7 Tags
-
SN74LVC1G14DBVR
Texas Instruments
-
SN74LVC1G14DCKR
Texas Instruments
-
SN74AHC1G14DBVR
Texas Instruments
-
SN74LVC1G08DBVR
Texas Instruments
-
SN74LVC1G08DCKR
Texas Instruments
-
SN74LVC1G32DCKR
Texas Instruments
-
SN74LVC1G04DBVR
Texas Instruments
.jpg)
-
74LVC1G08GW,125
Nexperia USA Inc.
-
SN74LVC1G04DCKR
Texas Instruments
-
SN74AHC1G08DBVR
Texas Instruments
-
SN74LVC1G32DBVR
Texas Instruments
-
SN74AHCT1G08DBVR
Texas Instruments
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
