Diodes Incorporated 74AUP1G34FX4-7

Overview

74AUP1G34FX4-7 from Diodes Incorporated is a single non-inverting buffer gate in the Advanced Ultra Low Power (AUP) CMOS logic family, designed for signal conditioning and level translation in battery-powered portable electronics. It operates across 0.8V–3.6V supply, delivers ±4mA output drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V - enabling robust interfacing in noisy or slow-rising input environments such as sensor interface and microcontroller I/O expansion.

For engineers reviewing the 74AUP1G34FX4-7 datasheet, 74AUP1G34FX4-7 pinout, 74AUP1G34FX4-7 application, or 74AUP1G34FX4-7 equivalent, this device is selected for ultra-low static current (<0.9µA), wide-voltage compatibility, and chip-scale packaging (X2-DFN1409-6, 1.4mm × 0.9mm) in space-constrained, energy-sensitive designs including wearables, IoT edge nodes, and portable medical monitors.

Technical Context

This buffer implements a positive Boolean function (Y = A) with push-pull CMOS output stage and Schmitt-trigger input thresholding - eliminating need for external hysteresis components in slow-slew applications. Its IOFF circuit actively disables output leakage during partial power-down, preventing backflow current when VCC is unpowered while other system rails remain active.

Designed for operation from -40°C to +125°C, it supports dynamic switching up to 3.2ns propagation delay (typical, CL = 5pF, VCC = 3.3V), with input transition rate tolerance up to 200 ns/V. The X2-DFN1409-6 package provides thermal resistance θJA = 470°C/W on standard FR-4 PCBs, optimized for minimal footprint without compromising thermal performance in high-density layouts.

Key Specifications

Pinout & Package

X2-DFN1409-6 is a 6-pin chip-scale package (1.4mm × 0.9mm × 0.4mm, 0.5mm pad pitch), leadless and RoHS-compliant, with exposed thermal pad (not electrically connected). Pin 1 is marked by a circular fiducial on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar single-buffer gate applications.

Compared with SN74LVC1G34DBVR, the 74AUP1G34FX4-7 enables true sub-1V operation and safe partial power-down, while its chip-scale package reduces board area by 42% versus the X1-DFN1010-6 alternative - making it optimal for size- and energy-constrained portable designs.

Availability

74AUP1G34FX4-7 is available at Aetrix Electronics and suitable for wearable electronics, IoT edge nodes, portable medical monitors, and smart home sensor gateways requiring stable component supply across extended product lifecycles.

Supply support for 74AUP1G34FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and logic solutions for power management, signal integrity, and connectivity applications.

The 74AUP1G34 belongs to the Advanced Ultra Low Power (AUP) logic family, engineered specifically for extended battery life and reliable operation in portable, energy-harvesting, and always-on edge devices.

FAQ

What is the maximum recommended load capacitance for stable operation?

The device is characterized up to 30pF load capacitance, with propagation delay increasing predictably (e.g., 7.2ns max at 3.3V/30pF). For reliable timing margins in high-speed applications, keep total node capacitance ≤15pF - including PCB trace, probe, and downstream input capacitance - to maintain sub-5ns delay and avoid overshoot.

Can Pin 3 (NC) and Pin 5 (NC) be grounded for mechanical stability?

Yes - both NC pins are unconnected internally and may be tied to GND on the PCB to improve solder joint reliability and thermal dissipation. No electrical impact occurs, and Diodes Incorporated's AP02001 pad layout guide explicitly recommends grounding unused pads in DFN packages for manufacturability.

Does the Schmitt trigger apply to both rising and falling edges?

Yes - the Schmitt-trigger input provides symmetric hysteresis (~250mV at 3.0V) for both rising and falling transitions, ensuring consistent noise rejection regardless of edge direction. This eliminates false triggering on bidirectional bus lines or switch bounce in either polarity.

Is the X2-DFN1409-6 package compatible with standard reflow profiles?

Yes - the package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 and supports standard lead-free reflow profiles (peak 260°C, 60s above 217°C). Its 0.4mm height and copper-leadframe construction ensure uniform thermal distribution and minimal warpage during assembly.