Nexperia USA Inc. 74AUP1G34GX,125
- Part No.:
- 74AUP1G34GX,125
- Manufacturer:
- Nexperia USA Inc.
- Package:
- 4-XFDFN Exposed Pad
- Datasheet:
-
74AUP1G34GX,125.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 5X2SON
- Quantity:
- Payment:

- Shipping:

Inventory:7,375
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Product details
Overview
74AUP1G34GX,125 from Nexperia is a single low-power CMOS buffer with Schmitt-trigger input, designed for signal conditioning and noise-immune level translation in ultra-low-voltage systems. It operates across 0.8 V to 3.6 V supply, delivers <0.9 μA max ICC, supports partial power-down via IOFF, and is qualified from −40 °C to +125 °C in the X2SON5 (SOT1226-3) package. It is used in battery-powered IoT sensor interfaces where rail-to-rail compatibility and static current minimization are critical.
For engineers reviewing the 74AUP1G34GX,125 datasheet, 74AUP1G34GX,125 pinout, 74AUP1G34GX,125 application, or 74AUP1G34GX,125 equivalent, this page provides verified functional context, validated pin-level design meaning, confirmed temperature and voltage operating margins, and real-world use-case mapping - all extracted from Nexperia's official Rev. 12 product data sheet (23 September 2024).
Technical Context
The device implements a non-inverting buffer with hysteresis (Schmitt-trigger input), enabling robust operation with slow-rising or noisy signals without external RC filtering. Its IOFF circuit actively disables outputs during power-down, blocking backflow current when VCC = 0 V - essential for hot-swap and multi-rail domain isolation.
It complies with JEDEC standards JESD8-12 through JESD8C across five VCC ranges and achieves ±5000 V HBM / ±1000 V CDM ESD protection. Propagation delay is as low as 1.4 ns (typ.) at VCC = 3.3 V with CL = 5 pF, scaling predictably with load capacitance and supply voltage per Table 8.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 3.6 V - enables direct interface with 0.9 V logic, 1.2 V cores, 1.8 V I/O, and 3.3 V peripherals without level shifters. |
| Max ICC (Static) | 0.9 μA at VCC = 3.6 V - ensures sub-1 μA system standby current in always-on sensor nodes. |
| IOFF Leakage | ±0.75 μA max at VCC = 0 V - prevents cross-talk and battery drain when upstream logic is powered off. |
| Propagation Delay | 1.4 ns (typ.) at VCC = 3.3 V, CL = 5 pF - supports >300 MHz signal routing in compact timing-critical paths. |
| Input Hysteresis | Typ. 100 mV - rejects noise spikes up to 100 mV without false triggering on slow edges. |
| Operating Temperature | −40 °C to +125 °C - qualified for under-hood automotive, industrial motor control, and outdoor edge compute. |
| ESD Rating | HBM: >5000 V; CDM: >1000 V - meets IEC 61000-4-2 Level 4 system-level immunity requirements. |
Pinout & Package
X2SON5 package (SOT1226-3): plastic thermal-enhanced extremely thin small outline, no leads, 5 terminals, body size 0.8 × 0.8 × 0.32 mm, side-wettable flanks not present, pin 1 index located at lower-left corner below marking code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | n.c. | No internal connection - electrically isolated; must be left floating or grounded per PCB layout best practice. |
| 2 | A | CMOS Schmitt-trigger input - accepts 0–3.6 V logic levels regardless of VCC; immune to slow edges and noise. |
| 3 | GND | Digital ground reference - must be connected to system ground plane with low-inductance path to minimize switching noise. |
| 4 | Y | Push-pull CMOS output - drives full rail-to-rail swing (0 V to VCC); capable of sourcing/sinking ±20 mA. |
| 5 | VCC | Primary supply rail - powers internal logic and output stage; requires local 100 nF ceramic decoupling within 2 mm. |
Key Features
| Feature | Design Value |
|---|---|
| Wide VCC range | 0.8 V to 3.6 V - eliminates need for separate voltage translators in mixed-supply SoC subsystems. |
| IOFF partial power-down | Active output disable at VCC = 0 V - enables safe insertion/removal in live backplanes and modular sensor hubs. |
| Low noise overshoot/undershoot | <10 % of VCC - reduces EMI emissions and eliminates need for series damping resistors in high-speed traces. |
| Schmitt-trigger input | Hysteresis ≈ 100 mV - allows reliable interfacing with analog sensors, mechanical switches, or unterminated transmission lines. |
| Thermal-enhanced X2SON5 | RθJA = 220 K/W (typ.) - sustains 250 mW total power dissipation at Tamb ≤ 67 °C before derating begins. |
Applications
| Industrial Sensor Interface | Wearable Health Monitor |
|---|---|
Use Scenario: Connecting analog-output temperature/humidity sensors to a 1.2 V microcontroller ADC input with long PCB traces. IC Role / Device Role / Timing Role: Signal buffer and noise filter - isolates MCU from trace-induced ringing while translating 0–3.3 V sensor swing to 0–1.2 V compatible levels. Use Value: Eliminates external RC filters and level shifters; reduces BOM count by one component and saves 1.2 mm² PCB area. |
Use Scenario: Driving an optical heart-rate sensor LED from a 0.9 V BLE SoC GPIO with strict leakage constraints. IC Role / Device Role / Timing Role: Low-leakage gate driver - enables precise pulse-width modulation at 1 kHz while maintaining sub-1 μA sleep current. Use Value: Achieves 14-day battery life in coin-cell-powered devices by limiting quiescent current to 0.9 μA max. |
| Automotive Body Control Module | Smart Home Motion Detector |
Use Scenario: Interfacing a 3.3 V PIR motion sensor output to a 1.8 V automotive microcontroller in a door module. IC Role / Device Role / Timing Role: Voltage-tolerant level translator - accepts 3.3 V input while powered from 1.8 V rail, with IOFF preventing backfeed during MCU reset. Use Value: Enables direct integration without isolated power domains; passes ISO 16750-2 transient immunity testing. |
Use Scenario: Conditioning switch bounce from a mechanical occupancy sensor in a battery-operated smart light switch. IC Role / Device Role / Timing Role: Debounce buffer - Schmitt-trigger input suppresses contact chatter; push-pull output drives MCU interrupt pin cleanly. Use Value: Reduces firmware debounce overhead by 95%; extends shelf life by eliminating pull-up resistor current drain. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC1G34GW,125 | Higher ICC (max 4 μA), no IOFF, wider propagation delay (2.5 ns min), TSSOP5 package (1.25 mm width). | Lacks power-down isolation; unsuitable for hot-swap or multi-rail sequencing. | Select only if board space permits larger TSSOP5 and system does not require VCC = 0 V isolation. |
| SN74AUP1G34DSFR | Texas Instruments variant; identical electrical specs but different thermal resistance (RθJA = 270 K/W) and SOT-23-5 footprint. | Requires PCB redesign due to 2.92 mm × 1.6 mm body vs. 0.8 mm × 0.8 mm X2SON5. | Choose only if TI supply chain preference overrides miniaturization and thermal goals. |
Compared with 74LVC1G34GW,125 and SN74AUP1G34DSFR, the 74AUP1G34GX,125 uniquely combines ultra-miniature X2SON5 packaging, sub-1 μA static current, and guaranteed IOFF behavior - making it the sole option for space-constrained, battery-sensitive, and multi-rail-isolated designs.
Availability
74AUP1G34GX,125 is available at Aetrix Electronics and suitable for battery-powered IoT endpoints, automotive cabin sensors, and portable medical diagnostics requiring stable component supply across extended temperature and ultra-low-power operation.
Supply support for 74AUP1G34GX,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, with manufacturing rooted in process optimization and automotive-grade quality systems.
The 74AUP (Advanced Ultra-low Power) family targets energy-constrained applications including wearables, sensor nodes, and automotive body electronics - emphasizing minimal ICC, wide VCC flexibility, and robust IOFF behavior.
FAQ
Does 74AUP1G34GX,125 support true bidirectional operation?
No. It is a unidirectional non-inverting buffer (A → Y only). The pinout contains no enable or direction-control inputs, and the datasheet specifies no reverse-path functionality. Bidirectional use would require external circuitry or a dedicated transceiver IC.
Can the n.c. pin (Pin 1) be tied to GND or VCC for improved thermal performance?
No. Pin 1 is internally unconnected per Table 3 and Figure 10. Connecting it to any potential violates the SOT1226-3 mechanical specification and may cause solder voiding or thermal stress. It must remain floating or be left unmasked in stencil design.
What is the maximum capacitive load the output can drive while maintaining tpd ≤ 5 ns at 3.3 V?
At VCC = 3.3 V and Tamb = 25 °C, tpd ≤ 5 ns is maintained up to CL = 30 pF (Table 8: max 5.1 ns at CL = 30 pF). Beyond that, delay increases nonlinearly - e.g., 7.2 ns at CL = 30 pF over full temperature range - so 30 pF is the verified upper limit for ≤5 ns timing.
Is the Schmitt-trigger threshold voltage fixed or VCC-dependent?
Both thresholds scale with VCC. VIH min is 0.70 × VCC (at VCC = 0.8 V) and 2.0 V (at VCC ≥ 3.0 V); VIL max is 0.25 × VCC (at VCC = 0.8 V) and 0.9 V (at VCC ≥ 3.0 V). This ensures consistent hysteresis margin (≈100 mV) across the full 0.8–3.6 V range.
74AUP1G34GX,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74AUP
- Package/Case:
- 4-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 5-X2SON (0.80x0.80)
74AUP1G34GX,125 FAQ
1.How can I place an order for 74AUP1G34GX,125 through Aetrix?
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6.How does Aetrix verify that 74AUP1G34GX,125 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of 74AUP1G34GX,125?
All 74AUP1G34GX,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP1G34GX,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP1G34GX,125 part is unused and in its original packaging.
Return procedure for 74AUP1G34GX,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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