Diodes Incorporated 74AUP1G57FZ4-7

Overview

74AUP1G57FZ4-7 from Diodes Incorporated is a single 3-input configurable multiple-function logic gate in X2-DFN1410-6 package, supporting AND, OR, NAND, NOR, XNOR, inverter, and non-inverting buffer functions via input configuration. It operates from 0.8V to 3.6V, delivers ±4mA output drive at 3.0V, features Schmitt-trigger inputs (950mV typical hysteresis at V_CC = 3.0V), and supports IOFF partial power-down mode. It is used in battery-powered portable electronics for voltage-level shifting and signal conditioning.

For engineers reviewing the 74AUP1G57FZ4-7 datasheet, 74AUP1G57FZ4-7 pinout, 74AUP1G57FZ4-7 application, or 74AUP1G57FZ4-7 equivalent, key selection criteria include its ultra-low static current (IC < 0.9µA), 3.0V output drive capability, 0.5mm pitch DFN package footprint, Schmitt-trigger noise immunity, and mixed-voltage I/O tolerance up to 3.6V.

Technical Context

The 74AUP1G57 implements a programmable 3-input truth table with eight possible output states determined by A/B/C inputs-enabling functional reconfiguration without external components. Its Schmitt-trigger inputs provide robust noise rejection on slow-rising/falling signals, with hysteresis ranging from 0.07V (0.8V supply) to 1.31V (3.0V supply).

IOFF circuitry actively disables the output during power-down, preventing back-current flow when V_CC = 0V while inputs remain biased at 0–3.6V. The device complies with JESD78 Class I latch-up (>100mA) and exceeds 2000V HBM ESD protection, making it suitable for portable systems requiring high reliability under dynamic supply conditions.

Key Specifications

Pinout & Package

X2-DFN1410-6 package: 1.4mm × 1.0mm × 0.4mm body, 0.5mm lead pitch, wettable flank terminals, RoHS-compliant and halogen-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar configurable logic gate applications.

Compared with SN74LVC1G57DBVR and NC7SZ57P6X, the 74AUP1G57FZ4-7 uniquely combines sub-1µA static current, Schmitt-trigger noise immunity, and IOFF-enabled power-domain isolation-all in a 1.4×1.0mm DFN, making it optimal for space-constrained, battery-critical designs.

Availability

74AUP1G57FZ4-7 is available at Aetrix Electronics and suitable for smartphone power sequencing, wearable sensor interface, and USB-C port controller logic requiring stable component supply across high-mix, low-volume production runs.

Supply support for 74AUP1G57FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and logic solutions for consumer, computing, communications, and industrial markets.

The 74AUP1G57 belongs to the Advanced Ultra Low-Power (AUP) logic family, designed specifically for battery-operated portable electronics requiring extended runtime, mixed-voltage interoperability, and robust noise immunity in compact form factors.

FAQ

Can the 74AUP1G57FZ4-7 operate reliably at 0.8V supply?

Yes. The device is fully characterized from 0.8V to 3.6V, with guaranteed propagation delay (≤14.4ns at 0.8V, CL=5pF) and output drive (≥±20µA). Input thresholds scale with V_CC, maintaining correct logic interpretation across the full range.

How does the IOFF feature behave when V_CC is disconnected?

When V_CC = 0V, the IOFF circuit disables the output driver, limiting leakage to ±0.6µA maximum even if inputs or outputs are biased at 0–3.6V. This prevents current backflow into unpowered sections of the system, satisfying IEC 61000-4-2 and JEDEC JESD78 requirements.

What is the recommended PCB pad layout for X2-DFN1410-6?

Use Diodes' AP02001 suggested footprint: 0.25mm wide × 0.30mm long solder pads, 0.35mm spacing between pad centers, with thermal relief vias under the exposed pad. Avoid solder mask defined (SMD) pads; use non-solder-mask-defined (NSMD) for reliable reflow and inspection.

Does the Schmitt-trigger action affect timing analysis?

Yes. Propagation delays include hysteresis-related transition stabilization time. At V_CC = 3.0V, t_pd increases by ~0.3ns versus non-Schmitt equivalents-but this is offset by elimination of external filtering and guaranteed monotonic edge response, simplifying timing closure in noisy environments.