Nexperia USA Inc. 74AUP1T00GXH

Overview

74AUP1T00GXH from Nexperia is a single 2-input NAND gate IC with integrated voltage-level translation, designed for bidirectional logic interfacing between 1.8 V and 2.5/3.3 V domains. It operates across 2.3 V–3.6 V supply, delivers ≤1.5 μA max ICC, features Schmitt-trigger inputs for noise immunity, and supports partial power-down via IOFF circuitry. It is used in battery-powered IoT sensor nodes requiring robust low-voltage signal conditioning.

For engineers reviewing the 74AUP1T00GXH datasheet, 74AUP1T00GXH pinout, 74AUP1T00GXH application, or 74AUP1T00GXH equivalent, key selection criteria include its 2.3–3.6 V supply range, 1.8 V input compatibility, IOFF-enabled power sequencing, Schmitt-trigger hysteresis (0.15–0.56 V), and X2SON5 thermal-enhanced packaging for space-constrained PCBs.

Technical Context

This device implements a single NAND logic function with dual-voltage domain capability: inputs accept up to 3.6 V while operating from 2.3–3.6 V VCC, enabling direct interface between 1.8 V controllers and 2.5/3.3 V peripherals. Its IOFF circuit actively disables outputs during power-down to prevent backfeed current, satisfying IEC 61000-4-2 ESD requirements (HBM >5 kV, CDM >1 kV).

The Schmitt-trigger input structure provides hysteresis (0.15–0.56 V) across full temperature (–40 °C to +125 °C) and supply ranges, ensuring reliable switching with slow-rising signals. Propagation delay is as low as 1.0 ns (typ.) at 3.6 V with 5 pF load, while static current remains ≤3.5 μA over full industrial temperature range.

Key Specifications

Pinout & Package

X2SON5 package (SOT1226-3): 0.8 mm × 0.8 mm × 0.32 mm body, 5-terminal no-lead thermal-enhanced outline with exposed die pad for improved heat dissipation in high-density layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-input NAND gate with level translation applications.

Compared with SN74LVC1G00DBVR and 74LVC1G00GW, the 74AUP1T00GXH uniquely combines 1.8 V input acceptance, IOFF-enabled power sequencing, and Schmitt-trigger noise rejection in a 0.64 mm² X2SON5 footprint-making it the sole option for compact, battery-operated systems demanding robust mixed-voltage interoperability.

Availability

74AUP1T00GXH is available at Aetrix Electronics and suitable for industrial sensor interfaces, wearable power management, automotive body control modules, and medical diagnostic ports requiring stable component supply across extended temperature and voltage ranges.

Supply support for 74AUP1T00GXH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert specializing in high-performance, energy-efficient logic, analog, and discrete components, with leadership in automotive-grade reliability and miniaturized packaging.

The 74AUP (Advanced Ultra-low Power) product line targets battery-powered and thermally constrained applications, delivering sub-microamp static current and enhanced ESD robustness without sacrificing speed or logic functionality.

FAQ

Does 74AUP1T00GXH support true bidirectional level translation?

No. The 74AUP1T00GXH is a unidirectional NAND gate with 1.8 V–compatible inputs and CMOS outputs referenced to VCC. It translates low-voltage inputs to higher-voltage outputs but cannot pass signals from VCC domain back to 1.8 V side without external circuitry.

What is the maximum capacitive load the Y output can drive reliably?

The Y output is characterized up to 30 pF load capacitance with guaranteed tpd performance (e.g., 1.5–11.9 ns depending on VCC and VI). Driving >30 pF may increase propagation delay unpredictably and risk signal integrity; use a buffer stage for heavier loads.

Can GND and VCC pins be swapped during PCB layout?

No. Swapping GND (Pin 3) and VCC (Pin 5) will cause immediate device failure due to reverse biasing of internal ESD diodes and core logic. The pin 1 indicator (lower-left corner below marking code "5a") must align with the PCB silkscreen orientation mark.

Is the X2SON5 package compatible with standard reflow profiles?

Yes. The SOT1226-3 (X2SON5) package is qualified for IPC/JEDEC J-STD-020D reflow, supporting peak temperatures up to 260 °C. Its thermal-enhanced construction requires no special stencil design beyond standard 0.15 mm thickness for the 0.32 mm height profile.