Nexperia USA Inc. 74AUP1T17GXH

Overview

74AUP1T17GXH from Nexperia is a single-channel low-power buffer with Schmitt-trigger inputs and voltage-level translation capability, designed for bidirectional logic interfacing between 1.8 V CMOS inputs and 2.5 V/3.3 V supply domains. It operates across 2.3 V–3.6 V, delivers ≤1.5 μA max ICC, supports IOFF partial power-down, and functions from –40 °C to +125 °C in X2SON5 (SOT1226-3) package. It enables reliable signal conditioning in battery-powered IoT sensor nodes.

For engineers reviewing the 74AUP1T17GXH datasheet, 74AUP1T17GXH pinout, 74AUP1T17GXH application, or 74AUP1T17GXH equivalent, key selection criteria include its 0.8 × 0.8 mm X2SON5 footprint, 2.5 ns typical propagation delay at 3.3 V/15 pF, Schmitt-trigger hysteresis (≥0.15 V), IOFF-enabled isolation during power sequencing, and ±0.75 μA max input leakage over full temperature range.

Technical Context

The 74AUP1T17GXH implements a non-inverting buffer with integrated Schmitt-trigger input stage, enabling robust noise immunity against slow-rising signals across its entire 2.3 V–3.6 V VCC range. Its input threshold voltages (VT+ = 0.75–1.19 V, VT− = 0.46–0.85 V) are dynamically referenced to VCC, allowing reliable detection of 1.8 V logic levels while powered from 2.5 V or 3.3 V.

IOFF circuitry actively disables output terminals when VCC = 0 V, limiting backflow current to ±0.75 μA and preventing bus contention during partial system power-down. The device exhibits low dynamic power dissipation (CPD = 5 pF at 3.0–3.6 V) and maintains stable VOL ≤ 0.50 V and VOH ≥ 2.30 V under 4 mA load across –40 °C to +125 °C.

Key Specifications

Pinout & Package

X2SON5 (SOT1226-3) package: 0.8 mm × 0.8 mm × 0.32 mm body, no leads, 5-terminal bottom-side thermal pad design optimized for space-constrained PCB layouts and thermal performance in high-density modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar buffer with level translation applications.

Compared with SN74LVC1T45DBVR and 74LVC1G17GW,125, the 74AUP1T17GXH uniquely combines unidirectional Schmitt buffering, sub-μA static current, IOFF isolation, and X2SON5 miniaturization-making it optimal for space- and power-constrained always-on edge nodes requiring deterministic signal integrity.

Availability

74AUP1T17GXH is available at Aetrix Electronics and suitable for industrial sensor interfaces, wearable health monitors, automotive body control modules, and smart home hub gateways requiring stable component supply across extended temperature and long product lifecycles.

Supply support for 74AUP1T17GXH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency-enhancing components, delivering high-performance, reliable, and scalable solutions for automotive, industrial, mobile, and computing markets.

The 74AUP1T17GXH belongs to Nexperia's Advanced Ultra-low Power (AUP) logic family, engineered specifically for energy-sensitive applications where nanowatt static consumption, robust noise immunity, and seamless voltage-domain bridging are critical design requirements.

FAQ

What is the maximum capacitive load the 74AUP1T17GXH can drive while maintaining specified tpd?

The 74AUP1T17GXH is characterized up to 30 pF load capacitance across all VCC and temperature ranges, with worst-case propagation delay of 11.9 ns at VCC = 2.3 V, –40 °C to +125 °C, and CL = 30 pF. Driving loads beyond 30 pF increases delay nonlinearly and may violate setup/hold margins in synchronous interfaces.

Can the 74AUP1T17GXH be used with a 1.8 V supply voltage?

No - the 74AUP1T17GXH requires minimum VCC = 2.3 V per datasheet Section 9. Operating below 2.3 V risks undefined output behavior, increased ICC, and failure to meet VOH/VOL specifications. For 1.8 V supply domains, consider the 74AUP2G07 or dedicated 1.8 V logic families.

Does the n.c. pin (Pin 1) require PCB connection or thermal treatment?

Pin 1 is internally not connected and must remain unconnected on the PCB. No trace, pad, or thermal via is required. Connecting it risks unintended coupling or mechanical stress on the X2SON5 die attach; Nexperia's SOT1226-3 layout guidelines explicitly prohibit metallization to Pin 1.

How does the IOFF feature behave when VCC ramps from 0 V to nominal voltage?

IOFF activates when VCC falls below ~0.2 V and remains active until VCC exceeds ~0.8 V, per ΔIOFF characterization. During this transition, output leakage stays ≤±0.75 μA, preventing bus contention. Full functional operation resumes only after VCC stabilizes above 2.3 V, as defined in recommended operating conditions.