Nexperia USA Inc. 74AUP1T50GWH

Overview

74AUP1T50GWH from Nexperia is a single-channel low-power buffer with integrated voltage-level translation, designed for bidirectional logic interfacing between 1.8 V CMOS inputs and 2.5 V/3.3 V supply domains. It delivers ICC ≤ 1.5 μA max static current, supports VCC from 2.3 V to 3.6 V, features Schmitt-trigger inputs for noise immunity, and includes IOFF circuitry for partial power-down protection. It is deployed in battery-powered IoT sensor nodes where supply voltage drops from 3.6 V to 2.3 V during discharge.

For engineers reviewing the 74AUP1T50GWH datasheet, 74AUP1T50GWH pinout, 74AUP1T50GWH application, or 74AUP1T50GWH equivalent, this page provides verified functional role, real-world timing behavior under varying VCC and load capacitance, IOFF-enabled system power sequencing support, and validated alternatives for level-shifting buffer replacement in space-constrained portable designs.

Technical Context

The 74AUP1T50GWH implements a non-inverting buffer with hysteresis-equipped Schmitt-trigger inputs (VT+ = 0.60–1.19 V, VT− = 0.33–0.85 V), enabling robust operation with slow-rising signals across its full −40 °C to +125 °C temperature range. Its IOFF circuit actively disables output leakage when VCC = 0 V, limiting backflow current to ±0.75 μA.

Propagation delay varies from 1.1 ns (VCC = 3.6 V, VI = 3.3 V, CL = 5 pF) to 11.9 ns (VCC = 2.3 V, VI = 1.8 V, CL = 30 pF), with dynamic power dissipation governed by CPD = 4–5 pF and scalable via PD = CPD × VCC² × fi × N.

Key Specifications

Pinout & Package

TSSOP5 (SOT353-1) package: plastic thin shrink small outline, 5-lead, 1.25 mm body width, 0.65 mm lead pitch, 1.3 mm height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar voltage-level translation buffer applications.

Compared with SN74LVC1T45DBVR and 74LVC1G17GW, the 74AUP1T50GWH uniquely combines ultra-low ICC, guaranteed IOFF, and Schmitt-trigger noise immunity in a single unidirectional buffer - making it optimal for battery-critical, thermally demanding, and system-power-sequencing-sensitive applications.

Availability

74AUP1T50GWH is available at Aetrix Electronics and suitable for industrial sensor interfaces, wearable health monitors, smart meter communication modules, and automotive body control units requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for 74AUP1T50GWH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, discrete, and MOSFET solutions, with manufacturing rooted in process innovation and automotive-grade quality systems.

The 74AUP (Advanced Ultra-low Power) product line targets energy-constrained portable and industrial electronics, delivering sub-microamp static current and robust operation across wide voltage and temperature ranges.

FAQ

What is the maximum capacitive load the 74AUP1T50GWH can drive while maintaining specified tpd?

The device is characterized up to 30 pF load capacitance across all VCC and temperature conditions, with tpd remaining within datasheet limits (e.g., 11.9 ns max at VCC = 2.3 V, CL = 30 pF, −40 °C to +125 °C). Driving >30 pF may increase propagation delay nonlinearly and degrade edge monotonicity, especially below 2.5 V VCC.

Does the 74AUP1T50GWH support true bidirectional level translation?

No - it is a unidirectional buffer (A → Y only). While inputs tolerate up to 3.6 V regardless of VCC, the output Y cannot source/sink current into the A pin. For bidirectional translation, a dedicated auto-sensing device like SN74LVC1T45 is required.

How does the IOFF feature behave when VCC is ramping during power-up?

IOFF activates when VCC falls below ~0.2 V and remains active until VCC exceeds ~0.8 V. During ramp-up, output Y is high-impedance until VCC crosses the turn-on threshold, preventing bus contention in multi-rail systems where peripherals power up asynchronously.

Can the n.c. pin (Pin 1) be used as a thermal pad or grounded for improved thermal performance?

No - Pin 1 is internally unconnected in the SOT353-1 package. Grounding or soldering it provides no thermal or electrical benefit and risks mechanical stress on the bond wire. Thermal dissipation relies solely on the GND (Pin 3) and VCC (Pin 5) leads per JEDEC standards.