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Nexperia USA Inc. 74AUP2G00GXX

Part No.:
74AUP2G00GXX
Manufacturer:
Nexperia USA Inc.
Category:
Gates and Inverters
Package:
8-XFDFN Exposed Pad
Datasheet:
Aetrix74AUP2G00GXX.pdf
Description:
IC GATE NAND 2CH 2-INP 8X2SON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,277

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Product details

Overview

74AUP2G00GXX from Nexperia is a low-power dual 2-input NAND gate logic IC with Schmitt-trigger inputs, operating across 0.8 V to 3.6 V supply, delivering ICC ≤ 0.9 μA max static current, tPD ≤ 3.6 ns at VCC = 3.3 V/CL = 5 pF, and IOFF-enabled partial power-down protection for mixed-voltage system interfacing in portable and battery-powered control circuits.

For engineers reviewing the 74AUP2G00GXX datasheet, 74AUP2G00GXX pinout, 74AUP2G00GXX application, or 74AUP2G00GXX equivalent, this device supports robust level-shifting between sub-1V and 3.3V domains, offers ±0.75 μA input leakage at −40 °C to +125 °C, and integrates ESD protection exceeding 5000 V HBM - critical for noise-immune signal conditioning in space-constrained IoT sensor nodes and wearables.

Technical Context

This dual NAND gate implements standard positive-logic NAND function (Y = NOT(A AND B)) with independent Schmitt-trigger inputs on all four inputs (1A/1B/2A/2B), enabling reliable operation with slow-rising signals and high noise immunity across its full 0.8–3.6 V VCC range. Input thresholds scale with VCC (e.g., VIH = 0.65×VCC min at 1.4 V), ensuring consistent switching behavior under varying rail conditions.

The IOFF circuit actively disables outputs when VCC = 0 V, blocking backflow current up to ±0.75 μA, making it suitable for hot-swap and partial-power-down architectures. Propagation delay is load- and voltage-dependent: 1.0–4.7 ns over CL = 5–30 pF and VCC = 0.8–3.6 V, with CPD = 3.9 pF at 3.3 V enabling precise dynamic power estimation.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 0.8 V to 3.6 V - enables direct interface with 0.9 V, 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic families without level shifters.
ICC (max) 0.9 μA at TA = −40 °C to +125 °C - ensures ultra-low quiescent power for always-on battery-backed subsystems.
tPD (max) 4.7 ns at VCC = 3.0–3.6 V, CL = 5 pF - supports >100 MHz toggle rates in timing-critical combinational paths.
IOFF Leakage ±0.75 μA at VCC = 0 V - prevents destructive back-current during power sequencing in multi-rail FPGAs or microcontrollers.
ESD Rating HBM > 5000 V, CDM > 1000 V - meets IEC 61000-4-2 Level 4 requirements for handheld and industrial edge devices.
Operating Temp −40 °C to +125 °C - qualified for under-hood automotive, industrial PLC I/O, and extended-temperature embedded controllers.
Input Thresholds VIH = 0.70×VCC min (0.8 V), VIL = 0.25×VCC max (3.6 V) - provides ≥55% hysteresis margin at low VCC for noisy environments.

Pinout & Package

X2SON8 package (SOT1233-2): plastic thermal-enhanced extremely thin small outline, no leads, 8 terminals, body size 1.35 × 0.8 × 0.32 mm, exposed thermal pad not electrically connected.

Pin/Terminal Circuit Role Design Meaning
1A, 2A Primary data input (Gate 1 & Gate 2) Accepts 0–3.6 V logic levels; Schmitt-triggered for noise rejection and clean edge regeneration.
1B, 2B Secondary data input (Gate 1 & Gate 2) Independent hysteresis per input enables asynchronous signal conditioning without external RC networks.
1Y, 2Y Combinational NAND output (Gate 1 & Gate 2) Push-pull CMOS output drives loads up to ±4 mA; VOL ≤ 0.45 V at 4 mA ensures TTL/CMOS compatibility.
GND Ground reference (Pin 4) Low-inductance return path; must be decoupled locally with 100 nF ceramic capacitor near VCC pin.
VCC Supply voltage (Pin 8) Single-supply rail powers both gates; IOFF activates automatically when VCC = 0 V.

Key Features

Feature Design Value
Wide VCC range 0.8 V to 3.6 V supports direct integration into heterogeneous voltage domains (e.g., 1.1 V FPGA core + 3.3 V peripheral bus).
Schmitt-trigger inputs Input hysteresis ≥150 mV at 1.2 V ensures reliable switching with slow edges (Δt/ΔV ≤ 200 ns/V) in sensor interface applications.
IOFF partial power-down Output disable at VCC = 0 V limits back-current to ±0.75 μA - eliminates need for external isolation switches in hot-plug modules.
Ultra-low ICC 0.9 μA max supply current at +125 °C enables >10-year battery life in coin-cell-powered wake-up logic circuits.
High ESD robustness HBM > 5000 V and CDM > 1000 V allow direct PCB handling and assembly without special ESD controls in Class 0 environments.

Applications

Industrial Sensor Interface Wearable Power Sequencing

Use Scenario: Signal conditioning for analog sensor outputs (e.g., thermistor, photodiode) feeding ADCs in factory-floor monitoring nodes.

IC Role / Device Role / Timing Role: Dual NAND acts as debounced digital trigger and enable gate for ADC sampling clock, leveraging Schmitt inputs to reject EMI-induced glitches.

Use Value: Eliminates external RC filters and discrete logic; operates reliably at 1.2 V supply while interfacing 3.3 V ADC control lines via level-tolerant inputs.

Use Scenario: Controlled power-up sequence for BLE SoC, display driver, and environmental sensor in smartwatch firmware.

IC Role / Device Role / Timing Role: NAND gates implement OR-logic (via De Morgan) to combine reset signals from multiple PMIC rails before releasing system reset.

Use Value: IOFF prevents backfeed during staggered rail ramp-up; 0.9 μA ICC extends shelf-life of pre-charged coin cells by >30% vs. standard AUP series.

Automotive Body Control Module IoT Edge Node Wake Logic

Use Scenario: Interfacing mechanical switch inputs (door latch, trunk release) to 3.3 V CAN transceiver microcontroller in harsh 12 V vehicle environment.

IC Role / Device Role / Timing Role: Provides ESD-hardened, noise-immune signal inversion and gating for switch status before CAN message generation.

Use Value: Withstands −40 °C to +125 °C ambient and >5000 V HBM surges; input tolerance to 3.6 V allows direct connection to MCU GPIO without clamping diodes.

Use Scenario: Ultra-low-power wake controller that monitors PIR motion sensor and LoRaWAN interrupt lines to activate main processor only on valid event.

IC Role / Device Role / Timing Role: One NAND gate combines motion and network-ready signals; second gate inverts to drive deep-sleep exit line with minimal propagation delay.

Use Value: 1.0 ns tPD at 3.3 V ensures <100 ns wake latency; 0.9 μA ICC reduces standby current below 1 μA - critical for 10-year solar-battery deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input NAND gate applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC2G00DPWR Wider VCC (1.65–5.5 V); higher ICC (10 μA typ); no Schmitt inputs; no IOFF. Requires external level shifting below 1.65 V; unsuitable for partial power-down systems. Select only if operating exclusively above 1.65 V and ESD > 2000 V HBM is sufficient.
74AHC2G00GW,125 Higher speed (tPD = 2.5 ns @ 3.3 V); wider VCC (2–5.5 V); no Schmitt inputs; IOFF not supported. Lacks noise immunity for slow-switching sensors; cannot isolate powered-down sections. Prefer for high-speed clock gating in 3.3 V-only systems where input rise time > 10 ns.

Compared with SN74LVC2G00DPWR and 74AHC2G00GW,125, the 74AUP2G00GXX uniquely delivers sub-1V operation, Schmitt-trigger noise rejection, and IOFF-enabled power-domain isolation - making it the sole choice for battery-constrained, multi-rail, and EMI-prone embedded designs.

Availability

74AUP2G00GXX is available at Aetrix Electronics and suitable for industrial sensor interfaces, wearable power sequencers, automotive body control modules, and IoT edge node wake logic requiring stable component supply across extended temperature and ultra-low power profiles.

Supply support for 74AUP2G00GXX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, discrete, and MOSFET solutions optimized for reliability, power efficiency, and miniaturization.

The 74AUP (Advanced Ultra-low Power) logic family targets space- and energy-constrained applications including wearables, IoT endpoints, and automotive subsystems where sub-1V operation, nanowatt quiescent power, and robust ESD performance are mandatory.

FAQ

Does 74AUP2G00GXX support true 0.8 V logic operation with guaranteed timing?

Yes. The device is fully characterized down to 0.8 V VCC, with tPD ≤ 17.5 ns (typ) and VIH/VIL thresholds defined at 0.70×VCC and 0.25×VCC respectively. All static and dynamic parameters in Tables 6–8 are validated across −40 °C to +125 °C at 0.8 V, confirming functional correctness and timing predictability in sub-1V domains.

How does the IOFF feature behave when VCC is ramping or floating?

IOFF activates only when VCC is ≤ 0.2 V (per ΔIOFF spec), holding outputs in high-impedance state. During VCC ramp-up, outputs remain disabled until VCC exceeds ~0.3 V, then transition to active mode with controlled slew rate. If VCC floats, internal detection circuitry maintains IOFF until VCC stabilizes within operating range - preventing undefined output states during brown-out.

Can 74AUP2G00GXX inputs safely accept 5 V signals?

No. Absolute maximum input voltage is +4.6 V, but recommended operating VI is limited to 0–3.6 V. Applying 5 V violates the datasheet's VI limit and risks permanent damage or increased leakage. For 5 V tolerant interfacing, use dedicated level translators like NXSL1T22 or add external clamping diodes with current-limiting resistors.

What is the thermal performance difference between SOT1233-2 (GX) and SOT765-1 (DC) packages?

SOT1233-2 (X2SON8) has 300 mW total power dissipation (Ptot) with 7.7 mW/K derating above 118 °C, versus 250 mW and 4.9 mW/K for SOT765-1 (VSSOP8) above 99 °C. The GX package's thinner profile (0.32 mm vs. 0.5 mm) and enhanced thermal pad improve junction-to-board conduction, yielding ~12 °C lower θJA in identical PCB layouts - critical for sealed enclosures.

74AUP2G00GXX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
74AUP
Package/Case:
8-XFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
NAND Gate
Number of Circuits:
2
Number of Inputs:
2
Features:
-
Voltage - Supply:
0.8V ~ 3.6V
Current - Quiescent (Max):
500 nA
Current - Output High, Low:
4mA, 4mA
Input Logic Level - Low:
0.7V ~ 0.9V
Input Logic Level - High:
1.6V ~ 2V
Max Propagation Delay @ V, Max CL:
6.5ns @ 3.3V, 30pF
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-X2SON (1.35x0.8)

74AUP2G00GXX FAQ

1.How can I place an order for 74AUP2G00GXX through Aetrix?

Please submit a Request for Quotation (RFQ) for 74AUP2G00GXX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74AUP2G00GXX reliable?

The price and inventory of 74AUP2G00GXX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP2G00GXX is usually 5 days.

3.What payment methods are accepted for 74AUP2G00GXX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP2G00GXX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 74AUP2G00GXX?

74AUP2G00GXX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 74AUP2G00GXX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74AUP2G00GXX?

For technical support, including 74AUP2G00GXX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP2G00GXX requirements.

6.How does Aetrix verify that 74AUP2G00GXX is sourced from the original manufacturer or authorized distributors?

All 74AUP2G00GXX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP2G00GXX meets industry standards.

7.What is the process for return or replacement of 74AUP2G00GXX?

All 74AUP2G00GXX units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G00GXX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AUP2G00GXX part is unused and in its original packaging.

Return procedure for 74AUP2G00GXX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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