Diodes Incorporated 74AUP2G00RA3-7
- Part No.:
- 74AUP2G00RA3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Gates and Inverters
- Package:
- 8-XFDFN
- Datasheet:
-
74AUP2G00RA3-7.pdf
- Description:
- IC GATE NAND 2CH 2-INP DFN1210-8
- Quantity:
- Payment:

- Shipping:

Inventory:4,986
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Product details
Overview
74AUP2G00RA3-7 from Diodes Incorporated is a dual 2-input NAND gate in the Advanced Ultra Low Power (AUP) CMOS logic family, designed for battery-powered portable systems. It operates from 0.8V to 3.6V, delivers ±4mA output drive at 3.0V, features IOFF partial power-down protection, and integrates Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V - deployed in ultrabooks, GPS devices, and SSD controllers.
For engineers reviewing the 74AUP2G00RA3-7 datasheet, 74AUP2G00RA3-7 pinout, 74AUP2G00RA3-7 application, or 74AUP2G00RA3-7 equivalent, key selection criteria include ultra-low ICC (<0.9µA), wide VCC range compatibility, IOFF-enabled system-level power sequencing, and DFN1210-8 footprint constraints for high-density PCB layouts.
Technical Context
The 74AUP2G00RA3-7 implements two independent NAND gates with push-pull outputs and Schmitt-trigger inputs, enabling robust noise immunity against slow-rising signals. Its IOFF circuit actively disables outputs during power-down, preventing backflow current when VCC = 0V while inputs remain biased.
It supports dynamic operation across five voltage tiers (0.8V–3.6V), with propagation delay as low as 1.0ns (typ.) at 3.3V/CL=5pF and static supply current under 0.5µA at +25°C - optimized for always-on subsystems in mobile SoC interfaces and peripheral control logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8V to 3.6V - enables direct interfacing with sub-1V logic rails and legacy 3.3V I/O without level shifters. |
| Output Drive | ±4mA at VCC = 3.0V - sufficient to drive multiple CMOS loads or small-signal LEDs without external buffers. |
| Static Supply Current | ICC < 0.9µA max at +25°C - extends battery life in sleep-mode peripherals like keyboard controllers or sensor hubs. |
| IOFF Leakage | ±0.6µA max at –40°C to +125°C - ensures safe hot-insertion and multi-rail power sequencing in modular systems. |
| Input Hysteresis | ~250mV at VCC = 3.0V - rejects noise on slow-switching signals from mechanical switches or analog comparators. |
| Propagation Delay | 1.0ns (typ.) at 3.3V/CL=5pF - supports >100MHz toggle rates in clock-gating or enable-path logic. |
| ESD Protection | 2kV HBM, 1kV CDM - meets industrial IEC 61000-4-2 system-level surge immunity requirements. |
Pinout & Package
X2-DFN1210-8 package: 1.2mm × 1.0mm × 0.35mm body, 0.3mm lead pitch, bottom thermal pad, no leads - optimized for space-constrained mobile PCBs and automated reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 1B, 2A, 2B | Data Input | Four independent logic inputs - each with Schmitt-trigger action to tolerate slow edges and reduce EMI susceptibility. |
| 1Y, 2Y | Data Output | Push-pull CMOS outputs - capable of sourcing/sinking ±4mA at 3.0V, compatible with 1.2V–3.3V logic families. |
| VCC | Supply Voltage | Single power rail for both gates - supports mixed-voltage domain operation when paired with IOFF-aware system architecture. |
| GND | Ground Reference | Common return path - thermally coupled to exposed pad for improved thermal dissipation in high-duty-cycle applications. |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Ultra Low Power (AUP) CMOS | Reduces standby power by >90% vs. standard AHC logic - critical for always-on sensor nodes and wearable wake-up circuits. |
| IOFF Partial Power-Down Support | Enables live insertion of daughterboards or hot-plug peripherals without damaging backdrive current to powered-down sections. |
| Schmitt-Trigger Inputs | Eliminates need for external RC filtering on noisy switch debouncing or analog comparator outputs - saves BOM cost and board area. |
| Halogen- and Antimony-Free "Green" Construction | Meets IPC-1752A Tier 1 reporting requirements and EU EcoDesign Directive compliance for consumer electronics OEMs. |
| Leadless X2-DFN1210-8 Package | Reduces PCB footprint by 65% vs. SOIC-8 - enables routing density gains in compact SSD controller modules and camera ISP interfaces. |
Applications
| Smartphone Power Sequencing | SSD Controller Enable Logic |
|---|---|
|
Use Scenario: Coordinating power-up order between AP, PMIC, and memory subsystems during cold boot. IC Role / Device Role / Timing Role: Dual NAND gate used as active-low enable combiner for reset propagation and voltage-rail readiness arbitration. Use Value: IOFF prevents backfeed from partially powered rails; ultra-low ICC avoids loading standby current budgets during deep-sleep states. |
Use Scenario: Generating chip-select and write-enable strobes for NAND flash arrays in portable SSDs. IC Role / Device Role / Timing Role: Logic-level translation and signal conditioning between 1.8V controller outputs and 3.3V flash interface timing windows. Use Value: Sub-2ns propagation delay ensures setup/hold margin compliance at 100+ MHz toggle rates; Schmitt inputs reject noise from high-speed data bus coupling. |
| Ultrabook Keyboard Backlight Control | GPS Module Wake-Up Interface |
|
Use Scenario: Debouncing mechanical keypresses and gating PWM dimming signals to LED driver ICs. IC Role / Device Role / Timing Role: NAND configured as inverter + AND gate to synchronize key-scan interrupts with backlight enable timing. Use Value: Built-in Schmitt triggers eliminate discrete RC filters; 0.8V minimum VCC allows direct connection to battery-monitoring ADC reference rails. |
Use Scenario: Interfacing low-power GNSS receiver's interrupt output with host MCU's wake-from-sleep input. IC Role / Device Role / Timing Role: Signal level adaptation and edge sharpening for asynchronous wake events across 1.2V/3.3V domain boundaries. Use Value: 250mV hysteresis suppresses false wakes from RF-induced transients; IOFF isolates GPS module during host suspend cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual NAND gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G00DPWR | Wider VCC range (1.65V–5.5V); higher ICC (10µA typ.); no IOFF or Schmitt inputs. | Better suited for mixed 5V/3.3V industrial I/O; unsuitable for sub-1V battery monitoring paths. | Select when interfacing with legacy 5V peripherals and thermal budget permits higher static power. |
| 74AUP2G00GW,125 | Same AUP core but in SOT363 (SC-88) package; larger footprint (2.1mm × 1.25mm); identical electrical specs. | Easier hand-soldering and in-circuit probing; less suitable for ultra-dense mobile PCBs. | Choose for prototyping, repair, or where DFN rework capability is limited. |
Compared with SN74LVC2G00DPWR and 74AUP2G00GW,125, the 74AUP2G00RA3-7 uniquely balances sub-1V operation, IOFF safety, and minimal 1.2mm × 1.0mm footprint - making it the only option for next-gen wearables requiring simultaneous ultra-low power, hot-plug resilience, and PCB area optimization.
Availability
74AUP2G00RA3-7 is available at Aetrix Electronics and suitable for smartphone power sequencing, SSD controller enable logic, ultrabook keyboard backlight control, and GPS module wake-up interfaces requiring stable component supply across extended product lifecycles.
Supply support for 74AUP2G00RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and precision timing solutions for consumer, computing, and industrial markets.
The 74AUP2G00RA3-7 belongs to the Advanced Ultra Low Power (AUP) logic family - engineered specifically for energy-constrained portable electronics where battery life, thermal density, and PCB real estate are primary design constraints.
FAQ
Does the 74AUP2G00RA3-7 support true bidirectional I/O or bus-hold functionality?
No. The 74AUP2G00RA3-7 is a unidirectional dual NAND gate with fixed input/output roles per pin. It lacks bus-hold, weak pull-up/down, or direction-control circuitry. Inputs are Schmitt-triggered for noise immunity, but outputs are strictly push-pull CMOS with no tri-state capability.
What is the maximum capacitive load the 74AUP2G00RA3-7 can drive while maintaining guaranteed tPD?
The datasheet specifies switching characteristics up to CL = 30pF. At 3.3V, tPD remains within spec (max 8.4ns) even at 30pF. Driving >30pF will increase propagation delay nonlinearly and may violate setup/hold timing in synchronous designs - external buffering is recommended beyond this limit.
Can unused inputs be left floating, or must they be terminated?
Unused inputs must not be left floating. Per Recommended Operating Conditions (Note 8), all unused inputs must be tied to VCC or GND. Floating inputs cause increased ICC, potential oscillation due to Schmitt-trigger metastability, and elevated EMI radiation - compromising both power efficiency and signal integrity.
Is the X2-DFN1210-8 package compatible with standard reflow profiles for lead-free soldering?
Yes. The X2-DFN1210-8 package is qualified for JEDEC J-STD-020D-compliant lead-free reflow profiles, including peak temperatures up to 260°C for ≤60 seconds. Diodes Incorporated provides detailed thermal profile guidance in Application Note AP02002 for optimal solder joint reliability.
74AUP2G00RA3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74AUP
- Package/Case:
- 8-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- NAND Gate
- Number of Circuits:
- 2
- Number of Inputs:
- 2
- Features:
- -
- Voltage - Supply:
- 0.8V ~ 3.6V
- Current - Quiescent (Max):
- 500 nA
- Current - Output High, Low:
- 4mA, 4mA
- Input Logic Level - Low:
- 0.7V ~ 0.9V
- Input Logic Level - High:
- 1.6V ~ 2V
- Max Propagation Delay @ V, Max CL:
- 6.5ns @ 3.3V, 30pF
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1210-8
74AUP2G00RA3-7 FAQ
1.How can I place an order for 74AUP2G00RA3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP2G00RA3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP2G00RA3-7 reliable?
The price and inventory of 74AUP2G00RA3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP2G00RA3-7 is usually 5 days.
3.What payment methods are accepted for 74AUP2G00RA3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP2G00RA3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74AUP2G00RA3-7?
74AUP2G00RA3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP2G00RA3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP2G00RA3-7?
For technical support, including 74AUP2G00RA3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP2G00RA3-7 requirements.
6.How does Aetrix verify that 74AUP2G00RA3-7 is sourced from the original manufacturer or authorized distributors?
All 74AUP2G00RA3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP2G00RA3-7 meets industry standards.
7.What is the process for return or replacement of 74AUP2G00RA3-7?
All 74AUP2G00RA3-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G00RA3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP2G00RA3-7 part is unused and in its original packaging.
Return procedure for 74AUP2G00RA3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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