Diodes Incorporated 74AUP2G04FZ4-7

Overview

74AUP2G04FZ4-7 from Diodes Incorporated is a dual CMOS inverter IC in the Advanced Ultra Low Power (AUP) logic family, designed for battery-powered portable systems requiring operation from 0.8V to 3.6V supply. It delivers ±4mA output drive at 3.0V, features IOFF partial power-down protection, and integrates Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V for noise-immune signal conditioning in low-voltage microcontroller I/O buffering.

For engineers reviewing the 74AUP2G04FZ4-7 datasheet, 74AUP2G04FZ4-7 pinout, 74AUP2G04FZ4-7 application, or 74AUP2G04FZ4-7 equivalent, key selection criteria include ultra-low ICC (<0.9µA), wide VCC range compatibility, IOFF-enabled system-level power sequencing, and DFN1410-6 footprint suitability for space-constrained PCB layouts.

Technical Context

This device implements two independent inverting logic gates with push-pull outputs and no internal pull-ups or pull-downs. Its IOFF circuit actively disables both outputs when VCC = 0V, blocking reverse current flow from powered downstream circuits into the unpowered IC - critical for hot-swap and multi-rail power domain isolation.

The Schmitt-trigger input structure provides defined switching thresholds (VIH ≈ 0.8×VCC, VIL ≈ 0.3×VCC at 1.65V) and inherent noise immunity, enabling reliable operation with slow-rising signals such as reset lines, mechanical switch debouncing, or low-speed sensor interfaces without external RC filtering.

Key Specifications

Pinout & Package

X2-DFN1410-6 package: 1.4mm × 1.0mm × 0.4mm body, 0.5mm pad pitch, leadless, RoHS-compliant, thermal pad optional.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual inverter applications.

Compared with SN74LVC2G04DBVR and 74AHC2G04GW,125, the 74AUP2G04FZ4-7 uniquely combines sub-1µA static current, IOFF, Schmitt inputs, and 0.8V operation - making it the only choice for energy-critical, multi-rail portable designs requiring robust signal integrity and safe power sequencing.

Availability

74AUP2G04FZ4-7 is available at Aetrix Electronics and suitable for battery-powered wearables, IoT sensor nodes, and portable medical monitors requiring stable component supply across extended product lifecycles.

Supply support for 74AUP2G04FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for consumer, industrial, and automotive markets.

The 74AUP logic family targets ultra-low-power portable electronics, delivering sub-microwatt static operation and robust performance across wide voltage ranges for next-generation battery-constrained devices.

FAQ

What is the minimum operating voltage for 74AUP2G04FZ4-7?

The absolute minimum recommended operating voltage is 0.8V per the datasheet's Recommended Operating Conditions. At this voltage, the device maintains valid logic thresholds (VIH ≈ 0.64V, VIL ≈ 0.24V) and delivers usable output drive (±20µA). Operation below 0.8V is not characterized and may result in undefined behavior or excessive propagation delay.

Does 74AUP2G04FZ4-7 require external pull-up or pull-down resistors on its inputs?

No. The inputs are CMOS with high impedance (>1MΩ) and do not require external biasing. However, unused inputs must be tied to either VCC or GND to prevent floating states that increase ICC and cause erratic output switching - a requirement explicitly stated in Note 8 of the datasheet.

Can 74AUP2G04FZ4-7 safely interface between a 3.3V domain and a 1.2V domain?

Yes - but only unidirectionally from 3.3V to 1.2V. A 3.3V logic HIGH (≥2.0V) exceeds the VIH threshold at 1.2V (0.96V), and a 3.3V LOW (≤0.9V) is below the VIL threshold (0.36V). However, driving the 74AUP2G04FZ4-7 input from 1.2V into a 3.3V system requires level translation, as its outputs swing only to VCC (1.2V), insufficient to meet 3.3V VIH.

Is the thermal pad on the X2-DFN1410-6 package electrically connected internally?

No - the exposed thermal pad on the X2-DFN1410-6 package is not internally connected to any die node. It is intended solely for thermal conduction and mechanical stability. Diodes Incorporated's AP02001 pad layout document specifies it should be soldered to a PCB thermal plane or left floating; connecting it to GND or VCC is not recommended unless validated by thermal simulation and reliability testing.