Diodes Incorporated 74AUP2G07FW4-7

Overview

74AUP2G07FW4-7 from Diodes Incorporated is a dual non-inverting buffer with open-drain outputs, designed for ultra-low-power logic interfacing in battery-powered systems. It operates across 0.8V–3.6V supply, delivers –4mA output drive at 3.0V, features IOFF partial power-down protection, and includes Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V. Used in voltage-level translation and wired-OR bus driving in portable computing peripherals.

For engineers reviewing the 74AUP2G07FW4-7 datasheet, 74AUP2G07FW4-7 pinout, 74AUP2G07FW4-7 application, or 74AUP2G07FW4-7 equivalent, key selection criteria include its 1.0mm × 1.0mm X2-DFN1010-6 package, sub-1µA ICC static current, 3.5ns typical propagation delay at 3.3V/CL=5pF, IOFF-enabled system power sequencing, and Schmitt-trigger noise immunity for slow-rising control signals.

Technical Context

This device implements two independent positive-buffer functions (Y = A) using advanced ultra-low-power CMOS process technology. Each channel features an open-drain output stage enabling wired-OR logic, I²C-compatible bus driving, and level-shifting between disparate voltage domains.

Its IOFF circuit actively disables both outputs during power-down to prevent back-current flow, while Schmitt-trigger inputs tolerate slow edge rates and provide noise margin-critical for reset, enable, and interrupt signal conditioning in mixed-voltage embedded systems.

Key Specifications

Pinout & Package

X2-DFN1010-6 (1.0mm × 1.0mm × 0.4mm) thermally enhanced leadless package with wettable flank capability and RoHS-compliant matte tin finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual open-drain buffer applications.

Compared with SN74LVC2G07DBVR, 74AUP2G07FW4-7 offers 10× lower ICC and integrated Schmitt noise rejection-essential for battery longevity and EMI-prone handhelds. Against FW3, the larger pad pitch and thermal mass of FW4 improve manufacturability and sustained current handling without derating.

Availability

74AUP2G07FW4-7 is available at Aetrix Electronics and suitable for USB-C accessory design, portable sensor node development, and ultra-compact display subsystems requiring stable component supply, long-lifecycle assurance, and consistent DFN1010 sourcing.

Supply support for 74AUP2G07FW4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for consumer, computing, and industrial markets.

The 74AUP logic family targets portable and energy-sensitive applications, delivering industry-leading power efficiency without sacrificing speed or noise immunity-designed specifically for battery-constrained IoT endpoints and mobile peripherals.

FAQ

Can 74AUP2G07FW4-7 drive a standard I²C bus directly?

Yes-it supports I²C bus driving with open-drain outputs and compatible voltage thresholds. At VCC = 3.3V, it sinks up to 4mA, sufficient for standard 10kΩ pull-ups. Its Schmitt-trigger inputs reject noise on SCL/SDA lines, and IOFF prevents backfeed if the MCU is powered down while the bus remains active. No external components are required for basic compliance.

What is the maximum capacitive load this device can drive while maintaining timing specs?

The datasheet specifies switching characteristics up to CL = 30pF. At 3.3V and CL = 30pF, tPD is 10.6ns (max), remaining within I²C Fast-mode timing budgets. Driving >30pF increases propagation delay nonlinearly and may cause setup/hold violations; for heavier loads, add a series resistor or use a dedicated buffer with higher drive strength.

Does the IOFF feature work when VCC is disconnected but GND remains connected?

Yes-IOFF activates when VCC is near 0V (≤0.2V), regardless of GND continuity. The datasheet confirms IOFF leakage remains ≤±0.75µA across –40°C to +125°C under those conditions. This allows safe hot-swap operation in modular systems where VCC rails are sequenced independently, provided GND is maintained as reference.

Is the X2-DFN1010-6 package compatible with standard reflow profiles for lead-free soldering?

Yes-the package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 and withstands peak reflow temperatures up to 260°C. Its 0.35mm pad pitch and wettable flanks support automated optical inspection (AOI) and reliable solder joint formation using standard Type 3 or Type 4 no-clean pastes and convection reflow profiles.