Diodes Incorporated 74AUP2G08RA3-7
- Part No.:
- 74AUP2G08RA3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Gates and Inverters
- Package:
- 8-XFDFN
- Datasheet:
-
74AUP2G08RA3-7.pdf
- Description:
- IC GATE AND 2CH 2-INP DFN1210-8
- Quantity:
- Payment:

- Shipping:

Inventory:4,635
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Product details
Overview
74AUP2G08RA3-7 from Diodes Incorporated is a dual 2-input AND gate in the Advanced Ultra Low Power (AUP) CMOS logic family, designed for battery-powered portable systems. It operates across 0.8V–3.6V supply, delivers ±4mA output drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V for noise immunity in low-voltage signal routing.
For engineers reviewing the 74AUP2G08RA3-7 datasheet, 74AUP2G08RA3-7 pinout, 74AUP2G08RA3-7 application, or 74AUP2G08RA3-7 equivalent, key selection criteria include ultra-low ICC (<0.9µA), wide VCC range compatibility, IOFF-enabled system-level power sequencing, and DFN1210-8 footprint constraints in space-constrained mobile PCB layouts.
Technical Context
This device implements two independent positive-logic AND functions (Y = A • B) using push-pull CMOS outputs. Its IOFF circuit actively disables outputs during power-down to prevent back-current flow between powered and unpowered rails-critical for mixed-voltage domain interconnects in modern portable SoC subsystems.
Schmitt-trigger inputs provide defined switching thresholds and hysteresis (~250mV at 3.0V), enabling robust operation with slow-rising or noisy signals common in I²C pull-up networks, reset line conditioning, and wake-up logic interfaces where edge integrity is compromised by RC delays or EMI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8V to 3.6V - supports direct interface with sub-1V core logic, 1.2V/1.8V I/O domains, and 3.3V peripherals without level shifters. |
| Max Output Drive | ±4mA at VCC = 3.0V - sufficient to drive 15pF loads with <4.8ns propagation delay, enabling fanout-2 signal distribution in compact timing paths. |
| Static Current (ICC) | <0.9µA typical at 25°C - extends battery life in always-on sensor monitoring or standby wake logic circuits. |
| IOFF Leakage | ±0.6µA max at –40°C to +125°C - ensures safe isolation when one supply rail is off while adjacent logic remains active. |
| Input Hysteresis | ~250mV at VCC = 3.0V - rejects noise up to ±125mV on input lines, eliminating need for external RC filtering in noisy mobile environments. |
| Propagation Delay | 1.0ns typ / 4.8ns max at 3.3V, CL = 10pF - meets timing closure for 100MHz+ control-path gating in ultrabooks and SSD controllers. |
| ESD Robustness | 2kV HBM, 1kV CDM - exceeds IEC 61000-4-2 Level 2 requirements for handheld device front-end logic exposed to user handling. |
Pinout & Package
Supplied in X2-DFN1210-8 package: 1.2mm × 1.0mm × 0.35mm body, 0.3mm lead pitch, bottom thermal pad, no leads. RoHS-compliant, halogen- and antimony-free "Green" construction.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 1B, 2A, 2B | Data Input | Four independent logic inputs - each gate accepts standard CMOS voltage thresholds scaled to VCC; Schmitt-triggered for noise margin. |
| 1Y, 2Y | Data Output | Push-pull CMOS outputs - actively drive high/low without external pull-ups; support bus-hold or wired-AND via external resistors if needed. |
| VCC | Supply Voltage | Single power rail for both gates - decoupling capacitor (≥100nF) required within 2mm of pin per AP02001 layout guidelines. |
| GND | Ground Reference | Common return path - must connect directly to solid ground plane under thermal pad to maintain θJA = 395°C/W performance. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low static power | ICC < 0.9µA enables multi-year battery operation in IoT sensor nodes with infrequent wake-and-transmit cycles. |
| IOFF partial power-down | Prevents destructive back-current when VCC is off but I/O lines remain biased - essential for hot-plug USB or SD card interface logic. |
| Schmitt-trigger inputs | 250mV hysteresis at 3.0V eliminates chatter on slow edges from mechanical switches or long PCB traces in portable UI subsystems. |
| Wide VCC range | 0.8V–3.6V operation allows direct integration with energy-harvesting PMIC outputs and legacy 3.3V peripherals without translation. |
| Small-footprint DFN | X2-DFN1210-8 (1.2×1.0mm) saves >60% board area vs. SOIC-8 - critical for camera modules and wearable display drivers. |
Applications
| Mobile Device Power Sequencing | Low-Power Sensor Interface Logic |
|---|---|
|
Use Scenario: Coordinating power-up order of RF transceiver, baseband processor, and display controller in smartphones. IC Role / Device Role / Timing Role: Dual AND gate enables conditional enable signals - e.g., releasing reset only after both VDD_IO and VDD_CORE are stable. Use Value: IOFF prevents current leakage from powered VDD_IO rail into unpowered VDD_CORE domain during staggered startup sequences. |
Use Scenario: Debouncing and combining interrupt signals from multiple MEMS sensors (accelerometer, gyroscope, ambient light) before waking an MCU. IC Role / Device Role / Timing Role: Performs logical AND of sensor alert outputs to reduce false wake events - Schmitt inputs tolerate slow analog comparator transitions. Use Value: Sub-1µA ICC extends coin-cell lifetime beyond 5 years in maintenance-free industrial condition-monitoring nodes. |
| USB Type-C Port Controller Logic | SSD Controller Signal Gating |
|
Use Scenario: Validating CC line detection and VBUS presence before enabling USB data lanes in portable docking stations. IC Role / Device Role / Timing Role: Gates USB3.0 RX/TX enable based on dual confirmation - CC pin state AND VBUS > 4.5V threshold. Use Value: 0.8V–3.6V operation matches USB PD controller I/O voltage, eliminating level-shifter components in compact port designs. |
Use Scenario: Enabling NAND flash command strobes only when both host controller ready and flash busy flag is deasserted. IC Role / Device Role / Timing Role: Synchronizes control path between PCIe root complex and NAND die - dual gate used for handshake arbitration. Use Value: 1.0ns typical tPD at 3.3V ensures setup/hold timing margins for 200MT/s ONFI interfaces in M.2 SSD modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 2-input AND gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUP2G08DSFR | Texas Instruments version in same X2-DFN1210-8 package; identical VCC range and IOFF spec, but higher ICC (1.2µA max) and lower ESD (1.5kV HBM). | Valid for cost-sensitive consumer designs where full 2kV HBM is not mandated by end-equipment safety standards. | Select when TI supply chain alignment outweighs marginal ESD margin reduction and slightly higher quiescent current. |
| 74LVC2G08GM,132 | Nexperia part in XSON8 (1.25×1.25mm); wider VCC (1.65–5.5V) but no IOFF and no Schmitt inputs - requires external clamping for partial power-down. | Suitable for industrial control panels with stable 3.3V/5V rails where power sequencing complexity is low and noise immunity is managed externally. | Choose only if system lacks mixed-rail scenarios and can accommodate larger footprint and added external protection components. |
Compared with SN74AUP2G08DSFR and 74LVC2G08GM,132, the 74AUP2G08RA3-7 uniquely combines ultra-low ICC, guaranteed IOFF, Schmitt inputs, and smallest DFN footprint - making it optimal for next-gen wearables and battery-constrained edge AI modules requiring zero-power leakage and noise-hardened logic.
Availability
74AUP2G08RA3-7 is available at Aetrix Electronics and suitable for mobile device power sequencing, low-power sensor interface logic, USB Type-C port controller logic, and SSD controller signal gating requiring stable component supply and long-term lifecycle assurance.
Supply support for 74AUP2G08RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for consumer, computing, and industrial markets.
The 74AUP logic family targets ultra-low-power portable electronics - engineered to minimize static/dynamic power while maintaining speed and noise immunity across sub-1V to 3.6V operating ranges.
FAQ
Can 74AUP2G08RA3-7 operate reliably at 0.85V supply?
Yes - the device is fully characterized down to 0.8V, with guaranteed tPD ≤12.9ns (CL=5pF) and VIH/VIL thresholds scaling correctly at 0.85V. Input hysteresis remains functional, and IOFF leakage stays below ±0.6µA across –40°C to +125°C, making it suitable for energy-harvesting systems with dynamically varying rail voltages.
Does the X2-DFN1210-8 package require solder paste stencil adjustments?
Yes - Diodes' AP02001 recommends a 0.12mm-thick stencil with 0.11mm × 0.27mm apertures for the eight perimeter pads and a 0.25mm × 0.25mm aperture for the center thermal pad. Underfill is not required, but reflow profile must achieve peak temperature ≥235°C for void-free thermal pad wetting per JEDEC J-STD-020.
How does IOFF behave when VCC = 0V but inputs are pulled to 1.8V?
With VCC = 0V, the IOFF circuit disables both outputs, limiting leakage to ±0.6µA maximum even if 1.8V is applied to any input or output pin. This prevents current flow from the 1.8V domain into the grounded VCC rail - verified per JESD78 latch-up testing and absolute maximum ratings (VI = –0.5V to VCC + 0.5V).
Is the Schmitt trigger threshold adjustable via external bias?
No - hysteresis is fixed by internal transistor sizing and cannot be adjusted. At VCC = 3.0V, VIH ≈ 2.0V and VIL ≈ 0.9V, yielding ~250mV hysteresis. External resistor dividers on inputs are not recommended, as they degrade noise margin and violate the specified VI range (0 to VCC); use only direct CMOS-level signals.
74AUP2G08RA3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74AUP
- Package/Case:
- 8-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- AND Gate
- Number of Circuits:
- 2
- Number of Inputs:
- 2
- Features:
- -
- Voltage - Supply:
- 0.8V ~ 3.6V
- Current - Quiescent (Max):
- 500 nA
- Current - Output High, Low:
- 4mA, 4mA
- Input Logic Level - Low:
- 0.7V ~ 0.9V
- Input Logic Level - High:
- 1.6V ~ 2V
- Max Propagation Delay @ V, Max CL:
- 6.2ns @ 3.3V, 30pF
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1210-8
74AUP2G08RA3-7 FAQ
1.How can I place an order for 74AUP2G08RA3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP2G08RA3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP2G08RA3-7 reliable?
The price and inventory of 74AUP2G08RA3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP2G08RA3-7 is usually 5 days.
3.What payment methods are accepted for 74AUP2G08RA3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP2G08RA3-7 transactions.
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4.How is shipping managed for 74AUP2G08RA3-7?
74AUP2G08RA3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP2G08RA3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP2G08RA3-7?
For technical support, including 74AUP2G08RA3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP2G08RA3-7 requirements.
6.How does Aetrix verify that 74AUP2G08RA3-7 is sourced from the original manufacturer or authorized distributors?
All 74AUP2G08RA3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP2G08RA3-7 meets industry standards.
7.What is the process for return or replacement of 74AUP2G08RA3-7?
All 74AUP2G08RA3-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G08RA3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP2G08RA3-7 part is unused and in its original packaging.
Return procedure for 74AUP2G08RA3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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