Diodes Incorporated 74AUP2G125RA3-7

Overview

74AUP2G125RA3-7 from Diodes Incorporated is a dual 3-state buffer IC designed for low-power signal routing in battery-operated portable electronics. It features two independent buffers, each with active-low output enable (OE), operates from 0.8 V to 3.6 V, delivers ±4 mA drive at 3.0 V, and supports partial power-down via IOFF. It is used in mobile device data bus isolation and level translation between mixed-voltage subsystems.

For engineers reviewing the 74AUP2G125RA3-7 datasheet, 74AUP2G125RA3-7 pinout, 74AUP2G125RA3-7 application, or 74AUP2G125RA3-7 equivalent, key selection criteria include ultra-low ICC (<0.9 µA), IOFF-enabled power-down protection, Schmitt-trigger inputs (250 mV hysteresis at 3.0 V), and DFN1210-8 package compatibility with high-density PCB layouts.

Technical Context

This Advanced Ultra Low Power (AUP) CMOS device implements two non-inverting 3-state buffers with individual active-low OE controls. Each channel supports rail-to-rail input thresholds defined by VCC-dependent VIH/VIL levels and includes Schmitt-trigger inputs for noise immunity on slow-rising signals.

The IOFF circuit actively disables outputs during power-down, blocking back-current flow when VCC = 0 V, and leakage remains below ±3.5 µA across –40°C to +125°C. Propagation delay ranges from 1.4 ns (3.3 V, CL = 5 pF) to 20.6 ns (0.8 V, CL = 5 pF), with enable/disable times tightly specified across voltage and temperature.

Key Specifications

Pinout & Package

X2-DFN1210-8 is an 8-pin leadless, bottom-terminated package with exposed thermal pad; dimensions are 1.2 mm × 1.0 mm × 0.35 mm and pitch is 0.3 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Compared with SN74AUP2G125DSFR and 74LVC2G125GW,125, the 74AUP2G125RA3-7 uniquely combines sub-1V operation, IOFF protection, and 1.2 mm × 1.0 mm DFN packaging-making it the only option for next-gen wearables requiring simultaneous ultra-low power, small size, and robust power sequencing.

Availability

74AUP2G125RA3-7 is available at Aetrix Electronics and suitable for mobile device bus isolation, low-voltage sensor interfacing, wearable power-rail sequencing, and USB-C auxiliary channel switching requiring stable component supply across high-mix, low-volume production runs.

Supply support for 74AUP2G125RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, low-power solutions for consumer, computing, and industrial markets.

The 74AUP logic family targets ultra-low-power portable electronics, with the 74AUP2G125RA3-7 specifically engineered to extend battery life and simplify power-domain isolation in space-constrained devices.

FAQ

What is the minimum supply voltage for guaranteed operation?

The 74AUP2G125RA3-7 is fully specified from 0.8 V to 3.6 V. At 0.8 V, propagation delay is 20.6 ns (CL = 5 pF), VIH is 0.8 × VCC, and output drive drops to ±20 µA. All DC parameters-including IOFF and ICC-are validated down to 0.8 V per DS36144 Rev. 1–2.

Does this device support hot insertion or live swapping?

Yes-the IOFF feature actively disables outputs when VCC = 0 V, limiting back-current to ±3.5 µA max. This enables safe hot-swap in multi-supply systems, provided OE pins are held LOW before power application and GND is connected first per JESD63 guidelines.

Can unused inputs be left floating?

No. Per Section 4 of DS36144, unused inputs must be tied to VCC or GND to prevent increased ICC and potential oscillation. Floating inputs cause undefined logic states and may elevate static current beyond the 0.9 µA specification due to internal CMOS gate instability.

Is the X2-DFN1210-8 package compatible with standard reflow profiles?

Yes-the X2-DFN1210-8 meets JEDEC J-STD-020D moisture sensitivity level 1 and is qualified for peak reflow temperatures up to 260°C. Recommended pad layout AP02001 specifies 0.25 mm solder mask opening and 0.15 mm stencil aperture for reliable void-free solder joints.