Diodes Incorporated 74AUP2G14FW3-7

Overview

74AUP2G14FW3-7 from Diodes Incorporated is a dual Schmitt trigger inverter IC in X2-DFN0910-6 package, operating from 0.8V to 3.6V supply, delivering ±4mA output drive at 3.0V with ICC < 0.9µA static current and 4pF typical dynamic capacitance (CPD), used for noise-immune signal conditioning in portable battery-powered logic interfaces.

For engineers reviewing the 74AUP2G14FW3-7 datasheet, 74AUP2G14FW3-7 pinout, 74AUP2G14FW3-7 application, or 74AUP2G14FW3-7 equivalent, this device supports partial power-down via IOFF, exhibits hysteresis of 0.79–1.31V at 3.0V, and enables robust timing edge recovery in low-voltage microcontroller I/O expansion, sensor interface debouncing, and USB/SD card voltage-level translation circuits.

Technical Context

This CMOS logic device implements two independent Schmitt-trigger inverters with push-pull outputs and IOFF circuitry that disables outputs during power-down to prevent backflow current. Its input hysteresis (ΔVT) ranges from 0.07V at 0.8V VCC to 1.31V at 3.0V, enabling reliable operation with slow-rising signals such as mechanical switch inputs or RC-debounced lines.

Propagation delay tPD is 2.0ns (typ) at 3.3V with 15pF load, scaling predictably across VCC (1.1ns typ at 3.3V/5pF) and temperature (–40°C to +125°C). Input and output capacitances are each 2.0pF, and the device meets JESD22 ESD ratings: 2kV HBM, 1kV CDM, and 200V MM.

Key Specifications

Pinout & Package

X2-DFN0910-6 is a 0.9mm × 1.0mm × 0.35mm leadless, RoHS-compliant package with 0.35mm pad pitch and exposed thermal pad (not electrically connected).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schmitt trigger inverter applications.

Compared with SN74LVC2G14DBVR and 74LVC2G14GW,125, the 74AUP2G14FW3-7 uniquely supports 0.8V operation and IOFF-making it the only option for true single-cell battery systems requiring safe power-domain isolation.

Availability

74AUP2G14FW3-7 is available at Aetrix Electronics and suitable for battery-powered wearables, IoT sensor nodes, and portable medical devices requiring stable component supply, long-lifecycle assurance, and RoHS/halogen-free compliance.

Supply support for 74AUP2G14FW3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The 74AUP logic family targets ultra-low-power portable electronics, with the 74AUP2G14FW3-7 engineered specifically for noise-immune signal conditioning in space-constrained, battery-sensitive designs.

FAQ

What is the minimum supply voltage for guaranteed operation of 74AUP2G14FW3-7?

The device is fully specified from 0.8V to 3.6V. At 0.8V, VT+ = 0.3V and VT− = 0.1V, providing functional hysteresis and propagation delay of 19.9ns (CL = 5pF). All DC and AC parameters-including IOFF activation and ESD protection-are validated down to 0.8V per DS35512 Rev. 6-2.

Does 74AUP2G14FW3-7 require external pull-up or pull-down resistors on unused inputs?

No. Unused inputs must be tied to VCC or GND per recommended operating conditions (Note 8), but no external resistors are required-the input leakage is ±0.1µA max, and internal structure prevents floating node instability. Leaving inputs unconnected risks undefined output states and increased ICC.

Can 74AUP2G14FW3-7 drive a 50pF capacitive load reliably?

Yes, though with increased propagation delay: tPD rises to 4.2ns (typ) at 3.3V/30pF per datasheet Table 7. For 50pF, extrapolation suggests ~5.0ns delay with acceptable signal integrity; however, layout optimization (short traces, ground plane) is advised to avoid ringing or overshoot due to its 2.0pF CO and fast edge rates.

Is the X2-DFN0910-6 package compatible with standard reflow profiles for lead-free soldering?

Yes. The package is rated for JEDEC J-STD-020D MSL1 handling and withstands peak reflow temperatures up to 260°C. Diodes Incorporated recommends using their AP02001 pad layout and AP02007 taping orientation documents to ensure coplanarity, void-free solder joints, and thermal reliability in high-volume manufacturing.