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Diodes Incorporated 74AUP2G17FW4-7
- Part No.:
- 74AUP2G17FW4-7
- Manufacturer:
- Diodes Incorporated
- Package:
- 6-XFDFN
- Datasheet:
-
74AUP2G17FW4-7.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 6DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,056
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Product details
Overview
74AUP2G17FW4-7 from Diodes Incorporated is a dual Schmitt trigger buffer IC in X2-DFN1010-6 package, operating from 0.8V to 3.6V supply, delivering ±4mA output drive at 3.0V with ICC < 0.9µA static current, designed for noise-immune signal conditioning in ultra-low-power portable systems.
For engineers reviewing the 74AUP2G17FW4-7 datasheet, 74AUP2G17FW4-7 pinout, 74AUP2G17FW4-7 application, or 74AUP2G17FW4-7 equivalent, key selection criteria include input hysteresis (ΔVT = 0.79–1.31V at 3.0V), IOFF-enabled partial power-down capability, and 1.0mm × 1.0mm DFN footprint for space-constrained battery-powered designs.
Technical Context
This device implements two independent non-inverting Schmitt trigger buffers with push-pull outputs and IOFF circuitry that disables outputs during power-down to prevent backflow current. Each channel accepts slow-rising/falling inputs due to ≥0.79V hysteresis at 3.0V supply.
It operates across industrial temperature range (−40°C to +125°C) with guaranteed propagation delay of 2.1ns (typ) at 1.8V/CL=5pF and supports 0.35mm pad pitch layout per JESD30E-compliant X2-DFN1010-6 package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8V to 3.6V - enables direct interface with sub-1V logic and legacy 3.3V systems |
| Input Hysteresis (ΔVT) | 0.79V to 1.31V at 3.0V - rejects noise on slow edges without external RC networks |
| Output Drive | ±4mA at 3.0V - drives standard CMOS loads and short PCB traces without buffering |
| Static Supply Current | <0.9µA - extends battery life in always-on sensor nodes and wearables |
| IOFF Leakage | ±0.2µA max at 0V - prevents current flow between powered/unpowered domains in partial shutdown |
| Propagation Delay | 2.1ns typ at 1.8V/CL=5pF - supports >100MHz signal conditioning in low-voltage domains |
| ESD Protection | 2kV HBM, 1kV CDM - withstands handling and board-level ESD events without protection diodes |
Pinout & Package
X2-DFN1010-6 is a 1.0mm × 1.0mm, 0.4mm height, leadless surface-mount package with 0.35mm pad pitch and exposed thermal pad (not electrically connected). Pin 1 identifier is marked by chamfered corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Data Input Channel 1 | Schmitt-triggered input accepting 0.8–3.6V logic levels with hysteresis |
| GND | Ground Reference | Common return path for both channels; connects to thermal pad for improved heat dissipation |
| 2A | Data Input Channel 2 | Independent Schmitt input with identical threshold behavior as 1A |
| 2Y | Data Output Channel 2 | Push-pull output with IOFF disable when VCC = 0V; sinks/sourses ±4mA at 3.0V |
| VCC | Power Supply | Single-supply rail powering both buffers; IOFF activates automatically if VCC drops below 0.2V |
| 1Y | Data Output Channel 1 | Non-inverting buffered output matching 2Y electrical specs and timing |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Ultra Low Power (AUP) CMOS | Enables operation down to 0.8V while maintaining <0.9µA ICC - critical for coin-cell and energy-harvesting systems |
| Schmitt Trigger Inputs | VT+ = 1.88–2.29V and VT− = 0.88–1.24V at 3.0V - eliminates need for external hysteresis resistors in noisy environments |
| IOFF Partial Power-Down | Outputs go high-impedance when VCC = 0V - allows hot-swapping and domain isolation without latch-up risk |
| Lead-Free & Halogen-Free | RoHS 2 compliant with <900ppm Br+Cl and <1000ppm Sb - meets automotive and medical regulatory requirements |
| Small Footprint | 1.0mm × 1.0mm X2-DFN1010-6 - saves >60% board area vs. SOT363 while maintaining same pinout function |
Applications
| Wireless Sensor Node | USB-C Power Delivery Monitor |
|---|---|
|
Use Scenario: Signal conditioning of analog sensor outputs before ADC sampling in battery-powered IoT endpoints. IC Role / Device Role / Timing Role: Dual Schmitt buffer cleans up slow-rising thermistor or photodiode signals prior to microcontroller input. Use Value: Eliminates external RC filtering and reduces BOM count while ensuring reliable edge detection at 0.8V core voltage. |
Use Scenario: Level-shifting and noise rejection for CC line status signals in USB-C PD controllers. IC Role / Device Role / Timing Role: Buffers CC1/CC2 comparator outputs to MCU GPIOs with hysteresis against cable-induced transients. Use Value: Prevents false plug/unplug detection caused by EMI on 20cm+ USB-C cables operating at 3.3V/1.2V mixed-rail systems. |
| Wearable Health Band | Industrial PLC I/O Module |
|
Use Scenario: Debouncing mechanical switch inputs and conditioning PPG sensor pulses in compact wearable form factors. IC Role / Device Role / Timing Role: Provides clean, glitch-free digital signals to ARM Cortex-M0+ processor running at 0.9V. Use Value: Enables direct connection to sub-1V logic without level translators, reducing power and component count. |
Use Scenario: Isolating field-side digital inputs from controller-side logic in DIN-rail mounted I/O modules. IC Role / Device Role / Timing Role: Acts as input conditioner for 24V dry-contact signals translated to 3.3V logic via optocoupler output stage. Use Value: IOFF prevents backfeed into powered-down controller during maintenance, satisfying IEC 61000-4-5 surge immunity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual Schmitt buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G17DSFR | Wider VCC range (1.65–5.5V); higher ICC (10µA); no IOFF | Requires external power sequencing; unsuitable for partial power-down systems | Select when interfacing with 5V peripherals and IOFF is not required |
| 74LVC2G17GM,132 | Same AUP family but in XSON6 (1.2×1.0mm); slightly larger footprint; identical electrical specs | Compatible layout with minor pad revision; same thermal performance | Choose for design reuse where XSON6 is already qualified |
Compared with SN74LVC2G17DSFR and 74LVC2G17GM,132, the 74AUP2G17FW4-7 uniquely combines sub-1V operation, µA-level ICC, and IOFF in a 1.0mm² footprint - making it optimal for energy-constrained, multi-rail embedded systems requiring robust input noise immunity.
Availability
74AUP2G17FW4-7 is available at Aetrix Electronics and suitable for battery-powered wearables, USB-C peripheral interfaces, and industrial sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 74AUP2G17FW4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.
The 74AUP logic family targets ultra-low-power portable electronics, emphasizing sub-1V operation, nanowatt static consumption, and robust noise immunity for battery-critical designs.
FAQ
What is the minimum supply voltage for guaranteed operation of 74AUP2G17FW4-7?
The device is fully specified from 0.8V to 3.6V. At 0.8V, input thresholds are VT+ = 0.3–0.65V and VT− = 0.1–0.6V, with propagation delay ≤19.9ns (CL = 5pF). All DC and AC parameters are guaranteed across this range per DS35513 Rev. 6-2.
How does IOFF protect the device during partial power-down?
When VCC drops below ~0.2V, the IOFF circuit disables both outputs, limiting leakage to ±0.2µA max. This prevents current backflow from powered downstream logic into the unpowered IC, eliminating risk of latch-up or damage in mixed-voltage systems with staggered power sequencing.
Can 74AUP2G17FW4-7 drive a 50pF load reliably?
No - the datasheet specifies switching characteristics only up to CL = 30pF. At 3.3V/CL = 30pF, tPD max is 6.9ns. Driving 50pF would increase delay unpredictably and may exceed output drive capability, risking signal integrity; use a higher-drive buffer or reduce trace capacitance.
Is the X2-DFN1010-6 package thermally enhanced?
The package includes an exposed thermal pad (dimensions: 0.200mm × 0.550mm) that must be soldered to a PCB copper pour for optimal thermal performance. Junction-to-board thermal resistance (θJB) is 120°C/W typical; θJA depends on PCB layout but improves ≥35% with 100mm² 2-oz copper under the pad.
74AUP2G17FW4-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- 74AUP
- Package/Case:
- 6-XFDFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- Schmitt Trigger
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X2-DFN1010-6
74AUP2G17FW4-7 FAQ
1.How can I place an order for 74AUP2G17FW4-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP2G17FW4-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP2G17FW4-7 reliable?
The price and inventory of 74AUP2G17FW4-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP2G17FW4-7 is usually 5 days.
3.What payment methods are accepted for 74AUP2G17FW4-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP2G17FW4-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74AUP2G17FW4-7?
74AUP2G17FW4-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP2G17FW4-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP2G17FW4-7?
For technical support, including 74AUP2G17FW4-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP2G17FW4-7 requirements.
6.How does Aetrix verify that 74AUP2G17FW4-7 is sourced from the original manufacturer or authorized distributors?
All 74AUP2G17FW4-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP2G17FW4-7 meets industry standards.
7.What is the process for return or replacement of 74AUP2G17FW4-7?
All 74AUP2G17FW4-7 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G17FW4-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP2G17FW4-7 part is unused and in its original packaging.
Return procedure for 74AUP2G17FW4-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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