NXP Semiconductors 74AUP2G240GD,125
- Part No.:
- 74AUP2G240GD,125
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFDFN
- Datasheet:
-
74AUP2G240GD,125.pdf
- Description:
- IC BUFFER INVERT 3.6V 8XSON
- Quantity:
- Payment:

- Shipping:

Inventory:54,000
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Product details
Overview
74AUP2G240GD,125 from Nexperia is a dual inverting 3-state buffer/line driver in XSON8 (SOT996-2) package, operating from 0.8 V to 3.6 V supply. It features Schmitt-trigger inputs for noise immunity, IOFF partial power-down protection, and input-disable functionality. Used in low-power I/O expansion and bus isolation in portable instrumentation and battery-powered microcontroller interfaces.
For engineers reviewing the 74AUP2G240GD,125 datasheet, 74AUP2G240GD,125 pinout, 74AUP2G240GD,125 application, or 74AUP2G240GD,125 equivalent, key selection criteria include ultra-low ICC (≤1.4 μA), wide VCC range (0.8–3.6 V), guaranteed 3-state disable timing (tdis ≤9.1 ns at 3.6 V), IOFF leakage (±0.75 μA), and −40 °C to +125 °C operation.
Technical Context
This device implements two independent inverting buffers with active-low 3-state enable (nOE), where each output assumes high-impedance when nOE is HIGH. Schmitt-trigger inputs ensure robust signal integrity across slow-rising signals and full VCC range.
IOFF circuitry blocks backflow current during partial power-down, while input-disable prevents floating inputs when nOE is asserted. The logic function follows standard LVTTL-compatible truth table: nOE=L → nY = NOT(nA); nOE=H → nY = Z.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - supports single-supply operation across 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic domains |
| ICC (max) | 1.4 μA at −40 °C to +125 °C - enables multi-year battery life in always-on sensor nodes |
| tpd (max) | 6.4 ns at VCC = 3.3 V, CL = 30 pF - ensures timing compliance in 100+ MHz digital control loops |
| tdis (max) | 9.1 ns at VCC = 3.6 V - guarantees clean bus release before next master access in shared I²C/SPI peripheral isolation |
| IOFF Leakage | ±0.75 μA at VCC = 0 V - prevents cross-conduction and system-level latch-up during hot-swap or sleep mode |
| ESD Rating | HBM >5000 V, CDM >1000 V - meets industrial IEC 61000-4-2 Level 4 requirements without external protection |
| Operating Temp | −40 °C to +125 °C - qualified for under-hood automotive, motor drive gate driver interface, and industrial PLC modules |
Pinout & Package
XSON8 package (SOT996-2): plastic extremely thin small outline, no leads, 8 terminals, body size 1.35 × 1.0 × 0.35 mm, wettable flank compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1Y | Inverted output of Channel 1 - drives downstream logic or bus line; enters high-Z when 1OE = HIGH |
| 2 | 2OE | Active-low enable for Channel 2 - tied HIGH disables 2Y; pulled LOW activates inversion path from 2A |
| 3 | VCC | Supply rail - must be decoupled locally; powers internal logic and output drivers |
| 4 | 2A | Data input for Channel 2 - accepts 0–3.6 V; Schmitt-trigger threshold rejects noise on slow edges |
| 5 | 2Y | Inverted output of Channel 2 - electrically isolated from 1Y; shares no internal coupling |
| 6 | 1A | Data input for Channel 1 - independently buffered; supports mixed-voltage interfacing via VIH/VIL specs |
| 7 | 1OE | Active-low enable for Channel 1 - controls 1Y only; allows asymmetric channel enable/disable |
| 8 | GND | Reference ground - must be low-impedance; separates analog/digital return paths in mixed-signal PCBs |
Key Features
| Feature | Design Value |
|---|---|
| Wide VCC range | 0.8 V–3.6 V enables direct interface between 1.2 V FPGA I/O banks and 3.3 V legacy peripherals |
| Schmitt-trigger inputs | Input hysteresis ≥0.3 V at 1.8 V ensures reliable sampling of noisy or slow-rising sensor signals |
| IOFF partial power-down | Blocks current flow when VCC = 0 V - critical for hot-plug USB-C accessory detection and PCIe slot power sequencing |
| Input-disable on nOE HIGH | Prevents floating inputs during 3-state mode - eliminates need for external pull-ups in battery-critical designs |
| Low-noise switching | Overshoot/undershoot <10 % of VCC reduces EMI in EMC-sensitive medical and audio subsystems |
Applications
| Industrial Sensor Interface | Low-Power MCU I/O Expansion |
|---|---|
|
Use Scenario: Isolating analog sensor ADC reference lines from noisy digital MCU GPIOs in factory-floor temperature monitoring nodes. IC Role / Device Role / Timing Role: Dual-channel 3-state buffer provides bidirectional signal direction control and VCC domain separation between 1.8 V sensor ASIC and 3.3 V host MCU. Use Value: Schmitt-trigger inputs reject EMI-induced glitches on long traces; IOFF prevents backfeed during MCU sleep cycles. |
Use Scenario: Expanding GPIO count on an ARM Cortex-M0+ microcontroller in a wearable health monitor with strict 20 μA sleep budget. IC Role / Device Role / Timing Role: Inverting buffer drives LED indicators and button debouncing logic while maintaining sub-μA static current draw. Use Value: ICC ≤1.4 μA at 125 °C extends battery life beyond 3 years; compact XSON8 footprint saves PCB area. |
| Automotive Body Control Module | USB-C Accessory Detection |
|
Use Scenario: Level-shifting and isolating LIN bus transceiver enable signals in a vehicle door module operating at 125 °C ambient. IC Role / Device Role / Timing Role: 3-state output buffers isolate transceiver EN pin from MCU during firmware update reset sequences. Use Value: Guaranteed operation up to +125 °C and HBM >5 kV withstands under-hood ESD events without derating. |
Use Scenario: Detecting USB-C plug orientation and CC line state in a portable docking station with dual-role port controller. IC Role / Device Role / Timing Role: Inverting buffer conditions CC line voltage for Type-C controller; IOFF prevents current leakage when VBUS is absent. Use Value: Input-disable feature eliminates external bias resistors; ±0.75 μA IOFF enables true zero-power detection mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual inverting buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC2G240GW,125 | Higher ICC (max 40 μA), narrower VCC (1.65–5.5 V), no IOFF or input-disable | Lacks partial power-down - unsuitable for battery-backed systems requiring zero-leakage sleep states | Select only if higher drive strength (24 mA) and 5 V tolerance are required, and power-down is not needed |
| SN74AUP2G240DSFR | Same core logic but in US8 (VSSOP8) package; identical electrical specs per TI datasheet SNOSBQ9F | Requires larger PCB footprint (2.3 mm body width vs. 1.0 mm) and lacks wettable flanks for automated optical inspection | Choose for legacy board compatibility or when hand-soldering is preferred over reflow of XSON8 |
Compared with 74LVC2G240GW,125 and SN74AUP2G240DSFR, the 74AUP2G240GD,125 uniquely delivers sub-μA static current, IOFF protection, and 1.0 mm width XSON8 packaging - making it optimal for space-constrained, battery-operated, and thermally demanding applications.
Availability
74AUP2G240GD,125 is available at Aetrix Electronics and suitable for industrial sensor interface, low-power MCU I/O expansion, automotive body control modules, and USB-C accessory detection requiring stable component supply across extended temperature ranges.
Supply support for 74AUP2G240GD,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance logic, discrete, and MOSFET solutions with focus on efficiency, reliability, and miniaturization.
The 74AUP (Advanced Ultra-low Power) product line targets battery-powered and thermally constrained applications, emphasizing sub-μA quiescent current, wide VCC flexibility, and robust ESD/IOFF protection.
FAQ
What is the maximum propagation delay for 74AUP2G240GD,125 at 3.3 V and 30 pF load?
At VCC = 3.3 V and CL = 30 pF, the maximum propagation delay (tpd) is 6.4 ns across −40 °C to +125 °C, measured from input transition to valid output level (tPLH/tPHL). This value is specified in Table 8 of the Nexperia datasheet Rev. 11 and ensures timing closure in high-speed digital control paths.
Does 74AUP2G240GD,125 support partial power-down when VCC is disconnected?
Yes. Its IOFF circuitry actively disables outputs and limits power-off leakage to ±0.75 μA when VCC = 0 V, preventing damaging backflow current into powered sections of the system. This is verified in Table 7 (IOFF parameter) and enables safe hot-swap and multi-rail power sequencing.
Can the inputs tolerate voltages above VCC, such as 3.6 V when VCC = 1.8 V?
Yes. Inputs accept voltages up to 3.6 V regardless of VCC level, as confirmed in Section 2 ("Features and benefits") and Table 6 (VI max = 3.6 V). This allows level-shifting from higher-voltage peripherals into lower-VCC logic domains without external clamping diodes.
Is the XSON8 package of 74AUP2G240GD,125 compatible with standard reflow profiles?
Yes. The SOT996-2 (XSON8) package is qualified for IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260 °C. Its 0.35 mm height and wettable flanks support automated optical inspection and reliable solder joint formation in high-volume SMT assembly.
74AUP2G240GD,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74AUP
- Package/Case:
- 8-XFDFN
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON (2x3)
74AUP2G240GD,125 FAQ
1.How can I place an order for 74AUP2G240GD,125 through Aetrix?
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6.How does Aetrix verify that 74AUP2G240GD,125 is sourced from the original manufacturer or authorized distributors?
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7.What is the process for return or replacement of 74AUP2G240GD,125?
All 74AUP2G240GD,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G240GD,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP2G240GD,125 part is unused and in its original packaging.
Return procedure for 74AUP2G240GD,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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