NXP Semiconductors 74AUP2G241GF,115
- Part No.:
- 74AUP2G241GF,115
- Manufacturer:
- NXP Semiconductors
- Package:
- 8-XFDFN
- Datasheet:
-
74AUP2G241GF,115.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 8XSON
- Quantity:
- Payment:

- Shipping:

Inventory:5,000
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
74AUP2G241GF,115 from NXP Semiconductors is a dual non-inverting 3-state buffer/line driver in XSON8 package (1.35 × 1.0 × 0.5 mm), operating from 0.8 V to 3.6 V supply, with Schmitt-trigger inputs, IOFF partial power-down support, and input-disable functionality. It enables bidirectional signal buffering in low-voltage I/O expansion and bus isolation applications.
For engineers reviewing the 74AUP2G241GF,115 datasheet, 74AUP2G241GF,115 pinout, 74AUP2G241GF,115 application, or 74AUP2G241GF,115 equivalent, key selection criteria include its ultra-low ICC (≤1.4 µA max), asymmetric output enable logic (1OE active LOW, 2OE active HIGH), wide VCC range tolerance, and guaranteed operation up to +125 °C.
Technical Context
This device implements two independent non-inverting buffers, each with configurable 3-state output control: 1Y is enabled by LOW on 1OE, while 2Y is enabled by HIGH on 2OE. Schmitt-trigger inputs ensure robust noise immunity across the full 0.8–3.6 V VCC range, supporting slow-rising signals without oscillation.
The IOFF circuit actively disables outputs when VCC = 0 V, blocking damaging backflow current during partial power-down. Input-disable behavior-where 1A is disabled when 1OE = HIGH and 2A is disabled when 2OE = LOW-prevents floating-input leakage and reduces dynamic power in inactive channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 3.6 V - supports direct interface with 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic domains without level shifters. |
| Max ICC (Static) | 1.4 µA at −40 °C to +125 °C - enables battery-powered and always-on systems with negligible quiescent drain. |
| Propagation Delay (tpd) | 1.2 ns min / 4.4 ns max at VCC = 3.0–3.6 V, CL = 5 pF - ensures timing-critical signal routing in high-speed digital interfaces. |
| Enable/Disable Times | ten ≤ 4.8 ns, tdis ≤ 3.9 ns at VCC = 3.0–3.6 V, CL = 5 pF - provides fast bus arbitration and clean output state transitions. |
| Operating Temperature | −40 °C to +125 °C - qualified for under-hood automotive, industrial motor control, and harsh-environment embedded systems. |
| ESD Protection | HBM > 5000 V, MM > 200 V, CDM > 1000 V - meets stringent IEC 61000-4-2 requirements for system-level robustness. |
| IOFF Leakage | ±0.75 µA at VCC = 0 V - prevents current backfeed during hot-swap or multi-rail sequencing scenarios. |
Pinout & Package
XSON8 package (SOT1089): extremely thin small outline, no leads, 8-terminal surface-mount, body dimensions 1.35 mm × 1.0 mm × 0.5 mm, wettable flank compatible.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1Y | Buffer 1 output - non-inverting, 3-state, driven only when 1OE = LOW. |
| 2 | 2OE | Output enable for buffer 2 - active HIGH; asserts 2Y when HIGH, places 2Y in high-Z when LOW. |
| 3 | VCC | Positive supply rail - powers internal logic and output drivers; decoupling required within 2 mm. |
| 4 | 2A | Buffer 2 input - non-inverting data input; disabled (high-impedance) when 2OE = LOW. |
| 5 | 2Y | Buffer 2 output - non-inverting, 3-state, driven only when 2OE = HIGH. |
| 6 | 1A | Buffer 1 input - non-inverting data input; disabled (high-impedance) when 1OE = HIGH. |
| 7 | 1OE | Output enable for buffer 1 - active LOW; asserts 1Y when LOW, places 1Y in high-Z when HIGH. |
| 8 | GND | Ground reference - must be connected to system common ground plane with low-inductance path. |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetric Output Enable Logic | 1OE active LOW and 2OE active HIGH allow independent, polarity-matched control of two buses sharing one chip. |
| Input-Disable Functionality | Disables 1A when 1OE = HIGH and 2A when 2OE = LOW - eliminates input leakage and reduces dynamic switching current in idle mode. |
| Schmitt-Trigger Inputs | Provides ≥0.3×VCC hysteresis across 0.8–3.6 V - tolerates slow edges and noisy signals without false triggering. |
| IOFF Partial Power-Down | Blocks backflow current when VCC = 0 V - essential for hot-plug, multi-supply domain, and energy-harvesting systems. |
| Ultra-Low Dynamic Power | CPD = 4.2 pF at 3.3 V - minimizes switching power in high-frequency clock/data distribution paths. |
Applications
| Industrial Sensor Interface | Automotive Body Control Module |
|---|---|
|
Use Scenario: Isolating analog sensor ADC inputs from noisy microcontroller GPIOs in factory-floor PLCs. IC Role / Device Role / Timing Role: Dual buffer isolates bidirectional I²C/SPI lines and enables/disables sensor readout paths on demand. Use Value: Schmitt-trigger inputs reject EMI-induced glitches on long traces; IOFF prevents cross-talk during MCU sleep states. |
Use Scenario: Level-shifting and bus isolation between 1.8 V infotainment SoC and 3.3 V CAN transceiver peripherals. IC Role / Device Role / Timing Role: Non-inverting buffer drives 3.3 V logic signals while accepting 1.8 V inputs via VCC = 1.8 V operation. Use Value: Wide 0.8–3.6 V VCC range eliminates external level shifters; ±0.75 µA IOFF leakage ensures safe multi-rail sequencing. |
| Portable Medical Wearable | Low-Power IoT Edge Node |
|
Use Scenario: Enabling/disabling serial debug (SWD) and sensor data lines in battery-operated pulse oximeters. IC Role / Device Role / Timing Role: 3-state outputs isolate debug port during normal operation to reduce standby current. Use Value: 1.4 µA max ICC extends battery life; input-disable feature suppresses leakage when debug interface is unpowered. |
Use Scenario: Managing shared SPI flash and environmental sensor buses in sub-GHz wireless sensor nodes. IC Role / Device Role / Timing Role: Dual buffer routes SPI MISO/MOSI while enabling/disabling peripheral access via separate OE controls. Use Value: Asymmetric OE logic allows independent activation of flash vs. sensor; 4.4 ns tpd supports 100+ MHz SPI clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74AUP2G241DSFR | Same function, X2SON8 (1.0 × 1.0 × 0.35 mm); slightly smaller footprint but identical pinout and electrical specs. | Preferred where board space is constrained and 0.35 mm height is critical (e.g., ultra-thin wearables). | Select SN74AUP2G241DSFR if PCB real estate or Z-height is prioritized over thermal mass; same JEDEC-compliant operation. |
| 74LVC2G241GW,125 | Higher ICC (max 40 µA), narrower VCC range (1.65–5.5 V), no IOFF or input-disable features. | Limited to single-rail 3.3 V/5 V systems without partial power-down requirements. | Choose 74LVC2G241GW,125 only for cost-sensitive, non-power-critical 3.3 V designs where IOFF is unnecessary. |
Compared with SN74AUP2G241DSFR and 74LVC2G241GW,125, the 74AUP2G241GF,115 delivers superior ultra-low-power performance, broader voltage flexibility, and essential IOFF protection-making it the optimal choice for thermally constrained, multi-rail, or battery-operated designs requiring guaranteed +125 °C operation.
Availability
74AUP2G241GF,115 is available at Aetrix Electronics and suitable for industrial sensor interface, automotive body control, portable medical wearable, and low-power IoT edge node applications requiring stable component supply across extended temperature ranges.
Supply support for 74AUP2G241GF,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in low-power logic and mixed-signal integration.
The 74AUP (Advanced Ultra-low Power) family targets energy-constrained applications demanding sub-microamp quiescent current, wide VCC scalability, and robust operation in harsh environments-designed specifically for next-generation portable, automotive, and industrial electronics.
FAQ
What is the maximum operating temperature for the 74AUP2G241GF,115?
The 74AUP2G241GF,115 is fully specified from −40 °C to +125 °C, with all static and dynamic parameters guaranteed across this extended industrial temperature range. This makes the 74AUP2G241GF,115 suitable for under-hood automotive modules, motor drive controllers, and outdoor industrial equipment where ambient temperatures exceed standard commercial limits.
Does the 74AUP2G241GF,115 support partial power-down (IOFF)?
Yes, the 74AUP2G241GF,115 integrates IOFF circuitry that disables outputs and blocks backflow current when VCC = 0 V. Measured IOFF leakage is ±0.75 µA, ensuring safe operation during hot-swap events or multi-rail power sequencing. This feature is explicitly verified in the 74AUP2G241GF,115 datasheet Section 10, Table 7.
How does the asymmetric output enable logic work on the 74AUP2G241GF,115?
The 74AUP2G241GF,115 uses asymmetric enable logic: 1OE is active LOW (1Y enabled when 1OE = LOW), while 2OE is active HIGH (2Y enabled when 2OE = HIGH). This allows independent, polarity-matched control of two different bus segments-for example, matching OE polarity to upstream controller signals without inverters. The 74AUP2G241GF,115 function table (Table 4) confirms this behavior.
Can the 74AUP2G241GF,115 accept 3.6 V inputs while powered from 1.8 V?
Yes, the 74AUP2G241GF,115 inputs tolerate voltages up to 3.6 V regardless of VCC level, enabling safe interfacing with higher-voltage peripherals while operating from 1.8 V. This is confirmed in Section 2 ("Features and benefits") and Table 7 (VI absolute max = +4.6 V, VI recommended max = +3.6 V), making the 74AUP2G241GF,115 ideal for mixed-voltage system bridging.
What is the typical propagation delay of the 74AUP2G241GF,115 at 3.3 V?
At VCC = 3.0–3.6 V and CL = 5 pF, the 74AUP2G241GF,115 exhibits a typical propagation delay (tpd) of 2.4 ns, with a maximum of 3.1 ns over temperature. These values are measured per Figure 7 and Table 8, and apply to both 1A→1Y and 2A→2Y paths. The 74AUP2G241GF,115 maintains consistent timing across its full operating range due to its optimized AUP process.
74AUP2G241GF,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- 74AUP
- Package/Case:
- 8-XFDFN
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 4mA, 4mA
- Voltage - Supply:
- 0.8V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XSON (1.35x1)
74AUP2G241GF,115 FAQ
1.How can I place an order for 74AUP2G241GF,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP2G241GF,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP2G241GF,115 reliable?
The price and inventory of 74AUP2G241GF,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP2G241GF,115 is usually 5 days.
3.What payment methods are accepted for 74AUP2G241GF,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP2G241GF,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74AUP2G241GF,115?
74AUP2G241GF,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP2G241GF,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP2G241GF,115?
For technical support, including 74AUP2G241GF,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP2G241GF,115 requirements.
6.How does Aetrix verify that 74AUP2G241GF,115 is sourced from the original manufacturer or authorized distributors?
All 74AUP2G241GF,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP2G241GF,115 meets industry standards.
7.What is the process for return or replacement of 74AUP2G241GF,115?
All 74AUP2G241GF,115 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G241GF,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP2G241GF,115 part is unused and in its original packaging.
Return procedure for 74AUP2G241GF,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
74AUP2G241GF,115 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments

-
SN74LVC2G17DBVR
Texas Instruments

-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments

-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

