Nexperia USA Inc. 74AUP2G32GM,125
- Part No.:
- 74AUP2G32GM,125
- Manufacturer:
- Nexperia USA Inc.
- Category:
- Gates and Inverters
- Package:
- 8-XFQFN Exposed Pad
- Datasheet:
-
74AUP2G32GM,125.pdf
- Description:
- IC GATE OR 2CH 2-INP 8XQFN
- Quantity:
- Payment:

- Shipping:

Inventory:150
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Product details
Overview
74AUP2G32GM,125 from Nexperia is a low-power dual 2-input OR gate logic IC with Schmitt-trigger inputs, operating across 0.8 V to 3.6 V supply, delivering ≤0.9 μA max ICC at 25 °C, and supporting partial power-down via IOFF circuitry. It is used in battery-powered sensor interface signal conditioning where noise immunity and ultra-low static power are critical.
For engineers reviewing the 74AUP2G32GM,125 datasheet, 74AUP2G32GM,125 pinout, 74AUP2G32GM,125 application, or 74AUP2G32GM,125 equivalent, key selection factors include its 0.8 V minimum VCC support, IOFF-enabled power-gating capability, Schmitt-trigger input hysteresis for slow-edge tolerance, and XQFN8 (SOT902-2) package compatibility with high-density PCB layouts.
Technical Context
This device implements two independent OR logic functions with Schmitt-trigger inputs on all four inputs (1A/1B/2A/2B), enabling robust operation with slow-rising or noisy signals. Each output (1Y/2Y) drives CMOS loads with rail-to-rail swing and supports IOFF state when VCC = 0 V, blocking backflow current.
It complies with JEDEC standards JESD8-12 through JESD8C across five VCC ranges and meets HBM ESD >5000 V and CDM >1000 V. The logic function follows standard OR truth table: output HIGH if ≥1 input is HIGH; LOW only when both inputs are LOW.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 0.8 V to 3.6 V - enables direct interfacing with 0.9 V, 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic domains without level shifters. |
| ICC (max) | 0.9 μA at 25 °C - ensures negligible quiescent current draw in always-on IoT sensor nodes and wearable standby circuits. |
| IOFF Leakage | ±0.75 μA at VCC = 0 V - prevents damaging back-current during hot-swap or partial system power-down sequences. |
| tpd (typ) | 2.1 ns at VCC = 3.0 V, CL = 5 pF - provides sub-3 ns propagation delay suitable for timing-critical glue logic in microcontroller peripheral expansion. |
| VIH/VIL Hysteresis | Input Schmitt-trigger action - rejects <100 mV noise spikes and tolerates rise/fall times up to 200 ns/V, easing signal integrity in noisy industrial environments. |
| Operating Temp | –40 °C to +125 °C - qualified for under-hood automotive ECUs, industrial PLC I/O modules, and outdoor edge computing hardware. |
Pinout & Package
XQFN8 package (SOT902-2): plastic ultra-thin quad flat no-lead, 1.4 × 1.2 × 0.45 mm body, 0.4 mm pitch, wettable flank terminals, thermal pad exposed on bottom for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 2A | Input A of Gate 1 / Gate 2 | Dual independent OR gate first inputs; accept 0.8–3.6 V logic levels with Schmitt-trigger hysteresis. |
| 1B, 2B | Input B of Gate 1 / Gate 2 | Dual independent OR gate second inputs; identical electrical behavior to 1A/2A pins. |
| 1Y, 2Y | Output Y of Gate 1 / Gate 2 | CMOS-compatible push-pull outputs; drive ±20 mA, support rail-to-rail swing, and enter high-Z during IOFF. |
| GND | Ground reference | Primary return path for logic and leakage currents; must be low-impedance for stable noise immunity. |
| VCC | Supply voltage | Single-supply rail powering both gates; IOFF activates automatically when VCC = 0 V. |
| EPAD | Exposed thermal pad | Internally connected to GND; soldering improves thermal performance and mechanical reliability in high-reliability assemblies. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low static power | 0.9 μA max ICC enables multi-year battery life in coin-cell-powered wireless sensors and remote monitors. |
| IOFF partial power-down | Blocks backflow current when VCC = 0 V - essential for live-insertion in modular industrial backplanes and hot-swappable I/O cards. |
| Schmitt-trigger inputs | Hysteresis >100 mV at 3.3 V - eliminates contact bounce artifacts in mechanical switch debouncing and noisy encoder interfaces. |
| Wide VCC compatibility | Operates from 0.8 V (sub-threshold logic) to 3.6 V (3.3 V systems) - simplifies mixed-voltage board design without discrete level translators. |
| High ESD robustness | HBM >5000 V and CDM >1000 V - reduces field failure risk in manual assembly, test handling, and unshielded industrial enclosures. |
Applications
| Industrial Sensor Interface | Automotive Body Control Module |
|---|---|
|
Use Scenario: Combining door-open and trunk-latch status signals before feeding to MCU GPIO with weak pull-ups. IC Role / Device Role / Timing Role: Dual OR gate aggregates two independent mechanical switch inputs into single wake-up interrupt line. Use Value: Eliminates need for external diode-OR or software polling; Schmitt-trigger inputs reject EMI-induced glitches on long harness runs. |
Use Scenario: Merging brake-light activation and hazard-flash enable signals to drive shared LED driver enable pin. IC Role / Device Role / Timing Role: Logic-level OR function ensures brake lights illuminate even when hazard flasher is active. Use Value: IOFF prevents backfeed from 12 V LED driver circuit into 3.3 V MCU domain during ignition-off state. |
| Wearable Health Monitor | Smart Home Motion Detector |
|
Use Scenario: OR-ing PPG sensor interrupt and accelerometer activity-detection pulses to trigger low-power MCU wake-up. IC Role / Device Role / Timing Role: Ultra-low ICC gate enables always-on sensing with sub-1 μA total standby current budget. Use Value: 0.8 V minimum VCC allows direct connection to buck-boost regulator output, avoiding extra LDO dropout loss. |
Use Scenario: Combining passive infrared (PIR) and microwave Doppler sensor outputs to reduce false alarms in occupancy detection. IC Role / Device Role / Timing Role: Dual OR gate performs hardware-level sensor fusion before microcontroller processing. Use Value: Sub-3 ns tpd ensures real-time response to motion events; Schmitt inputs suppress RF coupling noise from microwave transceiver. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 2-input OR gate applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC2G32GW,125 | Higher ICC (max 4 μA), no Schmitt inputs, 1.65–5.5 V VCC range | Lacks slow-edge tolerance; unsuitable for mechanical switch or long-trace inputs without external RC filtering | Select when higher drive strength (±24 mA) and 5 V compatibility are required, and input edges are clean. |
| SN74AUP2G32DCUR | Same core specs but in VSSOP8 (SOT765-1); larger footprint (2.3 mm width), no thermal pad | Less suitable for space-constrained wearables or thermally demanding environments due to lower thermal efficiency | Select when legacy VSSOP8 footprint compatibility or hand-soldering preference outweighs size/thermal advantages of XQFN8. |
Compared with 74LVC2G32GW,125 and SN74AUP2G32DCUR, the 74AUP2G32GM,125 uniquely balances ultra-low ICC, Schmitt-trigger noise immunity, and XQFN8 thermal/space efficiency - making it optimal for miniaturized, battery-critical, and electrically noisy applications where other variants trade off one or more of these attributes.
Availability
74AUP2G32GM,125 is available at Aetrix Electronics and suitable for industrial sensor interface, automotive body control, wearable health monitoring, and smart home motion detection requiring stable component supply across extended temperature and low-power operating conditions.
Supply support for 74AUP2G32GM,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and MOSFET solutions, serving automotive, industrial, and consumer markets with ISO/TS 16949-certified manufacturing.
The 74AUP (Advanced Ultra-low Power) product line delivers sub-1 μA logic ICs optimized for energy-constrained edge devices, emphasizing ultra-low ICC, wide VCC scalability, and robust IOFF functionality for modern power-aware system architectures.
FAQ
Does 74AUP2G32GM,125 support true bidirectional operation?
No. It is a unidirectional logic gate with defined inputs (1A/1B/2A/2B) and outputs (1Y/2Y). Neither inputs nor outputs are designed for reverse current flow or bus arbitration. The IOFF feature disables outputs when VCC = 0 V but does not enable input/output role reversal.
Can 74AUP2G32GM,125 drive a 50 pF capacitive load reliably?
Yes - though propagation delay increases to ~8.5 ns at VCC = 3.0 V and CL = 30 pF (per datasheet Table 8), the device maintains valid VOH/VOL levels and timing margins up to 50 pF. For CL > 30 pF, verify setup/hold timing against your MCU's input requirements using worst-case tpd values.
Is the EPAD on SOT902-2 internally connected?
Yes - the exposed thermal pad (EPAD) is internally tied to GND per Nexperia's package drawing SOT902-2. It must be soldered to a GND plane for optimal thermal performance, mechanical stability, and ESD current shunting; floating or unconnected EPAD degrades reliability and noise immunity.
What happens to output states during VCC ramp-up?
Outputs remain in high-impedance (Hi-Z) until VCC reaches ~0.5 V, then transition to valid logic states as supply stabilizes. The IOFF circuit ensures no output contention or backfeed occurs during power sequencing - critical for safe integration into multi-rail systems with staggered power-up sequences.
74AUP2G32GM,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Series:
- 74AUP
- Package/Case:
- 8-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- OR Gate
- Number of Circuits:
- 2
- Number of Inputs:
- 2
- Features:
- -
- Voltage - Supply:
- 0.8V ~ 3.6V
- Current - Quiescent (Max):
- 500 nA
- Current - Output High, Low:
- 4mA, 4mA
- Input Logic Level - Low:
- 0.7V ~ 0.9V
- Input Logic Level - High:
- 1.6V ~ 2V
- Max Propagation Delay @ V, Max CL:
- 6.4ns @ 3.3V, 30pF
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XQFN (1.6x1.6)
74AUP2G32GM,125 FAQ
1.How can I place an order for 74AUP2G32GM,125 through Aetrix?
Please submit a Request for Quotation (RFQ) for 74AUP2G32GM,125 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 74AUP2G32GM,125 reliable?
The price and inventory of 74AUP2G32GM,125 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AUP2G32GM,125 is usually 5 days.
3.What payment methods are accepted for 74AUP2G32GM,125?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 74AUP2G32GM,125 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 74AUP2G32GM,125?
74AUP2G32GM,125 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 74AUP2G32GM,125 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 74AUP2G32GM,125?
For technical support, including 74AUP2G32GM,125 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AUP2G32GM,125 requirements.
6.How does Aetrix verify that 74AUP2G32GM,125 is sourced from the original manufacturer or authorized distributors?
All 74AUP2G32GM,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP2G32GM,125 meets industry standards.
7.What is the process for return or replacement of 74AUP2G32GM,125?
All 74AUP2G32GM,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP2G32GM,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP2G32GM,125 part is unused and in its original packaging.
Return procedure for 74AUP2G32GM,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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