Diodes Incorporated 74AUP2G32RA3-7

Overview

74AUP2G32RA3-7 from Diodes Incorporated is a dual 2-input OR gate in the Advanced Ultra Low Power (AUP) CMOS logic family, designed for battery-powered portable systems. It operates from 0.8V to 3.6V, delivers ±4mA output drive at 3.0V, features IOFF partial power-down protection, and uses Schmitt-trigger inputs with ~250mV hysteresis at VCC = 3.0V for noise immunity in low-slew-rate signal paths.

For engineers reviewing the 74AUP2G32RA3-7 datasheet, 74AUP2G32RA3-7 pinout, 74AUP2G32RA3-7 application, or 74AUP2G32RA3-7 equivalent, key selection criteria include ultra-low ICC (<0.9µA), wide VCC range compatibility, IOFF-enabled system-level power sequencing, and DFN1210-8 footprint constraints in space-constrained mobile designs.

Technical Context

This device implements two independent positive-logic OR functions (Y = A + B) using push-pull CMOS outputs. Its IOFF circuit actively disables outputs during power-down to prevent back-current flow between powered and unpowered rails - critical for mixed-voltage domain interconnects in modern portable SoC subsystems.

Schmitt-trigger inputs provide defined switching thresholds and hysteresis (~250mV at 3.0V), enabling reliable operation with slow-rising signals from sensors or legacy interfaces. Propagation delay ranges from 1.0ns (typ, 3.3V, CL=5pF) to 8.5ns (max, -40°C to +125°C, CL=30pF), supporting timing-critical control logic in low-power microcontroller peripherals.

Key Specifications

Pinout & Package

X2-DFN1210-8 package: 1.2mm × 1.0mm × 0.35mm body, 0.3mm lead pitch, bottom thermal pad, no leads - optimized for high-density PCB layouts and thermal dissipation in thin-profile handheld devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 2-input OR gate applications.

Compared with SN74AUP2G32DSFR and 74LVC2G32GM,132, the 74AUP2G32RA3-7 uniquely combines ultra-low ICC, IOFF, and DFN1210-8 thermal performance - making it optimal for miniaturized, battery-operated devices requiring robust power sequencing.

Availability

74AUP2G32RA3-7 is available at Aetrix Electronics and suitable for mobile device power sequencing, low-power sensor interface, USB-C port controller logic, and industrial edge node status aggregation requiring stable component supply across long-lifecycle consumer and industrial programs.

Supply support for 74AUP2G32RA3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and precision timing solutions for consumer, industrial, and automotive markets.

The AUP logic family targets ultra-low-power portable electronics, delivering sub-1µA static current and wide-VCC operation to extend battery life while maintaining robust noise immunity and system-level power sequencing capability.

FAQ

Does 74AUP2G32RA3-7 support true bidirectional signal flow?

No. It is a unidirectional logic gate with defined inputs (1A/1B/2A/2B) and outputs (1Y/2Y). The IOFF feature disables outputs during power-down but does not enable reverse signal propagation. Inputs remain high-impedance CMOS nodes regardless of VCC state.

Can unused inputs be left floating?

No. Per Diodes' Recommended Operating Conditions (Note 8), all unused inputs must be tied to VCC or GND. Floating inputs cause increased ICC, potential oscillation, and unpredictable output states due to CMOS threshold sensitivity - especially critical in ultra-low-power designs.

What is the maximum capacitive load this device can drive reliably?

Electrical characteristics are specified up to CL = 30pF. At 3.3V, tpd increases from 2.1ns (CL = 5pF) to 8.5ns (CL = 30pF, -40°C to +125°C). For timing-critical paths, keep CL ≤15pF; for non-critical enable/control lines, 30pF is supported with verified setup/hold margins.

Is the X2-DFN1210-8 package compatible with standard reflow profiles?

Yes. The package is qualified for JEDEC J-STD-020D moisture sensitivity level 1 (MSL1) and supports standard Pb-free reflow profiles (peak 260°C, 20–40 sec above 217°C). Thermal pad soldering requires controlled stencil aperture (0.25mm × 0.25mm) and 50% paste coverage to ensure mechanical reliability.