NXP Semiconductors 74AUP3G17GM,125
- Part No.:
- 74AUP3G17GM,125
- Manufacturer:
- NXP Semiconductors
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- -
- Datasheet:
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74AUP3G17GM,125.pdf
- Description:
- NEXPERIA 74AUP3G17 - LOW-POWER T
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Product details
Overview
74AUP3G17GM,125 from Nexperia is a low-power triple Schmitt trigger buffer IC in XQFN8 (SOT902-2) package, providing three independent hysteresis-input buffers for noise-immune signal conditioning. It operates from 0.8 V to 3.6 V, delivers ≤0.9 μA max ICC at 25 °C, supports IOFF partial power-down, and ensures jitter-free output transitions on slow-rising inputs - used in battery-powered sensor interfaces and I²C bus level-shifting circuits.
For engineers reviewing the 74AUP3G17GM,125 datasheet, 74AUP3G17GM,125 pinout, 74AUP3G17GM,125 application, or 74AUP3G17GM,125 equivalent, this page delivers verified functional identity, confirmed VSSOP/XSON/XQFN8 package mapping, validated 8-pin terminal roles, real-world hysteresis voltage (VH = 0.79–1.31 V at VCC = 3.0 V), propagation delay (tpd = 1.5–4.0 ns at CL = 5 pF), and direct alternative part comparisons - all extracted from Nexperia's Rev. 4 (2023) product data sheet.
Technical Context
This device implements three independent Schmitt-trigger input stages with asymmetric switching thresholds (VT+ and VT−), delivering input hysteresis (VH) that rejects noise up to ±500 mV on slow edges. Each buffer drives CMOS-compatible outputs with rail-to-rail swing and supports IOFF circuitry to isolate outputs during partial power-down.
It is specified across −40 °C to +125 °C, features ESD protection exceeding 5000 V HBM and 1000 V CDM, and maintains sub-1 μA static current across its full 0.8–3.6 V supply range - enabling use in ultra-low-power always-on subsystems without compromising signal integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage Range | 0.8 V to 3.6 V - enables direct interface with 1.2 V, 1.8 V, 2.5 V, and 3.3 V logic domains without level shifters |
| Max Static Supply Current | 0.9 μA at 25 °C - reduces quiescent power in battery-backed monitoring nodes |
| Hysteresis Voltage (VH) | 0.79–1.31 V at VCC = 3.0 V - provides robust noise margin against EMI-induced glitches on long traces |
| Propagation Delay | 1.5–4.0 ns at CL = 5 pF, VCC = 3.0–3.6 V - supports >200 MHz signal edge clean-up in timing-critical paths |
| IOFF Leakage Current | ±0.75 μA at VCC = 0 V - prevents backfeed current when one supply rail is powered down in mixed-voltage systems |
| Input Voltage Tolerance | Up to 3.6 V regardless of VCC - allows safe interfacing with higher-voltage peripherals in partial-power-down mode |
| Operating Temperature | −40 °C to +125 °C - qualified for industrial control, automotive body electronics, and outdoor IoT endpoints |
Pinout & Package
XQFN8 (SOT902-2) package: plastic extremely thin quad flat no-lead, 8-terminal, body size 1.5 × 1.5 × 0.55 mm, wettable flank leads, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 2A, 3A | Independent Schmitt-trigger inputs | Accept slow-rising/falling signals; each has dedicated VT+ and VT− thresholds for hysteresis |
| 1Y, 2Y, 3Y | CMOS-compatible buffered outputs | Drive loads up to ±4 mA; rail-to-rail swing; actively driven in normal mode, high-Z in IOFF |
| VCC | Primary supply rail | Power source for all three buffers; IOFF disables outputs only when VCC = 0 V |
| GND | Reference ground | Return path for supply and signal currents; required for proper hysteresis threshold referencing |
| EPAD | Exposed thermal pad | Internally connected to GND; must be soldered to PCB ground plane for thermal dissipation and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Triple independent Schmitt buffers | Enables simultaneous conditioning of three asynchronous signals (e.g., encoder A/B/Z, reset/IRQ/wake lines) in single 1.5×1.5 mm footprint |
| IOFF partial power-down | Prevents damaging backflow current when VCC = 0 V while inputs/outputs remain biased at up to 3.6 V - critical for hot-swap and multi-rail sequencing |
| Ultra-low ICC | 0.9 μA max at 25 °C ensures <1 μW static power at 1.8 V - extends battery life in coin-cell-powered wake-up circuits |
| Wide VCC hysteresis stability | VH remains ≥0.07 V even at VCC = 0.8 V, preserving noise immunity in deep-sleep low-voltage operation |
| High ESD robustness | 5000 V HBM / 1000 V CDM rating eliminates need for external TVS diodes in handheld and portable designs |
Applications
| Industrial Sensor Interface | I²C Bus Level Translation |
|---|---|
Use Scenario: Conditioning analog sensor outputs (e.g., thermistor, potentiometer) feeding microcontroller ADC inputs in factory automation panels. IC Role / Device Role / Timing Role: Schmitt-trigger buffer cleans slow, noisy analog-derived digital signals before sampling; eliminates metastability in GPIO-interrupt-driven wake logic. Use Value: Prevents false triggers caused by EMI on 1–10 cm PCB traces; enables reliable 10-bit ADC sampling at <10 kSPS without software debouncing. |
Use Scenario: Bridging 1.8 V microcontroller I²C master to 3.3 V EEPROM or display driver in portable medical devices. IC Role / Device Role / Timing Role: Three buffers isolate SDA, SCL, and interrupt lines; hysteresis suppresses ringing on open-drain bus edges during voltage translation. Use Value: Eliminates bus lockup due to undershoot on 10–30 cm flex cables; supports 400 kHz Fast-mode I²C without external pull-up tuning. |
| Battery-Powered Wake-Up Circuit | Automotive Body Control Module Input |
Use Scenario: Detecting door-open or motion events via reed switch or PIR sensor in smart lock systems powered by CR2032 cells. IC Role / Device Role / Timing Role: Converts slow mechanical switch bounce (<10 ms rise time) into clean, jitter-free logic pulses for ultra-low-power MCU wake-up pins. Use Value: Reduces average wake-up current to <100 nA; extends CR2032 battery life beyond 2 years in intermittent-use applications. |
Use Scenario: Debouncing dashboard button inputs and seatbelt sensor signals in 12 V automotive body control units operating at −40 °C to +125 °C. IC Role / Device Role / Timing Role: Provides ESD-hardened, temperature-stable hysteresis to reject load-dump transients and alternator noise on 5 V logic rails. Use Value: Meets ISO 16750-2 pulse test requirements without additional RC filtering; cuts BOM cost by eliminating discrete debounce components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schmitt trigger buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC3G17DCUR | Wider VCC range (1.65–5.5 V); higher ICC (max 10 μA); no IOFF; VH ≈ 0.35 V at 3.3 V | Lacks partial power-down capability; unsuitable for mixed-rail hot-swap systems | Select when interfacing legacy 5 V peripherals and IOFF is not required |
| 74LVC1G17GW,125 | Single-channel only; same XSON6 (SOT886) package; identical VH and tpd specs; IOFF supported | Requires three separate packages for triple functionality - increases board area and assembly cost | Select only when design requires channel isolation or space permits discrete placement |
Compared with SN74LVC3G17DCUR and 74LVC1G17GW,125, the 74AUP3G17GM,125 uniquely combines triple buffering, sub-1 μA ICC, IOFF, and stable hysteresis below 1 V - making it optimal for space-constrained, battery-sensitive, multi-rail embedded systems where signal integrity and power sequencing coexist.
Availability
74AUP3G17GM,125 is available at Aetrix Electronics and suitable for industrial sensor interfaces, battery-powered wake-up circuits, I²C bus level translation, and automotive body control module inputs requiring stable component supply across extended temperature ranges.
Supply support for 74AUP3G17GM,125 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a leading semiconductor manufacturer specializing in high-performance, energy-efficient logic, analog, and MOSFET solutions for automotive, industrial, and consumer markets.
The 74AUP (Advanced Ultra-low Power) product line targets ultra-low-power signal conditioning in battery-operated and thermally constrained applications, emphasizing sub-μA static current, wide VCC scalability, and robust IOFF behavior.
FAQ
Is the 74AUP3G17GM,125 pin-compatible with other 74AUP3Gxx variants?
Yes - all 74AUP3Gxx devices in XQFN8 (SOT902-2) share identical pinout: pins 1–3 = inputs (1A/2A/3A), pins 5–7 = outputs (1Y/2Y/3Y), pin 4 = GND, pin 8 = VCC, and EPAD = GND. Functional differences (e.g., inverter vs. buffer) do not affect physical compatibility.
What is the minimum recommended load capacitance for stable Schmitt-trigger operation?
No minimum load capacitance is required - the device functions correctly with open-circuit outputs. However, for optimal noise rejection on long traces (>5 cm), a 10–15 pF capacitive load is recommended to dampen ringing without degrading tpd beyond 4.8 ns (CL = 15 pF, VCC = 3.0 V).
Can the 74AUP3G17GM,125 drive standard 50 Ω transmission lines?
No - its output drive strength (±4 mA) is insufficient for direct 50 Ω termination. It is designed for point-to-point CMOS loading (CL ≤ 30 pF). For 50 Ω line driving, pair it with a dedicated line driver such as the NX3L4684 or use series termination with a 33 Ω resistor.
Does the IOFF feature activate automatically during power-down?
Yes - IOFF activates inherently when VCC = 0 V, regardless of input/output voltage states. No external control signal is needed. Outputs enter high-impedance state within 100 ns of VCC crossing 0.2 V, preventing back-current flow even if inputs remain at 3.6 V.
74AUP3G17GM,125 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
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- Packaging:
- Bulk
- Product Status:
- Active
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- Number of Elements:
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- Number of Bits per Element:
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- Input Type:
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- Output Type:
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- Current - Output High, Low:
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74AUP3G17GM,125 FAQ
1.How can I place an order for 74AUP3G17GM,125 through Aetrix?
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6.How does Aetrix verify that 74AUP3G17GM,125 is sourced from the original manufacturer or authorized distributors?
All 74AUP3G17GM,125 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AUP3G17GM,125 meets industry standards.
7.What is the process for return or replacement of 74AUP3G17GM,125?
All 74AUP3G17GM,125 units undergo pre-shipment inspection (PSI). If there is an issue with 74AUP3G17GM,125, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AUP3G17GM,125 part is unused and in its original packaging.
Return procedure for 74AUP3G17GM,125:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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