Texas Instruments 74AVC16245DGGR-P
- Part No.:
- 74AVC16245DGGR-P
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.240", 6.10mm Width)
- Datasheet:
-
74AVC16245DGGR-P.pdf
- Description:
- PROTOTYPE
- Quantity:
- Payment:

- Shipping:

Inventory:2,699
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Product details
Overview
74AVC16245DGGR-P from Texas Instruments is a 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between mixed-voltage buses (1.2 V to 3.6 V). It features Dynamic Output Control (DOC™), Ioff partial-power-down support, and ±24 mA dynamic drive at 2.5 V - enabling low-noise, high-speed communication in FPGA-to-ASIC interconnects and memory expansion subsystems.
For engineers reviewing the 74AVC16245DGGR-P datasheet, 74AVC16245DGGR-P pinout, 74AVC16245DGGR-P application, or 74AVC16245DGGR-P equivalent, this page delivers verified electrical specs, TSSOP-48 terminal mapping, DOC™ noise-reduction behavior, Ioff isolation characteristics, and validated drop-in alternatives for voltage-translating bus interface designs.
Technical Context
The 74AVC16245DGGR-P implements a dual 8-bit transceiver architecture with independent DIR and OE controls per octal section, supporting A→B or B→A data flow under logic-level direction selection. Its EPIC™ submicron CMOS process enables operation from –40°C to 85°C with guaranteed timing across 1.4 V–3.6 V supply range.
Dynamic Output Control (DOC™) circuitry actively modulates output impedance during signal transitions: lowering it initially for fast edge drive (equivalent to ±24 mA standard outputs), then raising it mid-transition to suppress simultaneous switching noise. This occurs without propagation delay penalty - tpd remains ≤1.7 ns at 3 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.2 V to 3.6 V - supports mixed-voltage system interfacing (e.g., 1.8-V FPGA ↔ 3.3-V peripheral) |
| Max Propagation Delay | 1.7 ns at VCC = 3 V - enables >500 MHz data rates in point-to-point bus links |
| Dynamic Drive Strength | ±24 mA at 2.5 V - matches standard-output drive while reducing EMI via DOC™ |
| Ioff Current | ±10 µA max at VI/VO = 3.6 V - prevents backflow during partial power-down of one bus side |
| Input Voltage Tolerance | –0.5 V to VCC + 0.5 V - allows overvoltage-tolerant I/O for robust level-shifting without external clamps |
| ESD Rating | 2000-V HBM, 200-V MM - exceeds JESD22-A114/A115 for production board handling reliability |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded control and communications equipment |
Pinout & Package
TSSOP-48 (DGG) package: 12.6 mm × 6.2 mm × 1.2 mm body, 0.5-mm lead pitch, RoHS-compliant NiPdAu finish, MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input (active-high) | Selects data flow direction per octal section: DIR = L → B→A; DIR = H → A→B |
| 1OE, 2OE | Output enable input (active-low) | Drives associated 8-bit port into high-impedance state when high; tie to VCC via pullup for power-up isolation |
| 1A1–1A8, 2A1–2A8 | Port A input/output terminals | First and second octal A-side I/Os; tolerate voltages up to VCC + 0.5 V regardless of VCC level |
| 1B1–1B8, 2B1–2B8 | Port B input/output terminals | First and second octal B-side I/Os; fully symmetric with A ports for bidirectional use |
| VCC, GND | Power and ground connections | Four VCC and six GND pins distributed for low-inductance decoupling and reduced ground bounce |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Output Control (DOC™) | Dynamically lowers then raises output impedance during transitions - achieves ±24 mA drive without overshoot/ringing |
| Ioff Partial-Power-Down Support | Disables outputs and blocks current backflow when VCC = 0 V - essential for hot-swap and multi-rail power sequencing |
| Mixed-Voltage I/O Tolerance | Inputs/outputs withstand –0.5 V to 4.6 V independent of VCC - eliminates need for external voltage translators |
| Low Capacitance I/O | 3 pF control inputs, 9 pF data ports - minimizes loading on high-speed traces and reduces AC power consumption |
| Widebus™ Architecture | Optimized layout and drive matching across all 16 bits - ensures skew <0.3 ns between channels |
Applications
| Industrial PLC Backplane Interface | FPGA-to-SDRAM Memory Bridge |
|---|---|
Use Scenario: Bidirectional data exchange between 3.3-V CPU module and 1.8-V I/O expansion cards in modular automation controllers. IC Role / Device Role / Timing Role: Voltage-translating bus transceiver managing address/data/control lines with direction arbitration via DIR signals. Use Value: DOC™ reduces simultaneous switching noise on shared backplane traces, improving signal integrity at 100+ MHz clock rates. |
Use Scenario: Interfacing Xilinx Artix-7 FPGA (1.8-V bank) to DDR2 SDRAM (2.5-V interface) in embedded vision processing units. IC Role / Device Role / Timing Role: Asynchronous 16-bit data path buffer with independent OE control per byte lane for burst-mode transfers. Use Value: Ioff protection prevents current leakage when SDRAM power rail is sequenced off before FPGA, avoiding latch-up risk. |
| Automotive ADAS Sensor Hub | Test Equipment Digital Pattern Generator |
Use Scenario: Aggregating LVDS camera streams into MIPI CSI-2 bridge IC using 1.2-V logic domain, while interfacing to 3.3-V CAN/FlexRay diagnostics port. IC Role / Device Role / Timing Role: Mixed-voltage bus isolator enabling safe communication between safety-critical sensor domain and service interface. Use Value: Overvoltage-tolerant I/O withstands load-dump transients up to 4.6 V without clamping diodes or TVS devices. |
Use Scenario: Driving 16-bit parallel stimulus patterns from pattern generator ASIC (2.5-V) to DUT requiring 3.3-V logic levels. IC Role / Device Role / Timing Role: Precision-controlled output driver with matched propagation delay (<1.7 ns) across all bits for deterministic timing alignment. Use Value: Low inter-channel skew (<0.3 ns) ensures setup/hold margin compliance at 200+ MHz test clock frequencies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16245ADGGR | No DOC™ circuit; static ±24 mA drive only; higher simultaneous switching noise | Lacks dynamic impedance control - requires additional PCB-level noise mitigation for >100 MHz operation | Lower-cost option where EMI constraints are relaxed and layout allows added filtering |
| SN74AVCH16245DGGR | Includes bus-hold circuitry on all I/Os; slightly higher ICC (60 µA vs 40 µA) | Eliminates external pullups on unused inputs - simplifies design in sparse-bus or low-pin-count configurations | Preferred when input floating states must be avoided without discrete resistors |
Compared with SN74LVC16245ADGGR and SN74AVCH16245DGGR, the 74AVC16245DGGR-P uniquely balances low-noise performance, mixed-voltage robustness, and industrial temperature range - making it optimal for high-density, high-speed interconnects where signal integrity and power sequencing reliability are critical.
Availability
74AVC16245DGGR-P is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA memory bridges, automotive ADAS sensor hubs, and automated test equipment requiring stable component supply across extended temperature and mixed-voltage operating conditions.
Supply support for 74AVC16245DGGR-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface ICs and industrial-grade reliability.
The AVC logic family - including the 74AVC16245DGGR-P - was engineered specifically for low-voltage, high-speed bidirectional bus interfacing in mixed-supply systems, emphasizing noise suppression, power sequencing safety, and wide operating margins.
FAQ
What is the maximum operating frequency supported by the 74AVC16245DGGR-P?
The 74AVC16245DGGR-P does not specify a maximum clock frequency directly, but its 1.7 ns maximum propagation delay at 3 V VCC supports reliable operation at data rates exceeding 500 MHz in point-to-point configurations. Actual usable frequency depends on trace length, loading, and termination - design validation at target speed is required per application.
Does the 74AVC16245DGGR-P require external pull-up resistors on OE pins?
Yes - to ensure high-impedance state during power-up or power-down, OE pins must be tied to VCC through an external pull-up resistor. The minimum value is determined by the current-sinking capability of the driving source; TI recommends ≥10 kΩ for typical microcontroller GPIO drivers.
Can the 74AVC16245DGGR-P interface a 1.2-V bus with a 3.3-V bus without level shifters?
Yes - the 74AVC16245DGGR-P has overvoltage-tolerant I/Os rated from –0.5 V to VCC + 0.5 V, allowing direct connection between 1.2-V and 3.3-V domains when VCC = 3.3 V. Inputs accept 0–3.3 V logic levels regardless of VCC, and outputs swing rail-to-rail within the VCC domain.
How does the DOC™ circuit in the 74AVC16245DGGR-P reduce noise?
The DOC™ circuit in the 74AVC16245DGGR-P dynamically lowers output impedance at signal transition onset to deliver strong edge drive (±24 mA), then raises impedance mid-transition to limit di/dt and suppress ringing/overshoot. This occurs automatically without external control and maintains tpd ≤1.7 ns.
Is the 74AVC16245DGGR-P pin-compatible with older 74-series transceivers like the 74LS245?
No - the 74AVC16245DGGR-P uses a 48-pin TSSOP (DGG) package with different pinout, voltage range (1.2–3.6 V vs 4.75–5.25 V), and logic thresholds than 74LS245 (20-pin PDIP/SOIC). It is not a drop-in replacement; PCB redesign and level-shifter removal are required for migration.
74AVC16245DGGR-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74AVC
- Package/Case:
- 48-TFSOP (0.240", 6.10mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 12mA, 12mA
- Voltage - Supply:
- 1.4V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TSSOP
74AVC16245DGGR-P FAQ
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For technical support, including 74AVC16245DGGR-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AVC16245DGGR-P requirements.
6.How does Aetrix verify that 74AVC16245DGGR-P is sourced from the original manufacturer or authorized distributors?
All 74AVC16245DGGR-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVC16245DGGR-P meets industry standards.
7.What is the process for return or replacement of 74AVC16245DGGR-P?
All 74AVC16245DGGR-P units undergo pre-shipment inspection (PSI). If there is an issue with 74AVC16245DGGR-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 74AVC16245DGGR-P part is unused and in its original packaging.
Return procedure for 74AVC16245DGGR-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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