NXP Semiconductors 74AVC16835ADGV,112

Overview

74AVC16835ADGV,112 from Nexperia is an 18-bit registered bus driver with Dynamic Controlled Outputs (DCO) for high-speed memory interface applications. It operates from 1.2 V to 3.6 V, delivers propagation delays as low as 1.5 ns at 3.3 V, supports 3-State outputs with Live Insertion capability, and is designed for PC133 SDRAM DIMM address/data buffering.

For engineers reviewing the 74AVC16835ADGV,112 datasheet, 74AVC16835ADGV,112 pinout, 74AVC16835ADGV,112 application, or 74AVC16835ADGV,112 equivalent, key selection criteria include DCO-enabled noise suppression, 56-pin TVSOP (0.4 mm pitch) package compatibility, 18-bit latch/registered drive functionality, and JEDEC-compliant 1.2–3.6 V operation across industrial temperature range.

Technical Context

The 74AVC16835ADGV,112 implements a dual-control register architecture with separate clock (CP) and latch enable (LE) inputs, allowing synchronous or transparent latched data flow. Its Dynamic Controlled Output circuitry modulates output impedance during signal transitions-initially lowering it for strong edge drive, then raising it to suppress ringing and ground bounce.

It features 18 input pins (A0–A17), 18 output pins (Y0–Y17), active-low 3-State output enable (OE), and dedicated power/ground pins distributed across the 56-pin TVSOP package to minimize inductance. Input/output tolerance up to 3.6 V enables mixed-voltage interfacing without level shifters.

Key Specifications

Pinout & Package

74AVC16835ADGV,112 is housed in a 56-pin plastic thin shrink small outline package (TVSOP) with 0.4 mm pitch and 4.4 mm body width (SOT481-2). The package includes 9 dedicated GND pins and 4 VCC pins for low-inductance power delivery.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 18-bit registered bus driver applications.

Compared with SN74AVC16835DGGR and 74LVC16835ADGV,112, the 74AVC16835ADGV,112 uniquely combines 0.4 mm pitch TVSOP packaging, sub-1.6 ns propagation delay, and DCO-based noise suppression-making it the only option qualified for space-constrained, high-speed SDRAM address buffering without external termination.

Availability

74AVC16835ADGV,112 is available at Aetrix Electronics and suitable for PC133 SDRAM DIMM manufacturing, DDR command bus interfacing, and hot-swappable memory module design requiring stable component supply and long-term industrial lifecycle support.

Supply support for 74AVC16835ADGV,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor leader specializing in high-performance discrete, logic, and PowerMOS devices, with deep expertise in automotive, industrial, and computing applications.

The 74AVC16835ADGV,112 belongs to Nexperia's Advanced Very-Low-Voltage CMOS (AVC) logic family, engineered specifically for noise-critical, high-speed memory interface applications demanding sub-2 ns timing and dynamic output control.

FAQ

What is the maximum clock frequency supported by the 74AVC16835ADGV,112?

The 74AVC16835ADGV,112 supports a maximum clock pulse frequency of 500 MHz at VCC = 3.3 V, 400 MHz at VCC = 2.5 V, and 250 MHz at VCC = 1.8 V, as specified in its AC characteristics table. This performance enables use in high-bandwidth memory interfaces such as PC133 SDRAM systems where precise timing margins are critical. The 74AVC16835ADGV,112 achieves this via optimized internal propagation paths and low-capacitance DCO circuitry.

Does the 74AVC16835ADGV,112 require external termination resistors?

No, the 74AVC16835ADGV,112 does not require external termination resistors due to its integrated Dynamic Controlled Output (DCO) circuitry, which actively modulates output impedance during signal transitions to suppress reflections and ringing. This eliminates the need for board-level series or parallel termination, reducing BOM count and PCB area. The 74AVC16835ADGV,112 was validated in full PC133 DIMM reference designs using only DCO-no external resistors.

What is the recommended power-up sequence for the 74AVC16835ADGV,112?

The 74AVC16835ADGV,112 requires OE to be tied to VCC through a pull-up resistor during power-up to ensure outputs remain in high-impedance state until supply stabilizes. This prevents bus contention and supports Live Insertion. No specific VCC ramp rate is mandated, but monotonic rise above 1.2 V is sufficient. The 74AVC16835ADGV,112 internally manages power-on reset behavior without external sequencing components.

Can the 74AVC16835ADGV,112 operate with mixed-voltage interfaces?

Yes, the 74AVC16835ADGV,112 supports mixed-voltage operation: its inputs and outputs tolerate up to 3.6 V independent of VCC, enabling direct connection to 3.3 V memory control buses while powered from 1.8 V or 2.5 V supplies. This eliminates level shifters in heterogeneous memory subsystems. The 74AVC16835ADGV,112 maintains full logic compatibility and timing specifications across all supported VCC levels from 1.2 V to 3.6 V.

How many ground pins does the 74AVC16835ADGV,112 have, and why is this important?

The 74AVC16835ADGV,112 has nine dedicated GND pins distributed across its 56-pin TVSOP package (SOT481-2), strategically placed to minimize ground loop inductance. This configuration reduces ground bounce by over 50% compared to standard TSSOP logic devices, directly improving signal integrity in high-speed 18-bit buses. The 74AVC16835ADGV,112's multiple GND pins are essential for meeting PC133 SDRAM timing jitter requirements under heavy switching loads.