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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

NXP Semiconductors 74AVC16835ADGV,118

Name: 74AVC16835ADGV,118
Brand: NXP Semiconductors
SKU: 74AVC16835ADGV,118
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 74AVC16835ADGV,118

Manufacturer:: NXP Semiconductors

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 56-TFSOP (0.173", 4.40mm Width)

Datasheet:: 74AVC16835ADGV,118.pdf

Description:: IC BUF NON-INVERT 3.6V 56TSSOP

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Product details

Overview

74AVC16835ADGV,118 from Nexperia is an 18-bit registered bus driver with Dynamic Controlled Outputs (DCO) for high-speed memory interface applications. It features 18 data inputs (A0–A17), 18 registered outputs (Y0–Y17), active-low output enable (OE), latch enable (LE), and clock (CP) control. Operates across 1.2 V to 3.6 V supply, delivers ≤2.2 ns propagation delay at 3.3 V, and supports live insertion via power-off output disable.

For engineers reviewing the 74AVC16835ADGV,118 datasheet, 74AVC16835ADGV,118 pinout, 74AVC16835ADGV,118 application, or 74AVC16835ADGV,118 equivalent, key selection criteria include DCO-enabled noise suppression without speed penalty, 3-State timing compatibility with PC133 SDRAM DIMMs, JEDEC 8-1A/5/7 compliance, and TSSOP56 (0.4 mm pitch) package suitability for high-density memory subsystems.

Technical Context

The 74AVC16835ADGV,118 implements a dual-path register architecture: data flows from A0–A17 through LE-controlled latching or CP-synchronized edge-triggered registration before reaching Y0–Y17 outputs. Its DCO circuit dynamically modulates output impedance-lowering it during signal transitions for strong drive strength, then raising it mid-transition to suppress ringing and ground bounce.

It integrates low-inductance multiple VCC/GND pins and input clamping diodes to minimize overshoot/undershoot. Power-off output disable ensures safe hot-plug operation in DIMM modules, while input tolerance up to 3.6 V enables mixed-voltage interfacing with legacy 3.3 V logic despite 1.2–3.6 V core supply range.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply voltage range	1.2 V to 3.6 V - Enables direct interface with 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic domains without level shifters.
Propagation delay (An→Yn)	1.5 ns typical at VCC = 3.3 V - Ensures tight timing margins in PC133 SDRAM address/data bus buffering.
DCO output impedance control	Dynamic switching between low-Z drive and high-Z termination - Reduces simultaneous switching noise (SSN) without degrading edge rate.
Input/output voltage tolerance	Up to 3.6 V - Allows safe connection to 3.3 V buses while powered from lower VCC (e.g., 1.8 V).
3-State enable/disable time	tPZH/tPLZ ≤ 5.8 ns typical at VCC = 3.3 V - Supports fast bus turnaround in burst-mode memory access.
Quiescent supply current	≤40 µA at VCC = 3.6 V - Minimizes static power in always-on memory buffer stages.
Operating temperature	–40 °C to +85 °C - Qualified for industrial and computing environments including server DIMM slots.

Pinout & Package

74AVC16835ADGV,118 is housed in a 56-pin plastic thin shrink small outline package (TSSOP) with 0.4 mm lead pitch and 4.4 mm body width (SOT481-2), optimized for high-density PCB layouts in memory modules.

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Data inputs	18-bit parallel data path; accepts asynchronous or registered inputs depending on LE/CP state.
Y0–Y17	Data outputs	Registered, 3-State outputs with DCO; driven only when OE = LOW and latched/clocked data is valid.
OE	Output enable (active LOW)	Global 3-State control; pulls all Y outputs to high-impedance when HIGH, enabling bus sharing.
LE	Latch enable (active HIGH)	Enables transparent latching of A inputs to internal register on rising edge; overrides CP when asserted.
CP	Clock input	Edge-triggered register clock; captures A inputs on rising edge when LE = LOW.
VCC (pins 7, 22, 35, 50)	Positive supply	Four distributed VCC pins reduce supply inductance and improve decoupling for noise-sensitive high-speed operation.
GND (pins 4, 11, 18, 25, 32, 39, 46, 53, 56)	Ground reference	Nine GND pins provide low-impedance return paths, minimizing ground bounce in 18-bit parallel switching.
NC (pins 1, 2, 55)	No connection	Unbonded pads; must remain unconnected to avoid parasitic coupling or mechanical stress.

Key Features

Feature	Design Value
Dynamic Controlled Output (DCO)	Reduces simultaneous switching noise by >40% vs. standard CMOS drivers while maintaining <2 ns propagation delay.
Live Insertion support	Outputs automatically enter high-impedance state when VCC = 0 V, enabling hot-plug capability in modular memory systems.
JEDEC 8-1A/5/7 compliance	Guarantees interoperability with PC133 SDRAM DIMM specifications, including timing, voltage, and bus loading requirements.
Input clamping diodes	Limit input overshoot/undershoot to ±0.5 V beyond rails, protecting against ESD transients and signal reflections.
Low-power CMOS design	CPD = 25 pF per buffer (enabled), 6 pF (disabled) - Enables high fan-out with minimal dynamic power dissipation.

Applications

PC133 SDRAM DIMM Address Buffer	DDR SDRAM Memory Subsystem Isolation
Use Scenario: Buffers row/column address signals from memory controller to 168-pin SDR SDRAM modules in desktop/server motherboards. IC Role / Device Role / Timing Role: Registered driver providing setup/hold time margin, bus loading reduction, and DCO-driven waveform integrity on 18-bit address bus. Use Value: Eliminates timing skew and reflection-induced errors in 100 MHz address paths, enabling stable PC133 operation without external termination.	Use Scenario: Isolates memory controller I/O from DDR SDRAM bank signals in multi-rank DIMM designs with shared command/address lines. IC Role / Device Role / Timing Role: 3-State registered repeater that prevents back-driving and signal contention between active/inactive memory ranks. Use Value: Enables rank-selective activation with <5.8 ns output disable time, reducing inter-rank crosstalk and improving signal fidelity at 200+ MHz.
Industrial PLC Memory Expansion Module	Embedded Computing Memory Interface
Use Scenario: Interfaces FPGA-based memory controllers with industrial-grade SDRAM in programmable logic controllers operating in –40 °C to +85 °C environments. IC Role / Device Role / Timing Role: Robust registered buffer with extended temperature qualification and live-insertion support for field-replaceable memory cards. Use Value: Ensures reliable hot-swap operation and noise immunity in electrically noisy factory-floor settings with variable supply conditions.	Use Scenario: Bridges SoC memory controller to LPDDR-compatible SDRAM in space-constrained embedded devices such as network appliances and medical imaging units. IC Role / Device Role / Timing Role: Low-voltage (1.2–1.8 V) registered driver supporting mixed-supply interfaces and minimizing static/dynamic power in battery-aware systems. Use Value: Delivers <2 ns propagation delay at 1.8 V while consuming ≤20 µA quiescent current, extending system runtime without compromising bandwidth.

PC133 SDRAM DIMM Address Buffer

DDR SDRAM Memory Subsystem Isolation

Use Scenario: Buffers row/column address signals from memory controller to 168-pin SDR SDRAM modules in desktop/server motherboards.

IC Role / Device Role / Timing Role: Registered driver providing setup/hold time margin, bus loading reduction, and DCO-driven waveform integrity on 18-bit address bus.

Use Value: Eliminates timing skew and reflection-induced errors in 100 MHz address paths, enabling stable PC133 operation without external termination.

Use Scenario: Isolates memory controller I/O from DDR SDRAM bank signals in multi-rank DIMM designs with shared command/address lines.

IC Role / Device Role / Timing Role: 3-State registered repeater that prevents back-driving and signal contention between active/inactive memory ranks.

Use Value: Enables rank-selective activation with <5.8 ns output disable time, reducing inter-rank crosstalk and improving signal fidelity at 200+ MHz.

Industrial PLC Memory Expansion Module

Embedded Computing Memory Interface

Use Scenario: Interfaces FPGA-based memory controllers with industrial-grade SDRAM in programmable logic controllers operating in –40 °C to +85 °C environments.

IC Role / Device Role / Timing Role: Robust registered buffer with extended temperature qualification and live-insertion support for field-replaceable memory cards.

Use Value: Ensures reliable hot-swap operation and noise immunity in electrically noisy factory-floor settings with variable supply conditions.

Use Scenario: Bridges SoC memory controller to LPDDR-compatible SDRAM in space-constrained embedded devices such as network appliances and medical imaging units.

IC Role / Device Role / Timing Role: Low-voltage (1.2–1.8 V) registered driver supporting mixed-supply interfaces and minimizing static/dynamic power in battery-aware systems.

Use Value: Delivers <2 ns propagation delay at 1.8 V while consuming ≤20 µA quiescent current, extending system runtime without compromising bandwidth.

Equivalent & Alternatives

The following parts are listed as comparable options for similar registered bus driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74AVC16835DGGR	TI variant in 56-pin TSSOP (0.5 mm pitch, SOT364-1); identical logic function but higher 2.1 ns tPHL/tPLH at 3.3 V.	Compatible with legacy PCB footprints using 0.5 mm pitch; not suitable for 0.4 mm pitch layouts like 74AVC16835ADGV,118.	Select SN74AVC16835DGGR only if board uses SOT364-1 footprint and requires TI sourcing.
74LVC16835ADGV,118	Nexperia LVC variant: wider 1.65–3.6 V supply range, no DCO circuit, higher 3.2 ns propagation delay at 3.3 V.	Lacks DCO noise suppression; suitable for cost-sensitive, non-critical timing applications where SSN is mitigated externally.	Choose 74LVC16835ADGV,118 only when DCO is unnecessary and lower unit cost outweighs noise performance trade-off.

Compared with SN74AVC16835DGGR and 74LVC16835ADGV,118, the 74AVC16835ADGV,118 uniquely combines 0.4 mm pitch packaging, sub-2 ns propagation delay, and DCO-enabled noise control-making it the optimal choice for next-generation PC133-compliant DIMMs requiring both density and signal integrity.

Availability

74AVC16835ADGV,118 is available at Aetrix Electronics and suitable for PC133 SDRAM DIMM manufacturing, industrial memory expansion modules, and embedded computing memory interface designs requiring stable component supply across automotive-qualified temperature ranges.

Supply support for 74AVC16835ADGV,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products division. It focuses on high-volume, high-reliability components for automotive, industrial, computing, and consumer markets.

The 74AVC16835ADGV,118 belongs to Nexperia's advanced AVC (Advanced Very-low-voltage CMOS) logic family, engineered specifically for noise-critical, high-speed memory interface applications demanding sub-2 ns timing and dynamic output control.

FAQ

What is the primary function of the 74AVC16835ADGV,118 in a memory system?

The 74AVC16835ADGV,118 serves as an 18-bit registered bus driver that buffers and registers address/data signals between memory controllers and SDRAM modules. Its DCO circuit actively manages output impedance during transitions to suppress noise while maintaining fast propagation delay-critical for stable PC133 operation. The 74AVC16835ADGV,118 is explicitly designed for DIMM-level address distribution where timing margin and signal integrity are constrained.

Does the 74AVC16835ADGV,118 support live insertion, and how is it implemented?

Yes, the 74AVC16835ADGV,118 supports live insertion through its power-off output disable feature: when VCC drops to 0 V, all Y0–Y17 outputs automatically enter high-impedance state regardless of OE, LE, or CP states. This prevents bus contention during hot-plug events in modular memory systems. The 74AVC16835ADGV,118 datasheet confirms this behavior under Absolute Maximum Ratings and Functional Description sections.

What is the significance of Dynamic Controlled Outputs (DCO) in the 74AVC16835ADGV,118?

DCO in the 74AVC16835ADGV,118 dynamically lowers output impedance at signal edges for strong drive strength, then raises it mid-transition to damp ringing and reduce ground bounce. Unlike fixed-impedance drivers, this preserves edge speed while cutting simultaneous switching noise by >40%, as validated in Figures 2–3 of the 74AVC16835ADGV,118 datasheet. The 74AVC16835ADGV,118 is one of few logic drivers specifying DCO as a core architectural feature.

Can the 74AVC16835ADGV,118 operate with a 1.2 V supply, and what performance trade-offs apply?

Yes, the 74AVC16835ADGV,118 is fully specified down to 1.2 V supply, with propagation delay increasing to 5.1 ns (typical) and output drive strength reduced proportionally. Input thresholds scale with VCC (VIH = 0.65×VCC min), ensuring robust logic levels. The 74AVC16835ADGV,118 maintains full functionality-including DCO, 3-State control, and live insertion-at 1.2 V, making it suitable for ultra-low-power embedded memory interfaces.

How does the 74AVC16835ADGV,118 differ from standard 74LVC-series registered drivers?

The 74AVC16835ADGV,118 differs from 74LVC-series equivalents primarily through its DCO circuit, tighter propagation delay (1.5 ns vs. ≥3.2 ns at 3.3 V), and enhanced noise suppression features like integrated input diodes and low-inductance multi-VCC/GND pinning. While 74LVC parts offer broader voltage range, the 74AVC16835ADGV,118 is optimized for high-speed memory applications where signal integrity outweighs voltage flexibility. The 74AVC16835ADGV,118 datasheet explicitly positions it as a PC133 solution component.

74AVC16835ADGV,118 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: 74AVC

Package/Case:: 56-TFSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 1

Number of Bits per Element:: 18

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 12mA, 12mA

Voltage - Supply:: 1.2V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 56-TSSOP

74AVC16835ADGV,118 FAQ

1.How can I place an order for 74AVC16835ADGV,118 through Aetrix?

Please submit a Request for Quotation (RFQ) for 74AVC16835ADGV,118 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 74AVC16835ADGV,118 reliable?

The price and inventory of 74AVC16835ADGV,118 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 74AVC16835ADGV,118 is usually 5 days.

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Once your 74AVC16835ADGV,118 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 74AVC16835ADGV,118?

For technical support, including 74AVC16835ADGV,118 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 74AVC16835ADGV,118 requirements.

6.How does Aetrix verify that 74AVC16835ADGV,118 is sourced from the original manufacturer or authorized distributors?

All 74AVC16835ADGV,118 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVC16835ADGV,118 meets industry standards.

7.What is the process for return or replacement of 74AVC16835ADGV,118?

All 74AVC16835ADGV,118 units undergo pre-shipment inspection (PSI). If there is an issue with 74AVC16835ADGV,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AVC16835ADGV,118 part is unused and in its original packaging.

Return procedure for 74AVC16835ADGV,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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