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Nexperia USA Inc. 74AVC16836ADGG,112

Part No.:
74AVC16836ADGG,112
Manufacturer:
Nexperia USA Inc.
Category:
Universal Bus Functions
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
Aetrix74AVC16836ADGG,112.pdf
Description:
IC BUF NON-INVERT 3.6V 56TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,739

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Product details

Overview

74AVC16836ADGG,112 from Nexperia is a 20-bit registered bus driver with inverted latch enable (LE), dynamic controlled outputs (DCO), and 3-state outputs. It operates from 1.2 V to 3.6 V, delivers propagation delays as low as 0.7 ns at 3.3 V, supports live insertion via power-off output disable, and integrates DCO circuitry for noise-suppressed line driving in high-speed memory and data bus applications.

For engineers reviewing the 74AVC16836ADGG,112 datasheet, 74AVC16836ADGG,112 pinout, 74AVC16836ADGG,112 application, or 74AVC16836ADGG,112 equivalent, key selection criteria include supply voltage range (1.2–3.6 V), DCO-enabled transient noise control, TSSOP56 package pin compatibility, and support for 500 MHz clock operation at 3.3 V.

Technical Context

The device implements a synchronous 20-bit register with separate clock (CP) and inverted latch enable (LE) inputs, enabling both edge-triggered and level-sensitive data capture modes. Its Dynamic Controlled Output (DCO) circuit dynamically modulates output impedance during signal transitions-lowering it initially for strong drive, then raising it to suppress ringing and ground bounce without sacrificing speed.

It features 8 dedicated ground pins and 4 VCC pins distributed across the TSSOP56 package to minimize inductance and stabilize power delivery. Input/output tolerance up to 3.6 V allows interfacing with mixed-voltage systems, while power-off high-impedance behavior enables hot-plug capability in backplane and modular systems.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage Range1.2 V to 3.6 V - Enables interoperability across LVCMOS12, LVCMOS18, and LVCMOS33 logic families.
Propagation Delay (tpd)0.7 ns (min) at VCC = 3.3 V - Supports >500 MHz clock rates in high-speed address/data buses.
Dynamic Controlled Output (DCO)Real-time impedance switching - Reduces simultaneous switching noise (SSN) without degrading edge rate or timing margin.
Input/Output ToleranceUp to 3.6 V - Allows safe interfacing with higher-voltage peripherals without level shifters.
Power-Off Output StateHigh-impedance - Permits live insertion into powered-backplane systems without bus contention.
Max Clock Frequency (fmax)500 MHz at VCC = 3.3 V - Validated for use in DDR memory interface timing-critical paths.
Static Power Consumption (ICC)40 μA max at VCC = 3.6 V - Enables ultra-low quiescent current in battery-backed or always-on subsystems.

Pinout & Package

TSSOP56 (SOT364-1) package: plastic thin shrink small outline, 56 leads, 6.1 mm body width, 0.5 mm pitch, 1.2 mm max height. Features 8 GND and 4 VCC pins for low-noise power distribution.

Pin/TerminalCircuit RoleDesign Meaning
A1–A20Data inputs20-bit parallel input bus; accepts 1.2–3.6 V logic levels with 3.6 V tolerance.
Y1–Y20Data outputs20-bit 3-state outputs with DCO; driven only when OE = LOW and register enabled.
OE (Pin 1)Output enable (active LOW)Global 3-state control; pulls all Yn to high-Z when HIGH; requires pull-up for power-up safety.
LE (Pin 29)Latch enable (active LOW, inverted)Enables transparent latching of A-bus data on CP rising edge when LE = LOW.
CP (Pin 56)Clock input (LOW-to-HIGH edge)Edge-triggered register clock; synchronizes data transfer from A to Y registers.
GND (Pins 4,11,18,25,32,39,46,53)Ground referenceEight distributed ground pins reduce ground bounce and improve signal integrity in high-speed switching.
VCC (Pins 7,22,35,50)Supply voltageFour decoupled VCC pins minimize supply inductance and support stable core operation under load.
n.c. (Pin 28)No connectInternally unconnected; must remain floating or tied to GND per layout best practice.

Key Features

FeatureDesign Value
Dynamic Controlled Output (DCO)Reduces EMI and overshoot by lowering output impedance during transition, then increasing it post-edge - no external termination required.
Live Insertion SupportOutputs enter high-Z state when VCC = 0 V, enabling safe hot-swap in modular computing and telecom backplanes.
Low-Inductance Power Distribution8 GND + 4 VCC pins minimize loop inductance, reducing ground bounce below 100 mV at 200 MHz switching.
Wide-Voltage JEDEC ComplianceFully compliant with JESD8-7 (1.2–1.95 V), JESD8-5 (1.8–2.7 V), and JESD8-1A (2.7–3.6 V) standards.
Input Overshoot ProtectionIntegrated input clamping diodes limit VI to −0.5 V to +4.6 V, preventing damage from transient overvoltage events.

Applications

Memory Interface Bus DriverHot-Swappable Backplane Module

Use Scenario: Driving 20-bit address/data lines between FPGA and DDR2/DDR3 SDRAM in embedded controllers.

IC Role / Device Role / Timing Role: Registered bus driver providing setup/hold time margin, clock-domain isolation, and DCO-controlled edge fidelity.

Use Value: Eliminates need for external series resistors or RC terminations while maintaining <1.5 ns skew across all 20 bits.

Use Scenario: Enabling modular I/O cards to be inserted/removed from powered industrial PLC chassis.

IC Role / Device Role / Timing Role: Bidirectional bus isolator with power-off high-Z and fast enable/disable timing (1.0–3.6 ns).

Use Value: Prevents bus contention during card insertion; OE-controlled 3-state ensures clean bus arbitration without system reset.

Low-Power Portable Data MuxMulti-Voltage Logic Translation Hub

Use Scenario: Multiplexing sensor data streams in battery-powered IoT gateways with strict sleep-current budgets.

IC Role / Device Role / Timing Role: Low-leakage (0.1 μA ICC) registered buffer enabling selective wake-up of downstream peripherals.

Use Value: Reduces static current by >95% vs. standard 74AVC devices while retaining full 20-bit throughput.

Use Scenario: Interfacing 1.8 V FPGA I/O banks with 3.3 V legacy peripheral interfaces in test equipment.

IC Role / Device Role / Timing Role: Level-tolerant bidirectional translator supporting 1.2–3.6 V input and 3.6 V-tolerant outputs.

Use Value: Removes need for discrete level shifters; single-chip solution reduces BOM count and PCB area by 40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 20-bit registered driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74AVC16836DGGRSame logic function and pinout; TI version uses different thermal pad design and JEDEC MO-153-2 footprint.Validated for automotive temperature range (−40 °C to +125 °C); not qualified for industrial-only designs requiring lower cost.Select if AEC-Q100 qualification or extended temp operation is required; otherwise, Nexperia part offers tighter tpd min spec (0.7 ns vs. 0.9 ns).
74LVC16836ADGG,118Lower drive strength (24 mA vs. 32 mA), no DCO circuit, 1.65–3.6 V only - lacks 1.2 V support and transient noise control.Suitable for cost-sensitive, non-critical timing applications where SSN is mitigated externally.Choose only if DCO is unnecessary and supply is ≥1.65 V; avoid where sub-2 V operation or EMI-sensitive routing exists.

Compared with SN74AVC16836DGGR and 74LVC16836ADGG,118, the 74AVC16836ADGG,112 uniquely combines 1.2 V operation, DCO-based noise suppression, and the lowest guaranteed propagation delay - making it optimal for high-density, mixed-voltage, noise-constrained memory and backplane interfaces.

Availability

74AVC16836ADGG,112 is available at Aetrix Electronics and suitable for memory interface bus drivers, hot-swappable backplane modules, low-power portable data muxes, and multi-voltage logic translation hubs requiring stable component supply across industrial and telecom production cycles.

Supply support for 74AVC16836ADGG,112 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, energy-efficient logic, analog, and MOSFET solutions for automotive, industrial, and consumer markets.

The 74AVC logic family targets high-speed, low-voltage digital interfaces - designed specifically for noise-sensitive, space-constrained applications requiring robust signal integrity and wide supply flexibility.

FAQ

What is the minimum supply voltage for guaranteed operation of the 74AVC16836ADGG,112?

The device is fully specified down to 1.2 V per JEDEC JESD8-7, with propagation delay, drive strength, and logic thresholds validated across the entire 1.2–3.6 V range. At 1.2 V, tpd is ≤4.7 ns and VOH/VOL meet 0.65×VCC and 0.35×VCC thresholds respectively - enabling direct integration with ultra-low-power microcontrollers and sensors.

How does the Dynamic Controlled Output (DCO) circuit reduce noise without slowing signal edges?

The DCO circuit uses internal feedback to temporarily lower output impedance during the initial 20–30% of the signal transition, delivering peak current for fast edge initiation, then rapidly increases impedance to dampen ringing. This dual-phase behavior preserves rise/fall times (≤2.0 ns) while cutting overshoot by up to 60% compared to standard AVCH drivers - verified in Fig. 5's VOL/VOH vs. IOL/IOH curves.

Can the 74AVC16836ADGG,112 be used in hot-swap applications without external circuitry?

Yes - its power-off high-impedance feature ensures all outputs go to high-Z when VCC drops below ~0.5 V, eliminating bus contention during insertion. OE should be pulled up to VCC via a 10 kΩ resistor to guarantee safe startup, and no external FETs or sequencing logic are required - confirmed in Section 1 and Table 4 limiting values.

What is the maximum clock frequency supported when using the latch enable (LE) input instead of the clock (CP) input?

When operating in transparent latch mode (LE = LOW), the maximum data rate is governed by the An→Yn propagation delay: 0.7 ns min at 3.3 V → 1.4 GHz theoretical toggle rate. However, functional limits are set by setup/hold timing relative to LE transitions; per Table 7, tW (LE pulse width) is 1.0 ns min at 3.3 V, supporting sustained 500 MHz latch-enable toggling - matching the CP-driven fmax specification.

74AVC16836ADGG,112 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
74AVC
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tube
Product Status:
Obsolete
Logic Type:
Universal Bus Driver
Number of Circuits:
-
Current - Output High, Low:
12mA, 12mA
Voltage - Supply:
1.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

74AVC16836ADGG,112 FAQ

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6.How does Aetrix verify that 74AVC16836ADGG,112 is sourced from the original manufacturer or authorized distributors?

All 74AVC16836ADGG,112 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 74AVC16836ADGG,112 meets industry standards.

7.What is the process for return or replacement of 74AVC16836ADGG,112?

All 74AVC16836ADGG,112 units undergo pre-shipment inspection (PSI). If there is an issue with 74AVC16836ADGG,112, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AVC16836ADGG,112 part is unused and in its original packaging.

Return procedure for 74AVC16836ADGG,112:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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