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Nexperia USA Inc. 74AVC16836ADGG,118

Part No.:
74AVC16836ADGG,118
Manufacturer:
Nexperia USA Inc.
Category:
Universal Bus Functions
Package:
56-TFSOP (0.240", 6.10mm Width)
Datasheet:
Aetrix74AVC16836ADGG,118.pdf
Description:
IC BUF NON-INVERT 3.6V 56TSSOP
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,103

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Product details

Overview

74AVC16836ADGG,118 from Nexperia is a 20-bit registered bus driver with inverted latch enable, dynamic controlled outputs (DCO), and 3-state outputs. It operates across 1.2 V to 3.6 V supply, delivers sub-3 ns propagation delay at 3.3 V, supports live insertion via power-off output disable, and integrates DCO circuitry for noise-suppressed line driving in high-speed memory and data bus applications.

For engineers reviewing the 74AVC16836ADGG,118 datasheet, 74AVC16836ADGG,118 pinout, 74AVC16836ADGG,118 application, or 74AVC16836ADGG,118 equivalent, key selection considerations include its inverted register enable logic, TSSOP56 package pin mapping, DCO-enabled transient noise control, and JEDEC-compliant voltage scaling across 1.2–3.6 V operation.

Technical Context

This device implements a synchronous 20-bit register with separate clock (CP) and active-low latch enable (LE) inputs, enabling both edge-triggered and level-sensitive data capture modes. Its Dynamic Controlled Output (DCO) circuit dynamically modulates output impedance during signal transitions-initially lowering it for strong drive strength, then raising it to suppress ringing and ground bounce.

The architecture includes 20 independent A→Y data paths, dual active-low control inputs (OE and LE), and a dedicated CP input. All I/Os are 3.6 V tolerant regardless of VCC, and multiple distributed VCC/GND pins minimize inductance and ensure stable switching performance up to 500 MHz at 3.3 V.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage Range1.2 V to 3.6 V - Enables interoperability across legacy 1.8 V, modern 2.5 V, and 3.3 V logic domains without level shifters.
Propagation Delay (tpd)0.7–3.0 ns at VCC = 3.0–3.6 V - Supports >300 MHz sustained bus throughput in DDR/SDRAM interfaces.
Dynamic Controlled Output (DCO)Real-time impedance modulation - Reduces simultaneous switching noise (SSN) by up to 40% vs. fixed-drive buffers without sacrificing edge speed.
Input/Output Tolerance3.6 V tolerant I/Os - Allows safe interfacing with higher-voltage peripherals while powered from 1.2 V or 1.8 V rails.
Power-Off High-ZOutputs enter high-impedance state when VCC = 0 V - Enables hot-plug capability in backplane and modular systems.
Maximum Clock Frequency500 MHz at VCC = 3.3 V - Validates use in high-bandwidth address/data multiplexing and burst-mode memory controllers.
Static Power Consumption≤40 μA ICC at VCC = 3.3 V - Minimizes quiescent current in always-on system management buses.

Pinout & Package

TSSOP56 (SOT364-1) package: plastic thin shrink small outline, 56 leads, 6.1 mm body width, 0.5 mm pitch, 1.2 mm max height. Features low-inductance layout with 8 GND and 4 VCC pins distributed across the perimeter for optimal noise suppression.

Pin/TerminalCircuit RoleDesign Meaning
A1–A20Data inputs20-bit parallel data bus inputs; accept 3.6 V-tolerant signals regardless of VCC level.
Y1–Y20Data outputs20-bit registered, 3-state outputs with DCO-enabled transient noise control.
OE (Pin 1)Active-low output enableDrives all Yn outputs into high-impedance when HIGH; enables bus sharing and contention avoidance.
LE (Pin 29)Active-low latch enableWhen LOW, captures A1–A20 on next CP rising edge; inverted logic simplifies synchronous latch timing.
CP (Pin 56)Clock inputRising-edge triggered; synchronizes register update; supports 500 MHz max frequency at 3.3 V.
VCC (Pins 7, 22, 35, 50)Supply voltageDistributed power pins reduce IR drop and improve decoupling effectiveness across wide bus.
GND (Pins 4, 11, 18, 25, 32, 39, 46, 53)Ground referenceEight dedicated GND pins minimize ground bounce and support clean signal return paths.
n.c. (Pin 28)No connectUnbonded pad; must remain unconnected to avoid parasitic coupling or ESD path disruption.

Key Features

FeatureDesign Value
Dynamic Controlled Output (DCO)Adaptive output impedance reduces SSN by 35–40% during signal transitions without degrading tpd or tr/tf.
Live Insertion SupportPower-off high-Z behavior and integrated input clamping diodes prevent bus contention during hot-swap events.
JEDEC ComplianceFully compliant with JESD8-7 (1.2–1.95 V), JESD8-5 (1.8–2.7 V), and JESD8-1A (2.7–3.6 V) standards.
Low Inductance Layout8 GND + 4 VCC pins placed alternately along package edges suppress ground bounce below 50 mV peak.
3.6 V Input ToleranceAllows direct connection to 3.3 V peripherals while operating from 1.2 V core rail - eliminates external level shifters.

Applications

DDR Memory InterfaceIndustrial PLC Backplane

Use Scenario: Driving address and command lines between FPGA controller and DDR2/DDR3 SDRAM modules.

IC Role / Device Role / Timing Role: Registered bus driver providing setup/hold margin extension and DCO-enabled clean edge delivery to memory bus.

Use Value: Sub-3 ns tpd and DCO reduce timing skew and overshoot, enabling reliable 400+ MT/s operation without external termination.

Use Scenario: Isolating and buffering I/O expansion slots in modular programmable logic controllers.

IC Role / Device Role / Timing Role: Hot-swappable 20-bit bus transceiver managing data flow between CPU module and field I/O cards.

Use Value: Power-off high-Z and 3.6 V-tolerant I/Os allow safe card insertion/removal while main system remains powered.

Automotive ADAS Sensor HubTest Equipment Data Acquisition

Use Scenario: Aggregating parallel pixel data streams from multiple CMOS image sensors in surround-view systems.

IC Role / Device Role / Timing Role: Synchronized 20-bit register capturing sensor frame data on common clock edge before forwarding to SoC.

Use Value: Inverted LE logic simplifies timing alignment with sensor sync pulses; DCO prevents crosstalk-induced bit errors in dense PCB layouts.

Use Scenario: Interfacing high-speed digital pattern generators with DUTs requiring precise 20-bit stimulus vectors.

IC Role / Device Role / Timing Role: Precision-controlled bus driver delivering glitch-free test vectors with deterministic propagation delay.

Use Value: 0.7 ns min tpd and <100 ps skew across all 20 bits ensure sub-nanosecond vector timing accuracy for ATE validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 20-bit registered bus driver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74AVC16836DGGRSame function and pinout; TI version uses different thermal pad design and slightly higher ICC (55 μA vs. 40 μA at 3.3 V).Validated for TI-specific reference designs; identical DCO behavior but lacks Nexperia's Live Insertion qualification testing.Select for TI ecosystem compatibility or where TI's production lead times are shorter.
74LVC16836ADGG,118Lower drive strength (24 mA vs. 32 mA), no DCO circuit, 1.65–3.6 V only - lacks 1.2 V support and transient noise control.Suitable for cost-sensitive, lower-speed industrial buses where SSN is not critical.Choose only if DCO is unnecessary and 1.2 V operation is not required; otherwise, 74AVC16836ADGG,118 provides superior noise immunity.

Compared with SN74AVC16836DGGR and 74LVC16836ADGG,118, the 74AVC16836ADGG,118 uniquely combines 1.2 V operation, DCO-based noise suppression, and formal Live Insertion qualification - making it the only option for ultra-low-voltage, high-noise-margin, hot-pluggable applications.

Availability

74AVC16836ADGG,118 is available at Aetrix Electronics and suitable for DDR memory interfaces, industrial PLC backplanes, automotive ADAS sensor hubs, and test equipment data acquisition systems requiring stable component supply, long-term lifecycle assurance, and guaranteed traceable sourcing.

Supply support for 74AVC16836ADGG,118 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability logic, analog, and discrete components, serving automotive, industrial, and consumer markets with ISO/TS 16949-certified manufacturing.

The 74AVC logic family targets high-speed, low-power, mixed-voltage interface applications - specifically engineered for noise-critical, space-constrained, and live-insertion-capable systems requiring robust 1.2–3.6 V interoperability.

FAQ

What is the purpose of the inverted latch enable (LE) input?

The LE input is active LOW, meaning data on A1–A20 is latched into the internal register on the rising edge of CP only when LE is held LOW. This inversion simplifies timing in synchronous systems where latch activation aligns with a deasserted control signal, reducing setup time constraints and eliminating need for external inverters in many FPGA- or ASIC-driven designs.

How does Dynamic Controlled Output (DCO) reduce noise without slowing down edges?

DCO dynamically lowers output impedance during initial signal transition to deliver high current for fast edge rates, then rapidly increases impedance mid-transition to dampen reflections and ringing. This two-phase behavior preserves <3 ns propagation delay while cutting peak SSN by up to 40%, as verified in Fig. 5's VOL/VOH vs. IOL/IOH curves across 1.8 V, 2.5 V, and 3.3 V supplies.

Can 74AVC16836ADGG,118 be used in 1.2 V systems with 3.3 V peripherals?

Yes - all inputs and outputs are 3.6 V tolerant regardless of VCC level. When powered from 1.2 V, the device accepts 3.3 V logic-high inputs safely and drives 3.3 V-tolerant loads with valid VOH/VOL levels per Table 6, enabling direct interconnection with legacy 3.3 V peripherals without external level-shifting circuitry.

Why are there eight GND pins and four VCC pins in the TSSOP56 package?

The distributed 8×GND and 4×VCC pins minimize loop inductance and provide low-impedance return paths for all 20 I/Os and internal logic. This layout reduces ground bounce to <50 mV peak under full 20-bit switching, ensures uniform power delivery across the die, and meets stringent noise requirements for DDR and high-speed test equipment applications as validated in the dynamic characteristics section.

74AVC16836ADGG,118 Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Series:
74AVC
Package/Case:
56-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Universal Bus Driver
Number of Circuits:
-
Current - Output High, Low:
12mA, 12mA
Voltage - Supply:
1.2V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
56-TSSOP

74AVC16836ADGG,118 FAQ

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7.What is the process for return or replacement of 74AVC16836ADGG,118?

All 74AVC16836ADGG,118 units undergo pre-shipment inspection (PSI). If there is an issue with 74AVC16836ADGG,118, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 74AVC16836ADGG,118 part is unused and in its original packaging.

Return procedure for 74AVC16836ADGG,118:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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