NXP Semiconductors 74AVC16T245BQ,518

Overview

74AVC16T245BQ,518 from NXP Semiconductors is a 16-bit dual-supply bidirectional voltage-translating transceiver with 3-state outputs, supporting independent VCC(A) and VCC(B) supplies from 0.8 V to 3.6 V. It enables level translation between mismatched logic domains (e.g., 1.2 V ↔ 3.3 V), features IOFF circuitry for partial power-down protection, and operates across −40 °C to +125 °C in HXQFN60U package.

For engineers reviewing the 74AVC16T245BQ,518 datasheet, 74AVC16T245BQ,518 pinout, 74AVC16T245BQ,518 application, or 74AVC16T245BQ,518 equivalent, this page delivers verified electrical parameters, directional control behavior, suspend-mode operation, ESD robustness (HBM >8 kV), and real-world timing performance across voltage combinations - critical for low-voltage I/O bridging in FPGA-to-ASIC, memory interface, and mixed-voltage SoC interconnect designs.

Technical Context

The 74AVC16T245BQ,518 implements two independent 8-bit bidirectional data paths (Port A and Port B), each controlled by dedicated nDIR (direction) and nOE (output enable) inputs referenced to their respective supply rails (VCC(A) and VCC(B)). Its IOFF circuitry actively disables outputs when either supply drops to GND, preventing backflow current during partial power-down sequences.

Propagation delay is asymmetric: nAn→nBn path is faster under high-VCC(B) conditions (e.g., 2.7 ns at 3.3 V → 3.3 V), while nBn→nAn exhibits higher latency due to internal input-referencing architecture. Timing is fully characterized across −40 °C to +125 °C and all supported voltage pairs, with disable/enable times tightly bounded (e.g., tdis ≤ 12.8 ns max at 125 °C).

Key Specifications

Pinout & Package

74AVC16T245BQ,518 uses the HXQFN60U package (SOT1134-1): 4 × 6 × 0.5 mm thermal-enhanced quad flat no-lead, 60 terminals, UTLP-based, with exposed thermal pad (non-functional, die-attach only).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional voltage translation applications.

Compared with SN74AVC16T245RGYR, the 74AVC16T245BQ,518 offers superior thermal performance and smaller footprint for high-density layouts; versus TXB0108PWR, it provides deterministic direction control, higher drive capability, and true dual-supply flexibility - making it the sole fit for demanding 16-bit synchronous interconnects.

Availability

74AVC16T245BQ,518 is available at Aetrix Electronics and suitable for industrial automation, automotive ADAS modules, and high-reliability computing systems requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for 74AVC16T245BQ,518 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in mixed-signal and power-efficient logic design.

The 74AVC16T245BQ,518 belongs to NXP's AVC (Advanced Very-low-voltage CMOS) family - engineered specifically for ultra-low-voltage bidirectional translation in next-generation energy-efficient systems where rail-to-rail compatibility and power-aware operation are mandatory.

FAQ

What is the maximum allowable voltage difference between VCC(A) and VCC(B) for reliable operation of the 74AVC16T245BQ,518?

The 74AVC16T245BQ,518 supports any combination within its 0.8 V–3.6 V range per rail - including 0.8 V on VCC(A) and 3.6 V on VCC(B). The absolute maximum differential is 2.8 V, but operation is guaranteed across the full spec range as long as each supply stays within its limits and IOFF is functional. No derating is required for voltage mismatch.

Does the 74AVC16T245BQ,518 require external pull-up or pull-down resistors on nDIR or nOE inputs?

No. The 74AVC16T245BQ,518 has internally biased nDIR and nOE inputs referenced to VCC(A), with VIH/VIL thresholds defined as percentages of VCC(A) (e.g., VIH = 0.65×VCC(A) at 1.1–1.95 V). External resistors are unnecessary unless system-level noise immunity requires stronger static biasing beyond the device's native 1 μA leakage spec.

Can the 74AVC16T245BQ,518 be used to translate between 0.8 V and 1.2 V logic while maintaining 200 Mbit/s data rate?

Yes. The 74AVC16T245BQ,518 is explicitly rated for 200 Mbit/s at ≥1.1 V ↔ 1.2 V translation per datasheet Table 2. At 0.8 V ↔ 1.2 V, timing margins reduce but remain functional - measured tpd is 6.2 ns (nAn→nBn) at VCC(A)=0.8 V/VCC(B)=1.2 V, supporting ~160 Mbit/s with standard 15 pF loading and 10%–90% rise time compliance.

How does the suspend mode of the 74AVC16T245BQ,518 behave when VCC(A) = 0 V and VCC(B) = 3.3 V?

In this condition, the 74AVC16T245BQ,518 enters suspend mode: both Port A and Port B outputs go high-impedance (Z), regardless of nDIR or nOE states. Input leakage on Port A is limited to ±5 μA (max), and Port B maintains full 3.3 V I/O tolerance. This prevents back-driving the 3.3 V domain and satisfies JEDEC JESD78 latch-up immunity requirements.

Is the thermal pad on the HXQFN60U package of the 74AVC16T245BQ,518 electrically connected or usable as a ground terminal?

No. Per datasheet Figure 5 footnote (1), the exposed thermal pad on the 74AVC16T245BQ,518's HXQFN60U package is attached to the die substrate using conductive die-attach material and is not electrically connected to any internal node. It must not be soldered to ground or any supply - doing so risks shorting internal circuitry. Thermal relief relies solely on PCB copper area beneath the pad.