Diodes Incorporated 74AVC1T45FX4-7

Overview

74AVC1T45FX4-7 from Diodes Incorporated is a single-bit dual-supply translating transceiver with 3-state outputs, designed for bidirectional voltage-level translation between 1.2 V and 3.6 V domains. It features independent VCCA and VCCB supplies, direction-controlled data flow (DIR referenced to VCCA), and I_OFF protection enabling partial power-down isolation up to 3.6 V. It is used in mobile SoC interconnects where logic domains operate at mismatched voltages-e.g., 1.8 V processor core interfacing with 3.3 V peripheral I/O.

For engineers reviewing the 74AVC1T45FX4-7 datasheet, 74AVC1T45FX4-7 pinout, 74AVC1T45FX4-7 application, or 74AVC1T45FX4-7 equivalent, key selection criteria include dual-rail supply flexibility (1.2–3.6 V each), ±12 mA drive at 3.3 V, 100 mV typical input hysteresis for noise immunity, I_OFF behavior at 0 V supply, and compatibility with X2-DFN1409-6 footprint for space-constrained portable designs.

Technical Context

This device implements a direction-controlled, bidirectional bus transceiver with separate A-side (VCCA-referenced) and B-side (VCCB-referenced) I/O rails. The DIR input-referenced to VCCA-determines signal flow: high enables A→B transmission, low enables B→A. Tri-state output control is intrinsic and activated automatically when either VCCA or VCCB drops to 0 V.

The I_OFF circuitry ensures high-impedance isolation across both A and B pins when either supply is off, blocking backflow currents and supporting hot-insertion scenarios. Input tolerance extends to 4.6 V regardless of supply voltage, and hysteresis (100 mV typ.) enhances robustness against slow or noisy edges on DIR and data lines.

Key Specifications

Pinout & Package

X2-DFN1409-6 is a 0.9 mm × 1.0 mm, 0.4 mm pitch, 6-pin leadless package with bottom-side thermal pad. It supports high-density routing and offers θ_JA = 450 °C/W (FR-4, 2 oz Cu), suitable for thermally constrained mobile PCBs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply translating transceiver applications.

Compared with SN74AVC1T45DBVR and 74LVC1T45GW,125, the 74AVC1T45FX4-7 uniquely combines 1.2 V compatibility, chip-scale X2-DFN1409-6 packaging, and guaranteed I_OFF behavior at 0 V-making it optimal for miniaturized, battery-powered systems requiring lowest possible voltage operation and smallest footprint.

Availability

74AVC1T45FX4-7 is available at Aetrix Electronics and suitable for mobile SoC interconnects, wearable sensor hubs, industrial IoT edge nodes, and peripheral interface isolation requiring stable component supply across high-mix, low-to-medium volume production.

Supply support for 74AVC1T45FX4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for consumer, computing, communications, industrial, and automotive markets.

The 74AVC logic family targets low-voltage, high-speed digital interface applications-designed specifically for voltage translation and signal integrity preservation in power-sensitive, space-constrained portable electronics.

FAQ

Can 74AVC1T45FX4-7 translate between 1.2 V and 3.3 V simultaneously?

Yes. VCCA may be set to 1.2 V (for A-side logic) and VCCB to 3.3 V (for B-side logic), with DIR referenced to VCCA. The device guarantees correct logic thresholds, ±12 mA drive on the 3.3 V side, and 4.6 V input tolerance on both A and B pins-enabling robust bidirectional translation without external components.

What happens to A and B pins when VCCA = 0 V and VCCB = 3.3 V?

Both A and B pins enter high-impedance (3-state) mode with I_OFF active. Leakage is limited to ±0.1 μA per pin, and neither pin sources nor sinks current-even if 3.3 V is applied to A. This prevents back-driving the powered-down 1.2 V domain and protects downstream circuitry.

Is the X2-DFN1409-6 package compatible with standard reflow profiles?

Yes. The package is rated for JEDEC J-STD-020 moisture sensitivity level 1 (unlimited floor life) and withstands peak reflow temperatures up to 260 °C. Its thermal pad design supports efficient heat dissipation during standard Pb-free reflow, with recommended pad layout available from Diodes Incorporated's package outline documentation.

Does DIR require a pull-up or pull-down resistor?

No. DIR has CMOS-compatible input structure with defined VIH and VIL thresholds scaling with VCCA. However, per datasheet Note 8, unused DIR must be tied to VCCA or GND-not left floating-to prevent undefined transceiver state and excessive ICC. A 10 kΩ pull-up to VCCA is typical for default A→B direction.