Diodes Incorporated 74AVC1T45FZ4-7

Overview

74AVC1T45FZ4-7 from Diodes Incorporated is a single-bit dual-supply translating transceiver with 3-state outputs, designed for bidirectional voltage-level translation between 1.2 V and 3.6 V domains. It features independent VCCA and VCCB supplies, direction-controlled data flow via DIR pin referenced to VCCA, and I_OFF protection enabling partial power-down isolation up to 3.6 V. It is used in mobile SoC interconnects where logic domains operate at mismatched voltages (e.g., 1.8 V processor ↔ 3.3 V peripheral).

For engineers reviewing the 74AVC1T45FZ4-7 datasheet, 74AVC1T45FZ4-7 pinout, 74AVC1T45FZ4-7 application, or 74AVC1T45FZ4-7 equivalent, key selection considerations include bidirectional translation range (1.2–3.6 V), ±12 mA drive at 3.3 V, 3-state timing (tpHZ ≤ 4.3 ns at 3.3 V), I_OFF leakage < ±0.1 μA at 0 V supply, and X2-DFN1410-6 package thermal resistance (θ_JA = 430 °C/W).

Technical Context

The device implements a dual-rail CMOS transceiver architecture with separate input/output voltage references: A-side I/O tracks VCCA, B-side tracks VCCB, and DIR is referenced to VCCA. Direction control is synchronous-asserting DIR high makes A an input and B an output; asserting low reverses roles.

I_OFF functionality activates when either VCCA or VCCB drops to 0 V, forcing all outputs into high-impedance while blocking backflow currents up to ±3.6 V on A/B pins. Input hysteresis (100 mV typical) enhances noise immunity in noisy mixed-voltage environments.

Key Specifications

Pinout & Package

X2-DFN1410-6 is a 0.9 mm × 1.0 mm, 0.4 mm pitch, 6-terminal leadless chip-scale package with wettable flanks, optimized for space-constrained mobile PCBs and compatible with standard reflow profiles.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar single-bit dual-supply translating transceiver applications.

Compared with SN74AVC1T45DBVR and FXMA108MUTAG, the 74AVC1T45FZ4-7 uniquely balances ultra-small footprint (0.9 mm × 1.0 mm), full 1.2–3.6 V dual-rail support, and guaranteed I_OFF behavior-making it optimal for space- and power-constrained portable electronics where single-bit bridging dominates.

Availability

74AVC1T45FZ4-7 is available at Aetrix Electronics and suitable for mobile SoC interconnects, wearable sensor hubs, low-power peripheral bridging, and industrial IoT edge nodes requiring stable component supply across long production lifecycles.

Supply support for 74AVC1T45FZ4-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal ICs for power management, signal integrity, and connectivity applications.

The 74AVC1T45 belongs to Diodes' AVC logic family, engineered specifically for ultra-low-voltage, high-speed bidirectional translation in battery-powered portable electronics and compact embedded systems.

FAQ

Can 74AVC1T45FZ4-7 translate between 1.2 V and 5 V logic?

No. While its inputs tolerate up to 4.6 V regardless of supply voltage, the device requires both VCCA and VCCB to be within 1.2 V to 3.6 V. Driving a 5 V domain would exceed VCCB's absolute maximum rating (−0.5 V to +4.6 V), risking permanent damage. For 5 V interfaces, use a dedicated 5 V-tolerant translator like the TXS0102.

What happens to the A and B pins when DIR is floating?

DIR must never be left floating-it is referenced to VCCA and lacks internal pull-up/down. An uncontrolled DIR state causes undefined direction behavior: A and B may both enter high-impedance or exhibit metastability, leading to bus contention or data corruption. Always tie DIR to VCCA (for A→B) or GND (for B→A) via a 10 kΩ resistor if not actively driven.

Does the 74AVC1T45FZ4-7 support hot insertion?

Yes, under defined conditions. Its I_OFF feature activates when either VCCA or VCCB is at 0 V, holding A and B in high-impedance with leakage < ±0.1 μA and blocking up to ±3.6 V. This prevents backdrive current during live card insertion-provided VCCA/VCCB ramp rates comply with recommended slew limits (≤5 ns/V) per datasheet Section 7.

How does thermal performance compare between X2-DFN1410-6 and SOT363 packages?

X2-DFN1410-6 has θ_JA = 430 °C/W versus SOT363's 371 °C/W under identical FR-4 test conditions. Though SOT363 offers slightly better junction-to-ambient dissipation, X2-DFN1410-6's lower θ_JC (190 °C/W vs. 143 °C/W) enables superior heat transfer to PCB copper when using thermal vias-making it more effective in thermally constrained mobile designs despite higher θ_JA.