Nexperia USA Inc. 74AVC1T45GM,132

Overview

74AVC1T45GM,132 from Nexperia is a single-bit dual-supply voltage level translator/transceiver with 3-state output, enabling bidirectional logic-level translation between mismatched I/O domains (e.g., 1.2 V ↔ 3.3 V). It features independent VCC(A) and VCC(B) supplies (0.8 V to 3.6 V), DIR-controlled directionality, IOFF partial power-down protection, and operates across –40 °C to +125 °C.

For engineers reviewing the 74AVC1T45GM,132 datasheet, 74AVC1T45GM,132 pinout, 74AVC1T45GM,132 application, or 74AVC1T45GM,132 equivalent, key selection criteria include dual-rail voltage flexibility, sub-10 ns propagation delay at 1.8 V/3.3 V, IOFF-enabled suspend mode, low dynamic power dissipation (≤17 pF CPD), and XSON6 (SOT886) package compatibility with high-density PCB layouts.

Technical Context

The device implements a bidirectional, direction-controlled transceiver architecture where DIR referenced to VCC(A) selects data flow: HIGH enables A→B, LOW enables B→A. Both ports support independent supply rails, with input thresholds dynamically scaled to their respective VCC.

IOFF circuitry actively disables outputs when either VCC(A) or VCC(B) = GND, preventing backflow current and ensuring high-impedance OFF-state for both A and B ports during partial power-down-critical for system-level suspend/resume sequencing in mixed-voltage SoC interfaces.

Key Specifications

Pinout & Package

XSON6 plastic extremely thin small outline package (SOT886); no leads; 6 terminals; body dimensions 1.0 mm × 1.45 mm × 0.5 mm; thermal pad optional; pin 1 indicator located on lower-left corner below marking code "B5".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-supply voltage translation applications.

Compared with TXS0101DCUR and SN74AVC1T45DBVR, the 74AVC1T45GM,132 delivers superior board-area efficiency via its 1.0 × 1.45 mm XSON6 package, guaranteed IOFF behavior for robust power sequencing, and tighter propagation delay consistency across voltage combinations-making it optimal for miniaturized, thermally constrained, and automotive-qualified designs.

Availability

74AVC1T45GM,132 is available at Aetrix Electronics and suitable for industrial sensor interface, automotive body control, wearable health monitoring, and 5G small cell baseband applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q200-aligned reliability.

Supply support for 74AVC1T45GM,132 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential semiconductors, delivering high-performance, reliable components for automotive, industrial, mobile, and computing markets.

The 74AVC1T45GM,132 belongs to Nexperia's AVC logic family, engineered specifically for low-voltage bidirectional level translation in space- and power-constrained systems where mixed-voltage interoperability and robust power sequencing are mandatory.

FAQ

Can 74AVC1T45GM,132 translate between 0.8 V and 2.5 V simultaneously?

Yes. VCC(A) can be set to 0.8 V while VCC(B) is set to 2.5 V, enabling bidirectional translation. The device guarantees correct logic thresholds and output drive strength across this combination, with tpd ≤ 8.4 ns (A→B) and ≤ 12.0 ns (B→A) at 25 °C per datasheet Table 9.

Does DIR need to be driven before applying data signals?

Yes. DIR must be stable prior to data transitions to prevent bus contention. The enable time (ten) from DIR change to valid output is calculated as tdis + tpd (e.g., 27.2 ns max for DIR→A at 0.8 V/3.3 V), so timing margins must account for this delay in system-level protocol design.

What happens if VCC(A) = 0 V and VCC(B) = 3.3 V?

The device enters suspend mode: both A and B ports go to high-impedance (Z), and IOFF limits leakage to ±1 μA max. This prevents backfeed from the 3.3 V domain into the unpowered 0.8 V subsystem, satisfying IEC 61000-4-2 system-level ESD robustness requirements.

Is the XSON6 (SOT886) package compatible with standard reflow profiles?

Yes. The SOT886 package is qualified for IPC/JEDEC J-STD-020D moisture sensitivity level 1 and supports peak reflow temperatures up to 260 °C. Its 0.5 mm profile and exposed thermal pad (optional) allow compatibility with standard lead-free reflow processes used in high-volume manufacturing.